JPS5322669U - - Google Patents

Info

Publication number
JPS5322669U
JPS5322669U JP1976105304U JP10530476U JPS5322669U JP S5322669 U JPS5322669 U JP S5322669U JP 1976105304 U JP1976105304 U JP 1976105304U JP 10530476 U JP10530476 U JP 10530476U JP S5322669 U JPS5322669 U JP S5322669U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976105304U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976105304U priority Critical patent/JPS5322669U/ja
Publication of JPS5322669U publication Critical patent/JPS5322669U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1976105304U 1976-08-05 1976-08-05 Pending JPS5322669U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976105304U JPS5322669U (en) 1976-08-05 1976-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976105304U JPS5322669U (en) 1976-08-05 1976-08-05

Publications (1)

Publication Number Publication Date
JPS5322669U true JPS5322669U (en) 1978-02-25

Family

ID=28715463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976105304U Pending JPS5322669U (en) 1976-08-05 1976-08-05

Country Status (1)

Country Link
JP (1) JPS5322669U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11955466B2 (en) 2020-08-25 2024-04-09 Nichia Corporation Light emitting device
US12002909B2 (en) 2020-08-25 2024-06-04 Nichia Corporation Surface-mounted multi-colored light emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839866B1 (en) * 1968-10-17 1973-11-27
JPS4952989A (en) * 1972-09-22 1974-05-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839866B1 (en) * 1968-10-17 1973-11-27
JPS4952989A (en) * 1972-09-22 1974-05-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11955466B2 (en) 2020-08-25 2024-04-09 Nichia Corporation Light emitting device
US12002909B2 (en) 2020-08-25 2024-06-04 Nichia Corporation Surface-mounted multi-colored light emitting device

Similar Documents

Publication Publication Date Title
FR2340820B1 (en)
FR2354573B1 (en)
FR2366156B1 (en)
FR2340796B1 (en)
JPS5643335Y2 (en)
JPS5650481Y2 (en)
JPS5540071Y2 (en)
JPS5380479U (en)
JPS5364076U (en)
JPS5351943U (en)
JPS542812Y2 (en)
JPS5360469U (en)
JPS52159523U (en)
JPS52166948U (en)
JPS5296785U (en)
JPS5352207U (en)
JPS52102240U (en)
CS173369B1 (en)
DD124550A1 (en)
BG26161A1 (en)
DD124771A1 (en)
DD124637A1 (en)
DD124633A1 (en)
DD124623A5 (en)
DD124856A1 (en)