DE19723052A1 - Signalverteilungsstruktur mit einem verlustbehafteten Isolator - Google Patents

Signalverteilungsstruktur mit einem verlustbehafteten Isolator

Info

Publication number
DE19723052A1
DE19723052A1 DE19723052A DE19723052A DE19723052A1 DE 19723052 A1 DE19723052 A1 DE 19723052A1 DE 19723052 A DE19723052 A DE 19723052A DE 19723052 A DE19723052 A DE 19723052A DE 19723052 A1 DE19723052 A1 DE 19723052A1
Authority
DE
Germany
Prior art keywords
insulating layer
inner conductor
layer
conductive
signal distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19723052A
Other languages
German (de)
English (en)
Inventor
Ron Barnett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE19723052A1 publication Critical patent/DE19723052A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguide Connection Structure (AREA)
DE19723052A 1996-07-31 1997-06-02 Signalverteilungsstruktur mit einem verlustbehafteten Isolator Withdrawn DE19723052A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/690,118 US5756932A (en) 1996-07-31 1996-07-31 Signal distribution structure having lossy insulator

Publications (1)

Publication Number Publication Date
DE19723052A1 true DE19723052A1 (de) 1998-02-05

Family

ID=24771176

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19723052A Withdrawn DE19723052A1 (de) 1996-07-31 1997-06-02 Signalverteilungsstruktur mit einem verlustbehafteten Isolator

Country Status (4)

Country Link
US (1) US5756932A (enExample)
JP (1) JPH1098301A (enExample)
DE (1) DE19723052A1 (enExample)
GB (1) GB2315916A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031274A (ja) 1998-07-14 2000-01-28 Matsushita Electric Ind Co Ltd 半導体装置
KR100308871B1 (ko) * 1998-12-28 2001-11-03 윤덕용 동축 구조의 신호선 및 그의 제조 방법
GB2382725A (en) * 2002-02-25 2003-06-04 Bookham Technology Plc Transmission line structure
US7288723B2 (en) * 2003-04-02 2007-10-30 Sun Microsystems, Inc. Circuit board including isolated signal transmission channels
US7205860B2 (en) * 2003-12-09 2007-04-17 Advanced Magnetic Solutions Limited Electromagnetic interface module for balanced data communication
JP2006019567A (ja) * 2004-07-02 2006-01-19 Seiko Epson Corp シールド線

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL94742C (enExample) * 1951-05-31
JPS5636163Y2 (enExample) * 1976-08-19 1981-08-26
BE886846Q (fr) * 1977-11-29 1981-04-16 Mayer Ferdy Fil ou cable antiparasite pour haute frequence
FR2437686A1 (fr) * 1978-09-29 1980-04-25 Mayer Ferdy Element electrique a pertes, tel que fil, cable et ecran, resistant et absorbant
JPS56158502A (en) * 1980-05-12 1981-12-07 Junkosha Co Ltd Strip line
US4796079A (en) * 1984-07-25 1989-01-03 Rca Licensing Corporation Chip component providing rf suppression
FR2640819B1 (fr) * 1988-12-20 1991-05-31 Thomson Csf Cable semi-rigide destine a la transmission des ondes hyperfrequence
JPH02214202A (ja) * 1989-02-14 1990-08-27 Junkosha Co Ltd ストリップラインケーブル
GB2284095B (en) * 1990-04-05 1995-09-20 Gen Electric Microwave component having tailored operating characteristics and method of tailoring
CA2116995C (en) * 1993-03-05 1999-01-12 Kazunori Yamate Three-terminal capacitor and assembly
US5594397A (en) * 1994-09-02 1997-01-14 Tdk Corporation Electronic filtering part using a material with microwave absorbing properties

Also Published As

Publication number Publication date
JPH1098301A (ja) 1998-04-14
GB9713350D0 (en) 1997-08-27
US5756932A (en) 1998-05-26
GB2315916A (en) 1998-02-11

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8130 Withdrawal
8165 Publication of following application cancelled