CA858142A - Method and apparatus for dicing and cleaning semi-conductor slices - Google Patents

Method and apparatus for dicing and cleaning semi-conductor slices

Info

Publication number
CA858142A
CA858142A CA858142A CA858142DA CA858142A CA 858142 A CA858142 A CA 858142A CA 858142 A CA858142 A CA 858142A CA 858142D A CA858142D A CA 858142DA CA 858142 A CA858142 A CA 858142A
Authority
CA
Canada
Prior art keywords
dicing
cleaning semi
slices
conductor slices
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA858142A
Inventor
R. St. Louis Jacques
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Electric Co Ltd filed Critical Northern Electric Co Ltd
Application granted granted Critical
Publication of CA858142A publication Critical patent/CA858142A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CA858142A 1969-04-26 1969-04-26 Method and apparatus for dicing and cleaning semi-conductor slices Expired CA858142A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA49861 1969-04-26
US81973569A 1969-04-28 1969-04-28

Publications (1)

Publication Number Publication Date
CA858142A true CA858142A (en) 1970-12-08

Family

ID=36649562

Family Applications (1)

Application Number Title Priority Date Filing Date
CA858142A Expired CA858142A (en) 1969-04-26 1969-04-26 Method and apparatus for dicing and cleaning semi-conductor slices

Country Status (2)

Country Link
US (1) US3565306A (en)
CA (1) CA858142A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762426A (en) * 1972-04-26 1973-10-02 Ibm Semiconductor chip separation apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4068788A (en) * 1975-09-29 1978-01-17 Rca Corporation Method for cracking brittle material
US4653680A (en) * 1985-04-25 1987-03-31 Regan Barrie F Apparatus for breaking semiconductor wafers and the like
US5785225A (en) * 1991-12-06 1998-07-28 Loomis Industries, Inc. Frangible semiconductor wafer dicing apparatus which employs scribing and breaking
US5710065A (en) * 1995-01-03 1998-01-20 Texas Instruments Incorporated Method and apparatus for breaking and separating dies from a wafer
US6184063B1 (en) 1996-11-26 2001-02-06 Texas Instruments Incorporated Method and apparatus for breaking and separating a wafer into die using a multi-radii dome
US6685073B1 (en) 1996-11-26 2004-02-03 Texas Instruments Incorporated Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer
US6401994B1 (en) * 2001-08-31 2002-06-11 Joel R. Ham Contra-keeper

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762426A (en) * 1972-04-26 1973-10-02 Ibm Semiconductor chip separation apparatus

Also Published As

Publication number Publication date
US3565306A (en) 1971-02-23

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