DE1900442B2 - Alkalisches bad zum stromlosen reduktiven verkupfern von katalytisch wirkenden oberflaechen - Google Patents
Alkalisches bad zum stromlosen reduktiven verkupfern von katalytisch wirkenden oberflaechenInfo
- Publication number
- DE1900442B2 DE1900442B2 DE19691900442 DE1900442A DE1900442B2 DE 1900442 B2 DE1900442 B2 DE 1900442B2 DE 19691900442 DE19691900442 DE 19691900442 DE 1900442 A DE1900442 A DE 1900442A DE 1900442 B2 DE1900442 B2 DE 1900442B2
- Authority
- DE
- Germany
- Prior art keywords
- copper plating
- electroless copper
- cupric ions
- contng
- cpd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69586068A | 1968-01-05 | 1968-01-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE1900442A1 DE1900442A1 (de) | 1969-11-20 |
DE1900442B2 true DE1900442B2 (de) | 1971-09-09 |
Family
ID=24794740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19691900442 Withdrawn DE1900442B2 (de) | 1968-01-05 | 1969-01-04 | Alkalisches bad zum stromlosen reduktiven verkupfern von katalytisch wirkenden oberflaechen |
Country Status (7)
Country | Link |
---|---|
US (1) | US3475186A (pt) |
BE (1) | BE726182A (pt) |
DE (1) | DE1900442B2 (pt) |
FR (1) | FR1599501A (pt) |
GB (1) | GB1195330A (pt) |
NL (1) | NL139095B (pt) |
SE (1) | SE345144B (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615735A (en) * | 1968-08-13 | 1971-10-26 | Shipley Co | Electroless copper plating |
US3615733A (en) * | 1968-08-13 | 1971-10-26 | Shipley Co | Electroless copper plating |
US3765936A (en) * | 1968-08-13 | 1973-10-16 | Shipley Co | Electroless copper plate |
US3978252A (en) * | 1973-03-23 | 1976-08-31 | Macdermid Incorporated | Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon |
US4167601A (en) * | 1976-11-15 | 1979-09-11 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
US4228213A (en) * | 1979-08-13 | 1980-10-14 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
EP0132594B1 (en) * | 1983-07-25 | 1988-09-07 | Hitachi, Ltd. | Electroless copper plating solution |
US4969842A (en) * | 1989-11-30 | 1990-11-13 | Amp Incorporated | Molded electrical connector having integral spring contact beams |
US20090206526A1 (en) * | 2008-02-18 | 2009-08-20 | Huntsman Petrochemical Corporation | Sintering aids |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
GB1089317A (en) * | 1965-06-19 | 1967-11-01 | Asahi Dow Ltd | An electroless copper plating bath |
-
1968
- 1968-01-05 US US695860A patent/US3475186A/en not_active Expired - Lifetime
- 1968-12-11 GB GB58920/68A patent/GB1195330A/en not_active Expired
- 1968-12-27 BE BE726182D patent/BE726182A/xx unknown
- 1968-12-30 FR FR1599501D patent/FR1599501A/fr not_active Expired
-
1969
- 1969-01-02 SE SE26/69A patent/SE345144B/xx unknown
- 1969-01-03 NL NL696900088A patent/NL139095B/xx unknown
- 1969-01-04 DE DE19691900442 patent/DE1900442B2/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
BE726182A (pt) | 1969-06-27 |
SE345144B (pt) | 1972-05-15 |
NL6900088A (pt) | 1969-07-08 |
US3475186A (en) | 1969-10-28 |
DE1900442A1 (de) | 1969-11-20 |
NL139095B (nl) | 1973-06-15 |
GB1195330A (en) | 1970-06-17 |
FR1599501A (pt) | 1970-07-15 |
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DE1900442B2 (de) | Alkalisches bad zum stromlosen reduktiven verkupfern von katalytisch wirkenden oberflaechen | |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SH | Request for examination between 03.10.1968 and 22.04.1971 | ||
E77 | Valid patent as to the heymanns-index 1977 | ||
EHJ | Ceased/non-payment of the annual fee |