GB1231019A - - Google Patents

Info

Publication number
GB1231019A
GB1231019A GB1231019DA GB1231019A GB 1231019 A GB1231019 A GB 1231019A GB 1231019D A GB1231019D A GB 1231019DA GB 1231019 A GB1231019 A GB 1231019A
Authority
GB
United Kingdom
Prior art keywords
pattern
substrate
die
relief pattern
relief
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1231019A publication Critical patent/GB1231019A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding

Landscapes

  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB1231019D 1967-08-02 1968-08-02 Expired GB1231019A (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65792967A 1967-08-02 1967-08-02
US71285568A 1968-03-13 1968-03-13

Publications (1)

Publication Number Publication Date
GB1231019A true GB1231019A (https=) 1971-05-05

Family

ID=27097522

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1231019D Expired GB1231019A (https=) 1967-08-02 1968-08-02

Country Status (4)

Country Link
US (2) US3521128A (https=)
DE (1) DE1766879B1 (https=)
FR (1) FR1575174A (https=)
GB (1) GB1231019A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005051346A1 (de) * 2005-10-25 2007-05-03 Thallner, Erich, Dipl.-Ing. Träger für einen Wafer sowie Verfahren zur Handhabung des Trägers

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831507B1 (https=) * 1969-07-10 1973-09-29
US3700788A (en) * 1971-01-28 1972-10-24 Coars Porcelain Co Electrical component package
US3751720A (en) * 1971-12-20 1973-08-07 Ibm Radially oriented monolithic circuit masterslice
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
US4670770A (en) * 1984-02-21 1987-06-02 American Telephone And Telegraph Company Integrated circuit chip-and-substrate assembly
US5034802A (en) * 1989-12-11 1991-07-23 Hewlett-Packard Company Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates
US5491362A (en) * 1992-04-30 1996-02-13 Vlsi Technology, Inc. Package structure having accessible chip
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
KR100380701B1 (ko) * 1994-07-26 2003-07-22 코닌클리케 필립스 일렉트로닉스 엔.브이. 표면장착용반도체장치제조방법및표면장착용반도체장치
US5657207A (en) * 1995-03-24 1997-08-12 Packard Hughes Interconnect Company Alignment means for integrated circuit chips
WO1998027589A1 (en) * 1996-12-19 1998-06-25 Telefonaktiebolaget Lm Ericsson (Publ) Flip-chip type connection with elastic contacts
US6348659B1 (en) * 1999-01-07 2002-02-19 Thomas & Betts International, Inc. Resilient electrical interconnects having non-uniform cross-section
TW483129B (en) * 2000-10-05 2002-04-11 Amkor Technology Taiwan Linkou Package for image sensing device and its manufacturing process
US20050136742A1 (en) * 2003-12-17 2005-06-23 Thomas Szolyga Removable computer peripheral cartridge and related system and method
JP5981154B2 (ja) * 2012-02-02 2016-08-31 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2918640A (en) * 1956-03-23 1959-12-22 Gen Instrument Corp Transformer construction
DE1069236B (https=) * 1956-09-04 1959-11-19
US3027526A (en) * 1957-12-23 1962-03-27 Burroughs Corp Magnetic core assembly
DE1113483B (de) * 1958-12-29 1961-09-07 Amp Inc Schaltungsanordnung mit blockfoermigen, in ein Rahmengestell einschiebbaren Schaltungsgruppen
US3122680A (en) * 1960-02-25 1964-02-25 Burroughs Corp Miniaturized switching circuit
US3196318A (en) * 1960-06-06 1965-07-20 Ibm High density electronic package
US3114867A (en) * 1960-09-21 1963-12-17 Rca Corp Unipolar transistors and assemblies therefor
DE1218568B (de) * 1960-11-30 1966-06-08 Siemens Ag Mit Bauelementen versehenes Mikrobauteil fuer Miniaturbaugruppen
NL270369A (https=) * 1961-01-16
DE1229157B (de) * 1961-08-14 1966-11-24 Texas Instruments Inc Anordnung zum schaltungsmaessigen Verbinden einer Anzahl von Schaltplatten
DE1150726B (de) * 1962-02-05 1963-06-27 Siemens Ag Traeger-, Halte-, Umlenk- oder Verbindungs-element fuer Miniaturbaugruppen der Elektronik
NL292051A (https=) * 1962-04-27
US3249908A (en) * 1962-06-12 1966-05-03 Amp Inc Connecting device
US3213325A (en) * 1962-10-05 1965-10-19 Litton Prec Products Inc Weldable terminal
DE1182715B (de) * 1962-11-29 1964-12-03 Telefunken Patent Elektrisches Bauelement, das mit anderen Bauelementen zu einer Baugruppe stapelbar ist und dazugehoeriges Verbindungselement und Verfahren zu ihrer Herstellung
GB1058296A (en) * 1963-06-28 1967-02-08 Rca Corp Composite insulator-semiconductor wafer and method of making same
US3292240A (en) * 1963-08-08 1966-12-20 Ibm Method of fabricating microminiature functional components
US3286132A (en) * 1963-11-18 1966-11-15 Boeing Co Printed circuit board and component with improved mounting base for the component
US3331995A (en) * 1964-02-25 1967-07-18 Hughes Aircraft Co Housed semiconductor device with thermally matched elements
US3289045A (en) * 1964-03-02 1966-11-29 Intellux Inc Circuit module
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
FR1486855A (https=) * 1965-07-17 1967-10-05
US3418422A (en) * 1966-02-28 1968-12-24 Texas Instruments Inc Attachment of integrated circuit leads to printed circuit boards
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005051346A1 (de) * 2005-10-25 2007-05-03 Thallner, Erich, Dipl.-Ing. Träger für einen Wafer sowie Verfahren zur Handhabung des Trägers
DE102005051346B4 (de) * 2005-10-25 2011-02-10 Thallner, Erich, Dipl.-Ing. Träger für einen Wafer, Kombination aus einem Träger und einem Wafer sowie Verfahren zur Handhabung des Trägers

Also Published As

Publication number Publication date
DE1766879B1 (de) 1971-08-26
US3521128A (en) 1970-07-21
FR1575174A (https=) 1969-07-18
US3543106A (en) 1970-11-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees