CH431731A - Halbleiteranordnung für grosse Stromstärken und Verfahren zu ihrer Herstellung - Google Patents

Halbleiteranordnung für grosse Stromstärken und Verfahren zu ihrer Herstellung

Info

Publication number
CH431731A
CH431731A CH539865A CH539865A CH431731A CH 431731 A CH431731 A CH 431731A CH 539865 A CH539865 A CH 539865A CH 539865 A CH539865 A CH 539865A CH 431731 A CH431731 A CH 431731A
Authority
CH
Switzerland
Prior art keywords
manufacture
high currents
semiconductor arrangement
semiconductor
arrangement
Prior art date
Application number
CH539865A
Other languages
German (de)
English (en)
Inventor
Eric Andersson Nils
Svensson Robert
Lilja Goran
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Publication of CH431731A publication Critical patent/CH431731A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
CH539865A 1964-04-20 1965-04-17 Halbleiteranordnung für grosse Stromstärken und Verfahren zu ihrer Herstellung CH431731A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE481564 1964-04-20

Publications (1)

Publication Number Publication Date
CH431731A true CH431731A (de) 1967-03-15

Family

ID=20265035

Family Applications (1)

Application Number Title Priority Date Filing Date
CH539865A CH431731A (de) 1964-04-20 1965-04-17 Halbleiteranordnung für grosse Stromstärken und Verfahren zu ihrer Herstellung

Country Status (7)

Country Link
BE (1) BE662743A (enrdf_load_stackoverflow)
CH (1) CH431731A (enrdf_load_stackoverflow)
FI (1) FI41178C (enrdf_load_stackoverflow)
FR (1) FR1430747A (enrdf_load_stackoverflow)
GB (1) GB1099874A (enrdf_load_stackoverflow)
NL (1) NL6504892A (enrdf_load_stackoverflow)
NO (1) NO118754B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
US3489957A (en) * 1967-09-07 1970-01-13 Power Semiconductors Inc Semiconductor device in a sealed package
DE2049012C3 (de) * 1970-09-30 1979-07-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
FR2496987A1 (fr) * 1980-12-24 1982-06-25 Jeumont Schneider Electrodes pour pastille semi-conductrice de puissance
KR970000281B1 (ko) * 1991-12-30 1997-01-08 엘지전자 주식회사 마그네트론의 냉각핀

Also Published As

Publication number Publication date
FR1430747A (fr) 1966-03-04
NO118754B (enrdf_load_stackoverflow) 1970-02-09
NL6504892A (enrdf_load_stackoverflow) 1965-10-21
GB1099874A (en) 1968-01-17
BE662743A (enrdf_load_stackoverflow) 1965-08-17
FI41178C (fi) 1969-09-10
FI41178B (enrdf_load_stackoverflow) 1969-06-02

Similar Documents

Publication Publication Date Title
DE1695853B2 (de) 4-azadibenzocycloheptenderivate und verfahren zu ihrer herstellung
AT261711B (de) Mikroverbindung für mikrominiaturisierte Schaltungselemente und Verfahren zu ihrer Herstellung
CH442453A (de) Thermoelektrische Einrichtung und Verfahren zu ihrer Herstellung
CH457368A (de) Kapseln und Verfahren zu ihrer Herstellung
CH395348A (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
CH443862A (de) Hülle und Verfahren zu ihrer Herstellung
CH448642A (de) Rohrverbindung und Verfahren zu ihrer Herstellung
CH498627A (de) Salbengrundlage und Verfahren zu deren Herstellung
CH517359A (de) Halbleiterelement und Verfahren zu dessen Herstellung
CH489868A (de) Reflektor und Verfahren zu seiner Herstellung
AT243168B (de) Verpackung und Verfahren zu ihrer Herstellung
CH486915A (de) Elektrode und Verfahren zu ihrer Herstellung
AT242477B (de) Räumliches Tragwerk und Verfahren zu seiner Herstellung
CH403989A (de) Halbleiterdiode und Verfahren zu ihrer Herstellung
CH460099A (de) Depolarisatormischung und Verfahren zu ihrer Herstellung
AT275045B (de) Haarwaschmittel und Verfahren zu seiner Herstellung
AT266293B (de) Elastisches Multifilamentgarn und Verfahren zu dessen Herstellung
CH432606A (de) Druckfeste randdichte Einfassung für poröse Scheiben und Verfahren zu ihrer Herstellung
CH474156A (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
CH433580A (de) Bauschgarn und Verfahren zu seiner Herstellung
CH477267A (de) Raspel und Verfahren zu ihrer Herstellung
CH422990A (de) Elektrische Wicklung und Verfahren zu deren Herstellung
CH454733A (de) Verpackung und Verfahren zu ihrer Herstellung
CH431731A (de) Halbleiteranordnung für grosse Stromstärken und Verfahren zu ihrer Herstellung
CH489597A (de) Waschmittelzusammensetzung und Verfahren zu ihrer Herstellung