DE19518659A1 - Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat - Google Patents

Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat

Info

Publication number
DE19518659A1
DE19518659A1 DE19518659A DE19518659A DE19518659A1 DE 19518659 A1 DE19518659 A1 DE 19518659A1 DE 19518659 A DE19518659 A DE 19518659A DE 19518659 A DE19518659 A DE 19518659A DE 19518659 A1 DE19518659 A1 DE 19518659A1
Authority
DE
Germany
Prior art keywords
substrate
component
conductor track
contacted
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19518659A
Other languages
German (de)
English (en)
Inventor
Werner Dipl Phys Dr Gruenwald
Ralf Dipl Phys Dr Haug
Frank-Dieter Dipl In Hauschild
Martin Dipl Phys Dr Seyffert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19518659A priority Critical patent/DE19518659A1/de
Priority to DE59605642T priority patent/DE59605642D1/de
Priority to US08/727,541 priority patent/US5784779A/en
Priority to ES96905709T priority patent/ES2149454T3/es
Priority to EP96905709A priority patent/EP0771472B1/de
Priority to PCT/DE1996/000432 priority patent/WO1996036991A1/de
Priority to JP8534436A priority patent/JPH10503331A/ja
Priority to KR1019970700304A priority patent/KR970705171A/ko
Priority to TW085103252A priority patent/TW297937B/zh
Publication of DE19518659A1 publication Critical patent/DE19518659A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01044—Ruthenium [Ru]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01045—Rhodium [Rh]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/012—Method or apparatus with electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19518659A 1995-05-20 1995-05-20 Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat Withdrawn DE19518659A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE19518659A DE19518659A1 (de) 1995-05-20 1995-05-20 Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat
DE59605642T DE59605642D1 (de) 1995-05-20 1996-03-12 Verfahren zum verbinden eines elektrischen anschlusses eines unverpackten ic-bauelements mit einer leiterbahn auf einem substrat
US08/727,541 US5784779A (en) 1995-05-20 1996-03-12 Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate
ES96905709T ES2149454T3 (es) 1995-05-20 1996-03-12 Procedimiento para conectar una conexion electrica de un componente de circuito impreso no empaquetado con una banda conductora sobre un substrato.
EP96905709A EP0771472B1 (de) 1995-05-20 1996-03-12 Verfahren zum verbinden eines elektrischen anschlusses eines unverpackten ic-bauelements mit einer leiterbahn auf einem substrat
PCT/DE1996/000432 WO1996036991A1 (de) 1995-05-20 1996-03-12 Verfahren zum verbinden eines elektrischen anschlusses eines unverpackten ic-bauelements mit einer leiterbahn auf einem substrat
JP8534436A JPH10503331A (ja) 1995-05-20 1996-03-12 基板上に導体路を有する包装されていないｉｃ構成素子の電気接続部を接続させる方法
KR1019970700304A KR970705171A (ko) 1995-05-20 1996-03-12 집적회로의 구성 소자의 전기접속부의 접속방법(Method for electrical connection of ic's components)
TW085103252A TW297937B (enExample) 1995-05-20 1996-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19518659A DE19518659A1 (de) 1995-05-20 1995-05-20 Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat

Publications (1)

Publication Number Publication Date
DE19518659A1 true DE19518659A1 (de) 1996-11-21

Family

ID=7762506

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19518659A Withdrawn DE19518659A1 (de) 1995-05-20 1995-05-20 Verfahren zum Verbinden eines elektrischen Anschlußes eines unverpackten IC-Bauelements mit einer Leiterbahn auf einem Substrat
DE59605642T Expired - Fee Related DE59605642D1 (de) 1995-05-20 1996-03-12 Verfahren zum verbinden eines elektrischen anschlusses eines unverpackten ic-bauelements mit einer leiterbahn auf einem substrat

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59605642T Expired - Fee Related DE59605642D1 (de) 1995-05-20 1996-03-12 Verfahren zum verbinden eines elektrischen anschlusses eines unverpackten ic-bauelements mit einer leiterbahn auf einem substrat

Country Status (8)

Country Link
US (1) US5784779A (enExample)
EP (1) EP0771472B1 (enExample)
JP (1) JPH10503331A (enExample)
KR (1) KR970705171A (enExample)
DE (2) DE19518659A1 (enExample)
ES (1) ES2149454T3 (enExample)
TW (1) TW297937B (enExample)
WO (1) WO1996036991A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7626262B2 (en) 2006-06-14 2009-12-01 Infineon Technologies Ag Electrically conductive connection, electronic component and method for their production

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4688699A (en) * 1998-06-22 2000-01-10 Loctite Corporation Thermosetting resin compositions useful as underfill sealants
US20020104576A1 (en) * 2000-08-30 2002-08-08 Howland Charles A. Multi-layer and laminate fabric systems

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
JPS5586130A (en) * 1978-12-25 1980-06-28 Hitachi Ltd Connection of semiconductor element
US4642889A (en) * 1985-04-29 1987-02-17 Amp Incorporated Compliant interconnection and method therefor
DE3843984A1 (de) * 1988-12-27 1990-07-05 Asea Brown Boveri Verfahren zum loeten eines drahtlosen bauelementes sowie leiterplatte mit angeloetetem, drahtlosem bauelement
JP2709499B2 (ja) * 1989-02-25 1998-02-04 新日本製鐵株式会社 半導体素子接続構造
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
US5086558A (en) * 1990-09-13 1992-02-11 International Business Machines Corporation Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer
JP2756184B2 (ja) * 1990-11-27 1998-05-25 株式会社日立製作所 電子部品の表面実装構造
US5056215A (en) * 1990-12-10 1991-10-15 Delco Electronics Corporation Method of providing standoff pillars
JP2940269B2 (ja) * 1990-12-26 1999-08-25 日本電気株式会社 集積回路素子の接続方法
JPH04320089A (ja) * 1991-04-18 1992-11-10 Cmk Corp プリント配線板の製造方法
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5245750A (en) * 1992-02-28 1993-09-21 Hughes Aircraft Company Method of connecting a spaced ic chip to a conductor and the article thereby obtained
DE4227085A1 (de) * 1992-08-17 1994-02-24 Bosch Gmbh Robert Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7626262B2 (en) 2006-06-14 2009-12-01 Infineon Technologies Ag Electrically conductive connection, electronic component and method for their production
DE102007027378B4 (de) * 2006-06-14 2013-05-16 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements

Also Published As

Publication number Publication date
KR970705171A (ko) 1997-09-06
JPH10503331A (ja) 1998-03-24
US5784779A (en) 1998-07-28
TW297937B (enExample) 1997-02-11
WO1996036991A1 (de) 1996-11-21
ES2149454T3 (es) 2000-11-01
EP0771472B1 (de) 2000-07-26
EP0771472A1 (de) 1997-05-07
DE59605642D1 (de) 2000-08-31

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