GB1246468A - Electronic assembly - Google Patents
Electronic assemblyInfo
- Publication number
- GB1246468A GB1246468A GB58056/68A GB5805668A GB1246468A GB 1246468 A GB1246468 A GB 1246468A GB 58056/68 A GB58056/68 A GB 58056/68A GB 5805668 A GB5805668 A GB 5805668A GB 1246468 A GB1246468 A GB 1246468A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plate
- base
- tubular members
- frame
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69361167A | 1967-12-26 | 1967-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1246468A true GB1246468A (en) | 1971-09-15 |
Family
ID=24785381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB58056/68A Expired GB1246468A (en) | 1967-12-26 | 1968-12-06 | Electronic assembly |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3444309A (https=) |
| BE (1) | BE726039A (https=) |
| DE (1) | DE1816813A1 (https=) |
| FR (1) | FR1598638A (https=) |
| GB (1) | GB1246468A (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3729573A (en) * | 1971-01-25 | 1973-04-24 | Motorola Inc | Plastic encapsulation of semiconductor devices |
| JPS4846559U (https=) * | 1971-09-30 | 1973-06-18 | ||
| US3801728A (en) * | 1972-10-20 | 1974-04-02 | Bell Telephone Labor Inc | Microelectronic packages |
| US4066839A (en) * | 1972-11-16 | 1978-01-03 | Sgs-Ates Componenti Elettronici S.P.A. | Molded body incorporating heat dissipator |
| US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
| DE3003373A1 (de) * | 1980-01-31 | 1981-08-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Elektrische baueinheit mit einer leiterplatte |
| DE4015311C2 (de) * | 1990-05-12 | 1993-12-16 | Vdo Schindling | Elektrische Schaltungsanordnung |
| US5674343A (en) * | 1994-04-19 | 1997-10-07 | Nitto Denko Corporation | Method for manufacturing a semiconductor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3325586A (en) * | 1963-03-05 | 1967-06-13 | Fairchild Camera Instr Co | Circuit element totally encapsulated in glass |
-
1967
- 1967-12-26 US US693611A patent/US3444309A/en not_active Expired - Lifetime
-
1968
- 1968-12-06 GB GB58056/68A patent/GB1246468A/en not_active Expired
- 1968-12-23 FR FR1598638D patent/FR1598638A/fr not_active Expired
- 1968-12-24 DE DE19681816813 patent/DE1816813A1/de active Pending
- 1968-12-24 BE BE726039D patent/BE726039A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1816813A1 (de) | 1969-07-17 |
| FR1598638A (https=) | 1970-07-06 |
| BE726039A (https=) | 1969-06-24 |
| DE1816813B2 (https=) | 1970-06-25 |
| US3444309A (en) | 1969-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3657610A (en) | Self-sealing face-down bonded semiconductor device | |
| GB1365658A (en) | Semiconductor device | |
| US3784725A (en) | Electronic hybrid package | |
| US3629672A (en) | Semiconductor device having an improved heat sink arrangement | |
| GB1320924A (en) | Semiconductor device with thermally conductive dielectric barrier | |
| US3651448A (en) | Power frame for integrated circuit | |
| US3598896A (en) | Encapsulated semiconductor device with parts formed of sinter metal and plastic | |
| US3689683A (en) | Module for integrated circuits and method of making same | |
| US9607933B2 (en) | Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure | |
| GB1246468A (en) | Electronic assembly | |
| GB1238569A (https=) | ||
| GB1292636A (en) | Semiconductor devices and methods for their fabrication | |
| GB1207728A (en) | Housing assembly for an electric circuit | |
| US20240404983A1 (en) | Method for Fabricating a Semiconductor Device | |
| US3525910A (en) | Contact system for intricate geometry devices | |
| US3178621A (en) | Sealed housing for electronic elements | |
| GB1231019A (https=) | ||
| US3231797A (en) | Semiconductor device | |
| US3479570A (en) | Encapsulation and connection structure for high power and high frequency semiconductor devices | |
| GB1359780A (en) | Beam-lead semiconductor components | |
| US3729573A (en) | Plastic encapsulation of semiconductor devices | |
| KR20120138984A (ko) | 전력 모듈 패키지 및 그 제조방법 | |
| GB1278647A (en) | Electrical housing assembly | |
| GB1033813A (en) | Electrical semiconductor device | |
| GB1300881A (en) | Improvements in or relating to stacked arrangements of semiconductor bodies |