DE19982405T1 - Tomographische Rekonstruktion elektronischer Komponenten aus Schattenbild-Sensordaten - Google Patents

Tomographische Rekonstruktion elektronischer Komponenten aus Schattenbild-Sensordaten

Info

Publication number
DE19982405T1
DE19982405T1 DE19982405T DE19982405T DE19982405T1 DE 19982405 T1 DE19982405 T1 DE 19982405T1 DE 19982405 T DE19982405 T DE 19982405T DE 19982405 T DE19982405 T DE 19982405T DE 19982405 T1 DE19982405 T1 DE 19982405T1
Authority
DE
Germany
Prior art keywords
electronic components
sensor data
tomographic reconstruction
silhouette
silhouette sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19982405T
Other languages
English (en)
Inventor
Eric P Rudd
Steven Case
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Publication of DE19982405T1 publication Critical patent/DE19982405T1/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/12—Edge-based segmentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
DE19982405T 1998-11-03 1999-11-03 Tomographische Rekonstruktion elektronischer Komponenten aus Schattenbild-Sensordaten Ceased DE19982405T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10686098P 1998-11-03 1998-11-03
PCT/US1999/025900 WO2000026611A1 (en) 1998-11-03 1999-11-03 Tomographic reconstruction of electronic components from shadow image sensor data

Publications (1)

Publication Number Publication Date
DE19982405T1 true DE19982405T1 (de) 2001-04-26

Family

ID=22313650

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19982405T Ceased DE19982405T1 (de) 1998-11-03 1999-11-03 Tomographische Rekonstruktion elektronischer Komponenten aus Schattenbild-Sensordaten

Country Status (6)

Country Link
US (2) US6490048B1 (de)
JP (1) JP4620870B2 (de)
KR (1) KR100619098B1 (de)
DE (1) DE19982405T1 (de)
GB (1) GB2347499A (de)
WO (1) WO2000026611A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535291B1 (en) * 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
US7813559B2 (en) * 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US20040072385A1 (en) * 2002-10-15 2004-04-15 Bauer Donald G. Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices
US7206449B2 (en) * 2003-03-19 2007-04-17 Mitsubishi Electric Research Laboratories, Inc. Detecting silhouette edges in images
US7738725B2 (en) * 2003-03-19 2010-06-15 Mitsubishi Electric Research Laboratories, Inc. Stylized rendering using a multi-flash camera
US7295720B2 (en) * 2003-03-19 2007-11-13 Mitsubishi Electric Research Laboratories Non-photorealistic camera
US7218792B2 (en) * 2003-03-19 2007-05-15 Mitsubishi Electric Research Laboratories, Inc. Stylized imaging using variable controlled illumination
JP2005101263A (ja) * 2003-09-25 2005-04-14 Juki Corp 電子部品実装装置
US7706595B2 (en) 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
JP4833588B2 (ja) * 2005-06-03 2011-12-07 株式会社ミツトヨ 画像測定システム並びに非停止画像測定プログラムの作成方法及び実行方法
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
JP4896136B2 (ja) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
US20070130755A1 (en) * 2005-10-31 2007-06-14 Duquette David W Electronics assembly machine with embedded solder paste inspection
NL1033000C2 (nl) * 2006-03-30 2007-08-21 Assembleon Nv Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.
US7609907B2 (en) * 2006-06-07 2009-10-27 Analytical Graphics Inc. Visualization of field of view constraints
US8155475B2 (en) * 2007-03-12 2012-04-10 Varian Medical Systems, Inc. Method and apparatus to facilitate transforming grayscale level values
US7746481B2 (en) 2007-03-20 2010-06-29 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
US8068664B2 (en) * 2007-06-05 2011-11-29 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
US20100295935A1 (en) * 2009-05-06 2010-11-25 Case Steven K On-head component alignment using multiple area array image detectors
US9886790B2 (en) 2013-03-14 2018-02-06 Robert Bosch Gmbh System and method of shadow effect generation for concave objects with dynamic lighting in three-dimensional graphics
EP3241186B1 (de) * 2014-12-31 2021-11-17 Robert Bosch GmbH System und verfahren zur schatteneffekterzeugung für konkave objekte mit dynamischer beleuchtung in dreidimensionalen grafiken
US10517199B2 (en) 2015-12-17 2019-12-24 Assembléon B.V. Methods of positioning a component in a desired position on a board, pick and place machines, and sensors for such pick and place machines
US10620608B2 (en) 2017-03-07 2020-04-14 Raytheon Company Collet contrast disk
AU2018346758B2 (en) * 2017-10-06 2022-11-03 Visie Inc. Generation of one or more edges of luminosity to form three-dimensional models of objects
TWI650733B (zh) * 2017-12-01 2019-02-11 台達電子工業股份有限公司 電子元件組裝系統和方法
US11338441B2 (en) 2017-12-01 2022-05-24 Delta Electronics, Inc. Calibration system for robot tool and calibration method for the same
KR102641460B1 (ko) * 2021-12-30 2024-02-27 금오공과대학교 산학협력단 그림자 투영법을 이용한 3d 프린팅의 지지체 예측방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3781115A (en) 1972-02-14 1973-12-25 Monitor Systems Corp Method and apparatus for non-contact surface measurement
US4559452A (en) 1982-06-02 1985-12-17 Fujitsu Limited Apparatus for detecting edge of semitransparent plane substance
US4628464A (en) * 1983-10-07 1986-12-09 Westinghouse Electric Corp. Robotic system for mounting electrical components
DE3474750D1 (en) 1983-11-05 1988-11-24 Zevatech Ag Method and device positioning elements on a work piece
GB2183820A (en) 1985-11-09 1987-06-10 Dynapert Precima Ltd Electronic component placement
JPS63249018A (ja) 1987-04-06 1988-10-17 Hitachi Ltd 電子部品検出方法
US5235407A (en) * 1990-08-27 1993-08-10 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices
JPH04122248A (ja) * 1990-09-13 1992-04-22 Res Dev Corp Of Japan 光断層像画像化装置
US5278634A (en) 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
DE4222804A1 (de) * 1991-07-10 1993-04-01 Raytheon Co Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten
JPH0618215A (ja) * 1992-07-01 1994-01-25 Yamaha Motor Co Ltd 部品装着方法及び装置
JP2554437B2 (ja) 1992-08-07 1996-11-13 ヤマハ発動機株式会社 部品装着方法及び同装置
JP2816787B2 (ja) 1992-11-09 1998-10-27 ヤマハ発動機株式会社 実装機の吸着ノズル制御装置
JP2746810B2 (ja) * 1993-02-25 1998-05-06 ジューキ株式会社 吸着ノズルに吸着された部品の傾き及び位置測定方法
US5619528A (en) 1993-04-16 1997-04-08 Trans Video Electronics High speed teleconference system
US5559727A (en) 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
JP3842287B2 (ja) * 1994-08-11 2006-11-08 サイバーオプティックス・コーポレーション 高精度半導体部品位置合せシステム
US5900940A (en) * 1995-11-28 1999-05-04 Yamaha Hatsudoki Kabushiki Kaisha Position detector for chip mounter
JP3266524B2 (ja) * 1996-03-11 2002-03-18 ヤマハ発動機株式会社 チップ部品の位置検出方法及び同装置
JP3704157B2 (ja) * 1996-02-19 2005-10-05 アセンブレオン ネムローゼ フェンノートシャップ 電子部品検出用散乱前景照明を具える装置、及びそのような検出装置を設けられた部品取り付け機械
JPH09229638A (ja) * 1996-02-26 1997-09-05 Daido Steel Co Ltd 断面矩形材の厚み，傾き角測定方法および測定装置
JP3760274B2 (ja) 1997-07-18 2006-03-29 山形カシオ株式会社 電子部品の装着方法及び装置
JPH1140991A (ja) 1997-07-18 1999-02-12 Yamagata Casio Co Ltd 部品装着方法及び装置
JPH1144508A (ja) * 1997-07-24 1999-02-16 Genichi Tagata 部品装着方法および装置
JP3784935B2 (ja) 1997-08-12 2006-06-14 山形カシオ株式会社 電子部品の装着方法及び装置
JP3784934B2 (ja) 1997-08-12 2006-06-14 山形カシオ株式会社 電子部品の装着方法及び装置
JP3957839B2 (ja) * 1997-10-22 2007-08-15 協立電機株式会社 チップ部品の非接触位置決め方法及びその装置
US6100922A (en) * 1998-06-23 2000-08-08 Juki Corporation Apparatus for recognizing an electronic component
DE19840628B4 (de) * 1998-09-05 2005-10-27 Walter Maschinenbau Gmbh Meßverfahren und -vorrichtung
JP4428794B2 (ja) 1999-12-08 2010-03-10 富士機械製造株式会社 電気部品位置検出方法および電気回路組立方法

Also Published As

Publication number Publication date
WO2000026611A1 (en) 2000-05-11
US20020140948A1 (en) 2002-10-03
US6583884B2 (en) 2003-06-24
GB2347499A (en) 2000-09-06
KR20010033850A (ko) 2001-04-25
US6490048B1 (en) 2002-12-03
JP4620870B2 (ja) 2011-01-26
JP2002529685A (ja) 2002-09-10
KR100619098B1 (ko) 2006-09-04
GB0014169D0 (en) 2000-08-02

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Legal Events

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8110 Request for examination paragraph 44
8131 Rejection