DE1764891C3 - Verfahren und Einrichtung zum Trennen einer Mehrzahl von plättchen- oder würfelförmigen Gegenständen - Google Patents

Verfahren und Einrichtung zum Trennen einer Mehrzahl von plättchen- oder würfelförmigen Gegenständen

Info

Publication number
DE1764891C3
DE1764891C3 DE1764891A DE1764891A DE1764891C3 DE 1764891 C3 DE1764891 C3 DE 1764891C3 DE 1764891 A DE1764891 A DE 1764891A DE 1764891 A DE1764891 A DE 1764891A DE 1764891 C3 DE1764891 C3 DE 1764891C3
Authority
DE
Germany
Prior art keywords
membrane
objects
shaped
porous
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1764891A
Other languages
German (de)
English (en)
Other versions
DE1764891A1 (de
DE1764891B2 (de
Inventor
Jacob Robert Pittsburgh Bippus
Anderson Forbes Sinking Springs Johnson Jun.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE1764891A1 publication Critical patent/DE1764891A1/de
Publication of DE1764891B2 publication Critical patent/DE1764891B2/de
Application granted granted Critical
Publication of DE1764891C3 publication Critical patent/DE1764891C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5176—Plural diverse manufacturing apparatus including means for metal shaping or assembling including machining means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
DE1764891A 1966-05-20 1968-08-27 Verfahren und Einrichtung zum Trennen einer Mehrzahl von plättchen- oder würfelförmigen Gegenständen Expired DE1764891C3 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US55170966A 1966-05-20 1966-05-20
US69687368A 1968-01-10 1968-01-10
GB3788468A GB1163079A (en) 1966-05-20 1968-08-08 Methods and Apparatus for Separating Articles Initially in a Compact Array and for Retaining the Articles in a Separated Condition.

Publications (3)

Publication Number Publication Date
DE1764891A1 DE1764891A1 (de) 1972-01-27
DE1764891B2 DE1764891B2 (de) 1972-10-12
DE1764891C3 true DE1764891C3 (de) 1980-10-23

Family

ID=27259463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1764891A Expired DE1764891C3 (de) 1966-05-20 1968-08-27 Verfahren und Einrichtung zum Trennen einer Mehrzahl von plättchen- oder würfelförmigen Gegenständen

Country Status (6)

Country Link
US (1) US3448510A (nl)
BE (1) BE719816A (nl)
DE (1) DE1764891C3 (nl)
FR (1) FR1580730A (nl)
GB (1) GB1163079A (nl)
NL (1) NL159533B (nl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3120477A1 (de) * 1980-05-23 1982-03-11 Disco Co., Ltd., Tokyo Vorrichtung zum aufspannen und fixieren von halbleiter-plaettchen

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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NL6709523A (nl) * 1967-07-08 1969-01-10
US3988196A (en) * 1967-10-09 1976-10-26 Western Electric Company, Inc. Apparatus for transferring an oriented array of articles
US3899379A (en) * 1967-10-09 1975-08-12 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
US3590462A (en) * 1968-11-18 1971-07-06 Western Electric Co Method and apparatus for expanding an array of articles
CA858142A (en) * 1969-04-26 1970-12-08 R. St. Louis Jacques Method and apparatus for dicing and cleaning semi-conductor slices
US3747204A (en) * 1969-12-04 1973-07-24 Advanced Technology Center Inc Method for making an acoustic transducer
US3727282A (en) * 1970-02-05 1973-04-17 Burroughs Corp Semiconductor handling apparatus
US3850721A (en) * 1970-04-03 1974-11-26 Texas Instruments Inc Method of cleaning and transferring semiconductors
US3766638A (en) * 1970-08-31 1973-10-23 Hugle Ind Inc Wafer spreader
US3707760A (en) * 1971-05-19 1973-01-02 Sieburg Ind Inc Method and device for article working such as fracturing of semiconductor slices and separating semiconductor chips
US3788505A (en) * 1971-09-16 1974-01-29 J Kirsch Method for vacuum pick-up of porous materials
US3811182A (en) * 1972-03-31 1974-05-21 Ibm Object handling fixture, system, and process
US3989566A (en) * 1972-11-20 1976-11-02 Western Electric Company, Inc. Method of holding articles
NL7317749A (nl) * 1972-12-27 1974-07-01
US3918150A (en) * 1974-02-08 1975-11-11 Gen Electric System for separating a semiconductor wafer into discrete pellets
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4296542A (en) * 1980-07-11 1981-10-27 Presco, Inc. Control of small parts in a manufacturing operation
US4410168A (en) * 1980-07-11 1983-10-18 Asta, Ltd. Apparatus for manipulating a stretched resilient diaphragm
GB2128580B (en) * 1982-09-06 1986-07-02 Kulicke & Soffa Handling system for laminar objects
US4711014A (en) * 1985-08-29 1987-12-08 Vichem Corporation Method for handling semiconductor die and the like
US4667944A (en) * 1985-08-29 1987-05-26 Vichem Corporation Means for handling semiconductor die and the like
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
US5206749A (en) 1990-12-31 1993-04-27 Kopin Corporation Liquid crystal display having essentially single crystal transistors pixels and driving circuits
US5528397A (en) * 1991-12-03 1996-06-18 Kopin Corporation Single crystal silicon transistors for display panels
US5710065A (en) * 1995-01-03 1998-01-20 Texas Instruments Incorporated Method and apparatus for breaking and separating dies from a wafer
JP3662404B2 (ja) * 1997-11-19 2005-06-22 芝浦メカトロニクス株式会社 ウエハシート引伸ばし装置およびそれを用いたペレットボンディング装置
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP2003229469A (ja) * 2002-02-04 2003-08-15 Disco Abrasive Syst Ltd 半導体チップピックアップ装置
US7749867B2 (en) 2002-03-12 2010-07-06 Hamamatsu Photonics K.K. Method of cutting processed object
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
CN100355031C (zh) 2002-03-12 2007-12-12 浜松光子学株式会社 基板的分割方法
WO2003098632A2 (en) * 2002-05-16 2003-11-27 Nova Research, Inc. Methods of fabricating magnetoresistive memory devices
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
WO2004080643A1 (ja) * 2003-03-12 2004-09-23 Hamamatsu Photonics K.K. レーザ加工方法
JP4256214B2 (ja) * 2003-06-27 2009-04-22 株式会社ディスコ 板状物の分割装置
US20050214930A1 (en) * 2004-03-26 2005-09-29 Bynum Magdalena A Apparatus and method for preventing cross contamination when dissassembling an array
JP4684569B2 (ja) * 2004-03-31 2011-05-18 株式会社ディスコ テープ拡張装置
US7858902B2 (en) * 2007-02-13 2010-12-28 Disco Corporation Wafer dividing method and laser beam processing machine
DE102007033242A1 (de) * 2007-07-12 2009-01-15 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser
KR100970243B1 (ko) * 2008-04-03 2010-07-16 코리아테크노(주) 반도체 웨이퍼 오염물질 측정장치의 스캔 스테이지
JP5715125B2 (ja) * 2010-05-28 2015-05-07 オリンパス株式会社 細胞分取装置、細胞分取システムおよび細胞分取方法
EP2629078B1 (en) * 2010-11-19 2019-04-17 Olympus Corporation Method for preparing biological sample
EP2711683B1 (en) * 2011-05-20 2016-08-03 Olympus Corporation Method of manufacturing base sheet
WO2013077297A1 (ja) * 2011-11-24 2013-05-30 オリンパス株式会社 細胞分取装置および細胞分取方法
EP2784473A4 (en) * 2011-11-25 2015-07-01 Olympus Corp TISSUE SEGMENTATION APPARATUS, CELL SORTING APPARATUS, CELL SORTING SYSTEM, TISSUE DISPLAY SYSTEM, SUBSTRATE, EXTENSIBLE ELEMENT, TISSUE SEGMENTATION METHOD, AND CELL SORTING METHOD
DE102012111869A1 (de) * 2012-12-06 2014-06-12 Aixtron Se Vakuumgreifvorrichtung
CN103904011B (zh) * 2012-12-28 2016-12-28 上海微电子装备有限公司 翘曲硅片吸附装置及其吸附方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2194551A (en) * 1936-06-25 1940-03-26 Emi Ltd Means and method of producing flat surfaces
US2608750A (en) * 1949-08-25 1952-09-02 Albert C Cluzel Apparatus for and method of making printing screens
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
NL284964A (nl) * 1961-11-10 1900-01-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3120477A1 (de) * 1980-05-23 1982-03-11 Disco Co., Ltd., Tokyo Vorrichtung zum aufspannen und fixieren von halbleiter-plaettchen

Also Published As

Publication number Publication date
BE719816A (nl) 1969-02-03
US3448510A (en) 1969-06-10
DE1764891A1 (de) 1972-01-27
GB1163079A (en) 1969-09-04
NL6815432A (nl) 1969-07-14
FR1580730A (nl) 1969-09-05
DE1764891B2 (de) 1972-10-12
NL159533B (nl) 1979-02-15

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee