CH528818A - Device for clamping a disk-shaped semiconductor component - Google Patents

Device for clamping a disk-shaped semiconductor component

Info

Publication number
CH528818A
CH528818A CH1308771A CH1308771A CH528818A CH 528818 A CH528818 A CH 528818A CH 1308771 A CH1308771 A CH 1308771A CH 1308771 A CH1308771 A CH 1308771A CH 528818 A CH528818 A CH 528818A
Authority
CH
Switzerland
Prior art keywords
clamping
disk
semiconductor component
shaped semiconductor
shaped
Prior art date
Application number
CH1308771A
Other languages
German (de)
Inventor
Nitsche Oswald
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of CH528818A publication Critical patent/CH528818A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01059—Praseodymium [Pr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CH1308771A 1970-09-30 1971-09-07 Device for clamping a disk-shaped semiconductor component CH528818A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2049012A DE2049012C3 (en) 1970-09-30 1970-09-30 Device for clamping a disk-shaped semiconductor component

Publications (1)

Publication Number Publication Date
CH528818A true CH528818A (en) 1972-09-30

Family

ID=5784322

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1308771A CH528818A (en) 1970-09-30 1971-09-07 Device for clamping a disk-shaped semiconductor component

Country Status (4)

Country Link
CH (1) CH528818A (en)
DE (1) DE2049012C3 (en)
FR (1) FR2108123B1 (en)
SE (1) SE376687B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2224040C3 (en) * 1970-09-30 1981-07-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Device for clamping a disk-shaped semiconductor component
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO118754B (en) * 1964-04-20 1970-02-09 Asea Ab
SE339716B (en) * 1968-04-23 1971-10-18 Asea Ab

Also Published As

Publication number Publication date
FR2108123A1 (en) 1972-05-12
DE2049012B2 (en) 1978-11-09
FR2108123B1 (en) 1977-08-05
DE2049012C3 (en) 1979-07-12
DE2049012A1 (en) 1972-04-06
SE376687B (en) 1975-06-02

Similar Documents

Publication Publication Date Title
CH543932A (en) Device for gradually advancing a workpiece
AT306376B (en) Device for treating a flowable substance
CH524429A (en) Device for adjustable support of a workpiece
CH527092A (en) Method and device for vacuum packaging
CH524091A (en) Device for shutting off a work medium
DE2320660A1 (en) DEVICE FOR DE-ACIDIZING LIQUIDS
CH510491A (en) Device for clamping a workpiece
AT314921B (en) Device for connecting pipes
CH525742A (en) Clamping device for clamping workpieces
AT295409B (en) Device for holding an open sack
CH555715A (en) CLAMPING DEVICE FOR CLAMPING WORKPIECES.
AT314314B (en) Clamping device for clamping workpieces
CH537258A (en) Device for positioning a tool
CH543352A (en) Device for holding and mechanically operating a tool
AT330619B (en) DEVICE FOR CUTTING A WORKPIECE
DE2167006A1 (en) DEVICE FOR ALIGNING A SIGN
AT308569B (en) Device for lifting a component
CH528818A (en) Device for clamping a disk-shaped semiconductor component
CH527021A (en) Device for clamping workpieces
AT316967B (en) Device for joining workpieces
CH511095A (en) Clamping device for holding at least two workpieces
CH530845A (en) Device for lapping two gears
CH488127A (en) Device for sealing
AT259328B (en) Device for clamping an indexable insert
AT344952B (en) DEVICE FOR LIFTING A RECTANGULAR CEILING COMPONENT

Legal Events

Date Code Title Description
PL Patent ceased