ES375193A1 - Procedimiento de cobreado por reduccion quimica. - Google Patents

Procedimiento de cobreado por reduccion quimica.

Info

Publication number
ES375193A1
ES375193A1 ES375193A ES375193A ES375193A1 ES 375193 A1 ES375193 A1 ES 375193A1 ES 375193 A ES375193 A ES 375193A ES 375193 A ES375193 A ES 375193A ES 375193 A1 ES375193 A1 ES 375193A1
Authority
ES
Spain
Prior art keywords
copper plating
plating bath
electroless copper
ions
chemical reduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES375193A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pernix Enthone SA
Original Assignee
Pernix Enthone SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pernix Enthone SA filed Critical Pernix Enthone SA
Publication of ES375193A1 publication Critical patent/ES375193A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
ES375193A 1969-01-06 1970-01-05 Procedimiento de cobreado por reduccion quimica. Expired ES375193A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78940269A 1969-01-06 1969-01-06

Publications (1)

Publication Number Publication Date
ES375193A1 true ES375193A1 (es) 1973-08-16

Family

ID=25147540

Family Applications (1)

Application Number Title Priority Date Filing Date
ES375193A Expired ES375193A1 (es) 1969-01-06 1970-01-05 Procedimiento de cobreado por reduccion quimica.

Country Status (3)

Country Link
US (1) US3615736A (es)
ES (1) ES375193A1 (es)
GB (1) GB1286941A (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (es) * 1975-03-14 1981-06-25
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US4751106A (en) * 1986-09-25 1988-06-14 Shipley Company Inc. Metal plating process
JPH04234765A (ja) * 1990-08-29 1992-08-24 Xerox Corp 基体、ベルトおよび静電写真像形成部材、並びにこれらの製造方法
JP3052515B2 (ja) * 1991-11-28 2000-06-12 上村工業株式会社 無電解銅めっき浴及びめっき方法
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
GB2385863A (en) * 2001-10-29 2003-09-03 Qinetiq Ltd High resolution patterning method
US20060063382A1 (en) * 2004-09-17 2006-03-23 Dubin Valery M Method to fabricate copper-cobalt interconnects
DE102010012204B4 (de) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
EP2862959A1 (en) * 2013-10-21 2015-04-22 ATOTECH Deutschland GmbH Method of selectively treating copper in the presence of further metal
JP6733016B1 (ja) * 2019-07-17 2020-07-29 上村工業株式会社 無電解銅めっき浴
KR20210019752A (ko) * 2019-08-13 2021-02-23 삼성전기주식회사 무전해 동도금용 조성물 및 이를 이용한 무전해 도금 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377144A (en) * 1965-04-08 1968-04-09 Paragon Die Casting Company Speaker grill

Also Published As

Publication number Publication date
GB1286941A (en) 1972-08-31
DE2000320B2 (de) 1976-04-22
DE2000320A1 (de) 1970-07-16
US3615736A (en) 1971-10-26

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