GB2315916A - Signal distribution structure having a lossy insulator - Google Patents

Signal distribution structure having a lossy insulator Download PDF

Info

Publication number
GB2315916A
GB2315916A GB9713350A GB9713350A GB2315916A GB 2315916 A GB2315916 A GB 2315916A GB 9713350 A GB9713350 A GB 9713350A GB 9713350 A GB9713350 A GB 9713350A GB 2315916 A GB2315916 A GB 2315916A
Authority
GB
United Kingdom
Prior art keywords
insulating layer
layer
inner conductor
signal distribution
distribution structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9713350A
Other languages
English (en)
Other versions
GB9713350D0 (en
Inventor
Ron Barnett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of GB9713350D0 publication Critical patent/GB9713350D0/en
Publication of GB2315916A publication Critical patent/GB2315916A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguide Connection Structure (AREA)
GB9713350A 1996-07-31 1997-06-24 Signal distribution structure having a lossy insulator Withdrawn GB2315916A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/690,118 US5756932A (en) 1996-07-31 1996-07-31 Signal distribution structure having lossy insulator

Publications (2)

Publication Number Publication Date
GB9713350D0 GB9713350D0 (en) 1997-08-27
GB2315916A true GB2315916A (en) 1998-02-11

Family

ID=24771176

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9713350A Withdrawn GB2315916A (en) 1996-07-31 1997-06-24 Signal distribution structure having a lossy insulator

Country Status (4)

Country Link
US (1) US5756932A (enExample)
JP (1) JPH1098301A (enExample)
DE (1) DE19723052A1 (enExample)
GB (1) GB2315916A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2382725A (en) * 2002-02-25 2003-06-04 Bookham Technology Plc Transmission line structure

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031274A (ja) 1998-07-14 2000-01-28 Matsushita Electric Ind Co Ltd 半導体装置
KR100308871B1 (ko) * 1998-12-28 2001-11-03 윤덕용 동축 구조의 신호선 및 그의 제조 방법
US7288723B2 (en) * 2003-04-02 2007-10-30 Sun Microsystems, Inc. Circuit board including isolated signal transmission channels
US7205860B2 (en) * 2003-12-09 2007-04-17 Advanced Magnetic Solutions Limited Electromagnetic interface module for balanced data communication
JP2006019567A (ja) * 2004-07-02 2006-01-19 Seiko Epson Corp シールド線

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2012097A (en) * 1977-11-29 1979-07-18 Mayer F Cable having RF suppressing sheath
GB2033645A (en) * 1978-09-29 1980-05-21 Mayer F Lossy electric element such as wire cable or screen resistant and absorbent
GB2075744A (en) * 1980-05-12 1981-11-18 Junkosha Co Ltd Strip line cable
EP0375506A1 (fr) * 1988-12-20 1990-06-27 Thomson-Csf Câble semi-rigide de transmission d'ondes hyperfréquence
EP0382558A1 (en) * 1989-02-10 1990-08-16 Junkosha Co. Ltd. Strip line cable
GB2284094A (en) * 1990-04-05 1995-05-24 Gen Electric Microwave component having tailored operating characteristics and method of tailoring

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL94742C (enExample) * 1951-05-31
JPS5636163Y2 (enExample) * 1976-08-19 1981-08-26
US4796079A (en) * 1984-07-25 1989-01-03 Rca Licensing Corporation Chip component providing rf suppression
CA2116995C (en) * 1993-03-05 1999-01-12 Kazunori Yamate Three-terminal capacitor and assembly
US5594397A (en) * 1994-09-02 1997-01-14 Tdk Corporation Electronic filtering part using a material with microwave absorbing properties

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2012097A (en) * 1977-11-29 1979-07-18 Mayer F Cable having RF suppressing sheath
GB2033645A (en) * 1978-09-29 1980-05-21 Mayer F Lossy electric element such as wire cable or screen resistant and absorbent
GB2075744A (en) * 1980-05-12 1981-11-18 Junkosha Co Ltd Strip line cable
EP0375506A1 (fr) * 1988-12-20 1990-06-27 Thomson-Csf Câble semi-rigide de transmission d'ondes hyperfréquence
EP0382558A1 (en) * 1989-02-10 1990-08-16 Junkosha Co. Ltd. Strip line cable
GB2284094A (en) * 1990-04-05 1995-05-24 Gen Electric Microwave component having tailored operating characteristics and method of tailoring

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2382725A (en) * 2002-02-25 2003-06-04 Bookham Technology Plc Transmission line structure

Also Published As

Publication number Publication date
JPH1098301A (ja) 1998-04-14
US5756932A (en) 1998-05-26
DE19723052A1 (de) 1998-02-05
GB9713350D0 (en) 1997-08-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)