DE1816813A1 - Kunststoffgekapselte elektronische Montageeinheit - Google Patents

Kunststoffgekapselte elektronische Montageeinheit

Info

Publication number
DE1816813A1
DE1816813A1 DE19681816813 DE1816813A DE1816813A1 DE 1816813 A1 DE1816813 A1 DE 1816813A1 DE 19681816813 DE19681816813 DE 19681816813 DE 1816813 A DE1816813 A DE 1816813A DE 1816813 A1 DE1816813 A1 DE 1816813A1
Authority
DE
Germany
Prior art keywords
plastic
metal
assembly unit
parts
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681816813
Other languages
German (de)
English (en)
Other versions
DE1816813B2 (https=
Inventor
Dunn Thomas Arnold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE1816813A1 publication Critical patent/DE1816813A1/de
Publication of DE1816813B2 publication Critical patent/DE1816813B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19681816813 1967-12-26 1968-12-24 Kunststoffgekapselte elektronische Montageeinheit Pending DE1816813A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69361167A 1967-12-26 1967-12-26

Publications (2)

Publication Number Publication Date
DE1816813A1 true DE1816813A1 (de) 1969-07-17
DE1816813B2 DE1816813B2 (https=) 1970-06-25

Family

ID=24785381

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681816813 Pending DE1816813A1 (de) 1967-12-26 1968-12-24 Kunststoffgekapselte elektronische Montageeinheit

Country Status (5)

Country Link
US (1) US3444309A (https=)
BE (1) BE726039A (https=)
DE (1) DE1816813A1 (https=)
FR (1) FR1598638A (https=)
GB (1) GB1246468A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4015311A1 (de) * 1990-05-12 1991-11-14 Vdo Schindling Elektrische schaltungsanordnung

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729573A (en) * 1971-01-25 1973-04-24 Motorola Inc Plastic encapsulation of semiconductor devices
JPS4846559U (https=) * 1971-09-30 1973-06-18
US3801728A (en) * 1972-10-20 1974-04-02 Bell Telephone Labor Inc Microelectronic packages
US4066839A (en) * 1972-11-16 1978-01-03 Sgs-Ates Componenti Elettronici S.P.A. Molded body incorporating heat dissipator
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
DE3003373A1 (de) * 1980-01-31 1981-08-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrische baueinheit mit einer leiterplatte
US5674343A (en) * 1994-04-19 1997-10-07 Nitto Denko Corporation Method for manufacturing a semiconductor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325586A (en) * 1963-03-05 1967-06-13 Fairchild Camera Instr Co Circuit element totally encapsulated in glass

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4015311A1 (de) * 1990-05-12 1991-11-14 Vdo Schindling Elektrische schaltungsanordnung

Also Published As

Publication number Publication date
GB1246468A (en) 1971-09-15
FR1598638A (https=) 1970-07-06
BE726039A (https=) 1969-06-24
DE1816813B2 (https=) 1970-06-25
US3444309A (en) 1969-05-13

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