ES345064A1 - Procedimiento de encobrado sin corriente electrica. - Google Patents

Procedimiento de encobrado sin corriente electrica.

Info

Publication number
ES345064A1
ES345064A1 ES345064A ES345064A ES345064A1 ES 345064 A1 ES345064 A1 ES 345064A1 ES 345064 A ES345064 A ES 345064A ES 345064 A ES345064 A ES 345064A ES 345064 A1 ES345064 A1 ES 345064A1
Authority
ES
Spain
Prior art keywords
stardusting
inhibiting
copper plating
electroless copper
coded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES345064A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pernix Enthone SA
Original Assignee
Pernix Enthone SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pernix Enthone SA filed Critical Pernix Enthone SA
Publication of ES345064A1 publication Critical patent/ES345064A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
ES345064A 1966-09-15 1967-09-14 Procedimiento de encobrado sin corriente electrica. Expired ES345064A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57947966A 1966-09-15 1966-09-15

Publications (1)

Publication Number Publication Date
ES345064A1 true ES345064A1 (es) 1969-01-01

Family

ID=24317064

Family Applications (1)

Application Number Title Priority Date Filing Date
ES345064A Expired ES345064A1 (es) 1966-09-15 1967-09-14 Procedimiento de encobrado sin corriente electrica.

Country Status (2)

Country Link
US (1) US3472664A (es)
ES (1) ES345064A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607317A (en) * 1969-02-04 1971-09-21 Photocircuits Corp Ductility promoter and stabilizer for electroless copper plating baths
BE757573A (fr) * 1969-10-16 1971-04-15 Philips Nv Depot sans courant de cuivre flexible
US3661597A (en) * 1971-05-20 1972-05-09 Shipley Co Electroless copper plating
JPS5627594B2 (es) * 1975-03-14 1981-06-25
DE3121015C2 (de) * 1981-05-27 1986-12-04 Friedr. Blasberg GmbH und Co KG, 5650 Solingen Verfahren zur Aktivierung von gebeizten Oberflächen und Lösung zur Durchführung desselben
US4751110A (en) * 1986-07-14 1988-06-14 Shipley Company Inc. Radiation attenuation shielding
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2147415A (en) * 1937-05-11 1939-02-14 Eastman Kodak Co Electroplating
US2472393A (en) * 1944-09-25 1949-06-07 American Steel & Wire Co Process and bath for copper coating ferrous metal
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US2844486A (en) * 1956-12-26 1958-07-22 Sierra Talc & Clay Company Water dispersible talc pigment composition
US2976169A (en) * 1958-02-12 1961-03-21 Du Pont Immersion deposition of tin
US2996408A (en) * 1958-03-31 1961-08-15 Gen Electric Copper plating process and solution
US3246995A (en) * 1962-02-19 1966-04-19 Aerojet General Co Metal marking composition
US3202523A (en) * 1962-06-12 1965-08-24 Alside Inc Method and apparatus for applying expendable protective coatings on finished surfaces
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3392035A (en) * 1963-09-02 1968-07-09 Torigai Eiichi Method and bath for chemically plating copper
US3301680A (en) * 1964-02-07 1967-01-31 Mo Och Domsjoe Ab Method of impregnating paper to reduce curling tendency and resultant article
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials

Also Published As

Publication number Publication date
US3472664A (en) 1969-10-14

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