CH528818A - Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes - Google Patents
Vorrichtung zum Einspannen eines scheibenförmigen HalbleiterbauelementesInfo
- Publication number
- CH528818A CH528818A CH1308771A CH1308771A CH528818A CH 528818 A CH528818 A CH 528818A CH 1308771 A CH1308771 A CH 1308771A CH 1308771 A CH1308771 A CH 1308771A CH 528818 A CH528818 A CH 528818A
- Authority
- CH
- Switzerland
- Prior art keywords
- clamping
- disk
- semiconductor component
- shaped semiconductor
- shaped
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01059—Praseodymium [Pr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2049012A DE2049012C3 (de) | 1970-09-30 | 1970-09-30 | Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH528818A true CH528818A (de) | 1972-09-30 |
Family
ID=5784322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1308771A CH528818A (de) | 1970-09-30 | 1971-09-07 | Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH528818A (enrdf_load_stackoverflow) |
| DE (1) | DE2049012C3 (enrdf_load_stackoverflow) |
| FR (1) | FR2108123B1 (enrdf_load_stackoverflow) |
| SE (1) | SE376687B (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2224040C3 (de) * | 1970-09-30 | 1981-07-30 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes |
| CS180334B1 (en) * | 1975-11-28 | 1977-12-30 | Jiri Kovar | Power semiconducting disc elements suppressing and jigging equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO118754B (enrdf_load_stackoverflow) * | 1964-04-20 | 1970-02-09 | Asea Ab | |
| SE339716B (enrdf_load_stackoverflow) * | 1968-04-23 | 1971-10-18 | Asea Ab |
-
1970
- 1970-09-30 DE DE2049012A patent/DE2049012C3/de not_active Expired
-
1971
- 1971-09-07 CH CH1308771A patent/CH528818A/de not_active IP Right Cessation
- 1971-09-23 SE SE7112069A patent/SE376687B/xx unknown
- 1971-09-30 FR FR7135312A patent/FR2108123B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2049012C3 (de) | 1979-07-12 |
| FR2108123B1 (enrdf_load_stackoverflow) | 1977-08-05 |
| SE376687B (enrdf_load_stackoverflow) | 1975-06-02 |
| FR2108123A1 (enrdf_load_stackoverflow) | 1972-05-12 |
| DE2049012B2 (de) | 1978-11-09 |
| DE2049012A1 (de) | 1972-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |