DE19982793T1 - Gestapelte Elektronikvorrichtung mit einer Filmelektrode zum Unterbrechen eines unnormalen Stromes - Google Patents

Gestapelte Elektronikvorrichtung mit einer Filmelektrode zum Unterbrechen eines unnormalen Stromes

Info

Publication number
DE19982793T1
DE19982793T1 DE19982793T DE19982793T DE19982793T1 DE 19982793 T1 DE19982793 T1 DE 19982793T1 DE 19982793 T DE19982793 T DE 19982793T DE 19982793 T DE19982793 T DE 19982793T DE 19982793 T1 DE19982793 T1 DE 19982793T1
Authority
DE
Germany
Prior art keywords
interrupting
electronic device
film electrode
abnormal current
stacked electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19982793T
Other languages
English (en)
Inventor
Yukio Nishimiya
Syuji Aisawa
Shinji Ito
Masayuki Kurano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
NEC Tokin Hyogo Ltd
Original Assignee
Tokin Corp
Tokin Ceramics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp, Tokin Ceramics Corp filed Critical Tokin Corp
Publication of DE19982793T1 publication Critical patent/DE19982793T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/14—Protection against electric or thermal overload
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE19982793T 1998-12-03 1999-12-03 Gestapelte Elektronikvorrichtung mit einer Filmelektrode zum Unterbrechen eines unnormalen Stromes Withdrawn DE19982793T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP34433798 1998-12-03
JP34539998 1998-12-04
JP17108699 1999-06-17
PCT/JP1999/006805 WO2000033334A1 (en) 1998-12-03 1999-12-03 Stacked-type electronic device having film electrode for breaking abnormal current

Publications (1)

Publication Number Publication Date
DE19982793T1 true DE19982793T1 (de) 2001-03-22

Family

ID=27323427

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19982793T Withdrawn DE19982793T1 (de) 1998-12-03 1999-12-03 Gestapelte Elektronikvorrichtung mit einer Filmelektrode zum Unterbrechen eines unnormalen Stromes

Country Status (6)

Country Link
US (1) US6577486B1 (de)
JP (1) JP2002531939A (de)
CN (1) CN1289443A (de)
DE (1) DE19982793T1 (de)
TW (1) TW457501B (de)
WO (1) WO2000033334A1 (de)

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US6411012B2 (en) * 1999-12-08 2002-06-25 Tdk Corporation Multilayer piezoelectric element and method of producing the same
JP3794292B2 (ja) * 2001-07-03 2006-07-05 株式会社村田製作所 圧電型電気音響変換器およびその製造方法
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
JP3861809B2 (ja) * 2002-12-27 2006-12-27 株式会社村田製作所 圧電振動板およびこの圧電振動板を用いた圧電型電気音響変換器
US7180718B2 (en) * 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
JP4097268B2 (ja) * 2004-02-26 2008-06-11 Ｔｄｋ株式会社 積層コンデンサ
WO2006131096A1 (de) * 2005-06-09 2006-12-14 Epcos Ag Piezoelektrisches bauelement mit isolationsabsicherung
US7932471B2 (en) * 2005-08-05 2011-04-26 Ngk Spark Plug Co., Ltd. Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
US7164573B1 (en) * 2005-08-31 2007-01-16 Kemet Electronic Corporation High ESR or fused ceramic chip capacitor
US8717777B2 (en) * 2005-11-17 2014-05-06 Avx Corporation Electrolytic capacitor with a thin film fuse
DE102007004874A1 (de) * 2006-10-02 2008-04-03 Robert Bosch Gmbh Piezoaktor, bestehend aus übereinander gestapelten, elektrisch kontaktierten Piezoelementen
US7532457B2 (en) * 2007-01-15 2009-05-12 Avx Corporation Fused electrolytic capacitor assembly
US8154376B2 (en) * 2007-09-17 2012-04-10 Littelfuse, Inc. Fuses with slotted fuse bodies
JP4687757B2 (ja) * 2008-07-22 2011-05-25 株式会社村田製作所 積層セラミック電子部品の製造方法
JP5880648B2 (ja) * 2010-09-06 2016-03-09 株式会社村田製作所 電子部品
JP5810706B2 (ja) * 2010-09-06 2015-11-11 株式会社村田製作所 電子部品
JP2012059911A (ja) * 2010-09-09 2012-03-22 Murata Mfg Co Ltd 積層セラミックコンデンサ
CN103460315B (zh) * 2011-03-28 2016-12-14 株式会社村田制作所 电子部件
JP5810956B2 (ja) * 2012-02-13 2015-11-11 株式会社村田製作所 積層セラミックコンデンサの製造方法及び積層セラミックコンデンサ
JP6263849B2 (ja) * 2013-03-25 2018-01-24 株式会社村田製作所 積層セラミックコンデンサ
KR102057909B1 (ko) * 2013-06-14 2019-12-20 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
KR101489816B1 (ko) * 2013-07-22 2015-02-04 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
KR102076151B1 (ko) * 2013-08-26 2020-02-11 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
US9877393B2 (en) * 2013-12-24 2018-01-23 Kyocera Corporation Laminated electronic component and laminated electronic component mounting structure
JP6160572B2 (ja) * 2014-07-24 2017-07-12 株式会社村田製作所 コンデンサ素子およびその製造方法
JP6672786B2 (ja) * 2015-12-25 2020-03-25 株式会社村田製作所 積層セラミック電子部品
KR102467337B1 (ko) * 2020-05-22 2022-11-14 최항 금속필러가 포함된 유리페이스트를 이용한 단락저항기제조와 단락신뢰성

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2136206B (en) * 1983-03-02 1986-10-08 Standard Telephones Cables Ltd Fused ceramic capacitor
US4680670A (en) * 1986-09-29 1987-07-14 Avx Corporation Fail safe ceramic capacitor
JPS63305506A (ja) 1987-06-06 1988-12-13 Murata Mfg Co Ltd 積層形コンデンサ
JPH0267707A (ja) * 1988-09-01 1990-03-07 Nec Corp 積層セラミックコンデンサおよびその製造方法
JPH0831393B2 (ja) 1989-05-29 1996-03-27 株式会社村田製作所 ヒューズ付積層セラミックコンデンサ
JPH08148029A (ja) * 1994-11-24 1996-06-07 Murata Mfg Co Ltd 導電性ペースト及び該導電性ペーストを用いて形成された電子部品の外部電極
JPH08180731A (ja) * 1994-12-26 1996-07-12 Murata Mfg Co Ltd 導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
JPH11329073A (ja) * 1998-05-19 1999-11-30 Murata Mfg Co Ltd 導電ペースト及びそれを用いたセラミック電子部品

Also Published As

Publication number Publication date
US6577486B1 (en) 2003-06-10
JP2002531939A (ja) 2002-09-24
CN1289443A (zh) 2001-03-28
TW457501B (en) 2001-10-01
WO2000033334A1 (en) 2000-06-08

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: NEC TOKIN CERAMICS CORP., HYOGO, JP

Owner name: NEC TOKIN CORP., SENDAI, MIYAGI, JP

8139 Disposal/non-payment of the annual fee