CH498490A - Method for manufacturing a semiconductor component - Google Patents

Method for manufacturing a semiconductor component

Info

Publication number
CH498490A
CH498490A CH1252769A CH1252769A CH498490A CH 498490 A CH498490 A CH 498490A CH 1252769 A CH1252769 A CH 1252769A CH 1252769 A CH1252769 A CH 1252769A CH 498490 A CH498490 A CH 498490A
Authority
CH
Switzerland
Prior art keywords
manufacturing
semiconductor component
semiconductor
component
Prior art date
Application number
CH1252769A
Other languages
German (de)
Inventor
Kurt Dr Raithel
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH498490A publication Critical patent/CH498490A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Silicon Compounds (AREA)
  • Thyristors (AREA)
CH1252769A 1968-10-17 1969-08-19 Method for manufacturing a semiconductor component CH498490A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681803489 DE1803489A1 (en) 1968-10-17 1968-10-17 Method for manufacturing a semiconductor component

Publications (1)

Publication Number Publication Date
CH498490A true CH498490A (en) 1970-10-31

Family

ID=5710695

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1252769A CH498490A (en) 1968-10-17 1969-08-19 Method for manufacturing a semiconductor component

Country Status (7)

Country Link
US (1) US3665594A (en)
JP (1) JPS4839866B1 (en)
CH (1) CH498490A (en)
DE (1) DE1803489A1 (en)
FR (1) FR2020901B1 (en)
GB (1) GB1225088A (en)
SE (1) SE341950B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3886583A (en) * 1971-07-01 1975-05-27 Motorola Inc Insulated gate-field-effect transistor
FR2159632A5 (en) * 1971-11-05 1973-06-22 Thomson Csf
JPS532189U (en) * 1976-06-23 1978-01-10
JPS5322669U (en) * 1976-08-05 1978-02-25
JPS5946415B2 (en) * 1978-04-28 1984-11-12 株式会社日立製作所 Manufacturing method of semiconductor device
US4293587A (en) * 1978-11-09 1981-10-06 Zilog, Inc. Low resistance backside preparation for semiconductor integrated circuit chips
US4278195A (en) * 1978-12-01 1981-07-14 Honeywell Inc. Method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel and apparatus using such _a bonding technique
NL8004139A (en) * 1980-07-18 1982-02-16 Philips Nv SEMICONDUCTOR DEVICE.
IT1210953B (en) * 1982-11-19 1989-09-29 Ates Componenti Elettron METHOD FOR WELDING SEMICONDUCTOR PLATES ON NON-NOBLE METAL SUPPORTS.
GB2227700B (en) * 1989-02-01 1992-12-02 Marconi Electronic Devices Methods of joining components
US5178319A (en) * 1991-04-02 1993-01-12 At&T Bell Laboratories Compression bonding methods
CA2210063A1 (en) * 1997-07-08 1999-01-08 Ibm Canada Limited-Ibm Canada Limitee Method of manufacturing wire segments of homogeneous composition
KR100499722B1 (en) * 2000-02-29 2005-07-07 오므론 가부시키가이샤 Chip-type semiconductor device
SE520148C3 (en) * 2000-11-24 2003-07-16 Sandvik Ab Method for increasing the life of molybdenum disilicide type heaters in heat treatment of electronic ceramics

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices
FR1258010A (en) * 1959-06-30 1961-04-07 Fairchild Semiconductor Transistor manufacturing process
US3196330A (en) * 1960-06-10 1965-07-20 Gen Electric Semiconductor devices and methods of making same
NL275554A (en) * 1961-04-19 1900-01-01
US3330030A (en) * 1961-09-29 1967-07-11 Texas Instruments Inc Method of making semiconductor devices
FR1396813A (en) * 1963-05-29 1965-04-23 Siemens Ag Method of manufacturing a semiconductor electrical device
US3375143A (en) * 1964-09-29 1968-03-26 Melpar Inc Method of making tunnel diode
US3382568A (en) * 1965-07-22 1968-05-14 Ibm Method for providing electrical connections to semiconductor devices
US3461462A (en) * 1965-12-02 1969-08-12 United Aircraft Corp Method for bonding silicon semiconductor devices
US3537174A (en) * 1968-10-07 1970-11-03 Gen Electric Process for forming tungsten barrier electrical connection

Also Published As

Publication number Publication date
FR2020901B1 (en) 1974-02-22
DE1803489A1 (en) 1970-05-27
JPS4839866B1 (en) 1973-11-27
GB1225088A (en) 1971-03-17
US3665594A (en) 1972-05-30
SE341950B (en) 1972-01-17
FR2020901A1 (en) 1970-07-17

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Legal Events

Date Code Title Description
PL Patent ceased