DE1615957B2 - Anordnung mit mehreren Festkörperschaltungsplättchen - Google Patents

Anordnung mit mehreren Festkörperschaltungsplättchen

Info

Publication number
DE1615957B2
DE1615957B2 DE1615957A DED0052617A DE1615957B2 DE 1615957 B2 DE1615957 B2 DE 1615957B2 DE 1615957 A DE1615957 A DE 1615957A DE D0052617 A DED0052617 A DE D0052617A DE 1615957 B2 DE1615957 B2 DE 1615957B2
Authority
DE
Germany
Prior art keywords
solid
state circuit
circuit board
arrangement according
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1615957A
Other languages
German (de)
English (en)
Other versions
DE1615957C3 (enExample
DE1615957A1 (de
Inventor
John Wayne N.J. Marley (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
Deutsche ITT Industries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH filed Critical Deutsche ITT Industries GmbH
Publication of DE1615957A1 publication Critical patent/DE1615957A1/de
Publication of DE1615957B2 publication Critical patent/DE1615957B2/de
Application granted granted Critical
Publication of DE1615957C3 publication Critical patent/DE1615957C3/de
Granted legal-status Critical Current

Links

Classifications

    • H10W72/701—
    • H10W40/778—
    • H10W70/453—
    • H10W70/611—
    • H10W70/635—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE1615957A 1966-03-31 1967-03-23 Anordnung mit mehreren Festkörperschaltungsplättchen Granted DE1615957B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US539003A US3390308A (en) 1966-03-31 1966-03-31 Multiple chip integrated circuit assembly

Publications (3)

Publication Number Publication Date
DE1615957A1 DE1615957A1 (de) 1970-09-10
DE1615957B2 true DE1615957B2 (de) 1978-03-16
DE1615957C3 DE1615957C3 (enExample) 1979-02-15

Family

ID=24149343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1615957A Granted DE1615957B2 (de) 1966-03-31 1967-03-23 Anordnung mit mehreren Festkörperschaltungsplättchen

Country Status (2)

Country Link
US (1) US3390308A (enExample)
DE (1) DE1615957B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3727389A1 (de) * 1987-08-17 1989-03-02 Heidenhain Gmbh Dr Johannes Elektrische verbindung

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DE1539692A1 (de) * 1966-06-23 1969-10-16 Blume & Redecker Gmbh Umklebevorrichtung fuer Spulen
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3496419A (en) * 1967-04-25 1970-02-17 J R Andresen Enterprises Inc Printed circuit breadboard
US3594619A (en) * 1967-09-30 1971-07-20 Nippon Electric Co Face-bonded semiconductor device having improved heat dissipation
US3477051A (en) * 1967-12-26 1969-11-04 Ibm Die casting of core windings
US3529212A (en) * 1967-12-26 1970-09-15 Corning Glass Works Printed circuit assembly
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies
US3689991A (en) * 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
JPS4826069B1 (enExample) * 1968-03-04 1973-08-04
US3519890A (en) * 1968-04-01 1970-07-07 North American Rockwell Low stress lead
US3670639A (en) * 1968-12-16 1972-06-20 Gen Electric Flexible electronic integrated circuit camera control assembly
DE1915501C3 (de) * 1969-03-26 1975-10-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
DE2037666A1 (de) * 1970-07-29 1972-02-03 Siemens Ag Verfahren zum Kontaktieren eines mit mehreren Elektroden versehenen Halbleiterkörpers mit Hilfe eines aus einem Metallblech hergestellten Systems von elektrischen Zuleitungen
US3851383A (en) * 1970-07-29 1974-12-03 H Peltz Method of contacting a semiconductor body having a plurality of electrodes utilizing sheet metal electric leads
NL7011885A (enExample) * 1970-08-12 1972-02-15
CA892844A (en) * 1970-08-14 1972-02-08 H. Hantusch Gerald Semiconductor heat sink
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3683105A (en) * 1970-10-13 1972-08-08 Westinghouse Electric Corp Microcircuit modular package
US3684818A (en) * 1970-10-20 1972-08-15 Sprague Electric Co Multi-layer beam-lead wiring for semiconductor packages
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
US3746934A (en) * 1971-05-06 1973-07-17 Siemens Ag Stack arrangement of semiconductor chips
US3930115A (en) * 1971-05-19 1975-12-30 Philips Corp Electric component assembly comprising insulating foil bearing conductor tracks
US3740619A (en) * 1972-01-03 1973-06-19 Signetics Corp Semiconductor structure with yieldable bonding pads having flexible links and method
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process
US3823467A (en) * 1972-07-07 1974-07-16 Westinghouse Electric Corp Solid-state circuit module
GB1445591A (en) * 1973-03-24 1976-08-11 Int Computers Ld Mounting integrated circuit elements
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3943685A (en) * 1974-07-19 1976-03-16 Illinois Tool Works Inc. Machine for loading electric components into a carrier strip
US4048438A (en) * 1974-10-23 1977-09-13 Amp Incorporated Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
US4109275A (en) * 1976-12-22 1978-08-22 International Business Machines Corporation Interconnection of integrated circuit metallization
US4195195A (en) * 1978-09-28 1980-03-25 The United States Of America As Represented By The Secretary Of The Army Tape automated bonding test board
US4501960A (en) * 1981-06-22 1985-02-26 Motorola, Inc. Micropackage for identification card
US4413308A (en) * 1981-08-31 1983-11-01 Bell Telephone Laboratories, Incorporated Printed wiring board construction
DE3138987C2 (de) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Verhindern von Beschädigungen von Bausteinen bzw. Leiterbahnen auf einer Leiterplatte
FR2518813A1 (fr) * 1981-12-22 1983-06-24 Socapex Support d'interconnexion d'un boitier de circuit integre sur un circuit imprime et systeme d'interconnexion utilisant un tel support
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4573105A (en) * 1983-02-16 1986-02-25 Rca Corporation Printed circuit board assembly and method for the manufacture thereof
US4554613A (en) * 1983-10-31 1985-11-19 Kaufman Lance R Multiple substrate circuit package
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
JP2641869B2 (ja) * 1987-07-24 1997-08-20 三菱電機株式会社 半導体装置の製造方法
US4967261A (en) * 1987-07-30 1990-10-30 Mitsubishi Denki Kabushiki Kaisha Tape carrier for assembling an IC chip on a substrate
US7198969B1 (en) * 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5929517A (en) * 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
US5597470A (en) * 1995-06-18 1997-01-28 Tessera, Inc. Method for making a flexible lead for a microelectronic device
US5635718A (en) * 1996-01-16 1997-06-03 Minnesota Mining And Manufacturing Company Multi-module radiation detecting device and fabrication method
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6977440B2 (en) * 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
WO2003032370A2 (en) * 2001-10-09 2003-04-17 Tessera, Inc. Stacked packages
US7335995B2 (en) * 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US6765288B2 (en) * 2002-08-05 2004-07-20 Tessera, Inc. Microelectronic adaptors, assemblies and methods
US20040105244A1 (en) * 2002-08-06 2004-06-03 Ilyas Mohammed Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
WO2004017399A1 (en) * 2002-08-16 2004-02-26 Tessera, Inc. Microelectronic packages with self-aligning features
US7294928B2 (en) * 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US7071547B2 (en) * 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7061121B2 (en) 2003-11-12 2006-06-13 Tessera, Inc. Stacked microelectronic assemblies with central contacts
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7545029B2 (en) * 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies

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US3011379A (en) * 1957-02-05 1961-12-05 Baldwin Piano Co Electronic musical instrument with photoelectric switching
GB1009789A (en) * 1962-01-26 1965-11-10 Texas Instruments Inc Modular electronic packaging
US3195026A (en) * 1962-09-21 1965-07-13 Westinghouse Electric Corp Hermetically enclosed semiconductor device
US3234320A (en) * 1963-06-11 1966-02-08 United Carr Inc Integrated circuit package
US3248774A (en) * 1963-06-27 1966-05-03 Reynolds Metals Co Container body trimming and/or deburring apparatus
US3265802A (en) * 1963-11-18 1966-08-09 Mitronics Inc Cap for hermetically sealed semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3727389A1 (de) * 1987-08-17 1989-03-02 Heidenhain Gmbh Dr Johannes Elektrische verbindung

Also Published As

Publication number Publication date
DE1615957C3 (enExample) 1979-02-15
US3390308A (en) 1968-06-25
DE1615957A1 (de) 1970-09-10

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
EF Willingness to grant licences
8339 Ceased/non-payment of the annual fee