DE1521006B2 - Verfahren zur vorbehandlung von nichtleitenden unterlagen fuer das galvanische aufbringen von guthaftenden kupfer schichten fuer elektrische schaltungen - Google Patents
Verfahren zur vorbehandlung von nichtleitenden unterlagen fuer das galvanische aufbringen von guthaftenden kupfer schichten fuer elektrische schaltungenInfo
- Publication number
- DE1521006B2 DE1521006B2 DE19661521006 DE1521006A DE1521006B2 DE 1521006 B2 DE1521006 B2 DE 1521006B2 DE 19661521006 DE19661521006 DE 19661521006 DE 1521006 A DE1521006 A DE 1521006A DE 1521006 B2 DE1521006 B2 DE 1521006B2
- Authority
- DE
- Germany
- Prior art keywords
- copper
- electrical circuits
- conductive substrates
- copper layers
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 title claims description 5
- 238000002203 pretreatment Methods 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910000906 Bronze Inorganic materials 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010974 bronze Substances 0.000 claims description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 6
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 23
- 239000002585 base Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 239000012811 non-conductive material Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- KTZTWIUHOOVDLH-UHFFFAOYSA-N copper;ethane-1,2-diol Chemical compound [Cu].OCCO KTZTWIUHOOVDLH-UHFFFAOYSA-N 0.000 description 1
- 229910052571 earthenware Inorganic materials 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
- H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/926—Thickness of individual layer specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/928—Magnetic property
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/938—Vapor deposition or gas diffusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
- Y10T428/12618—Plural oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Physical Vapour Deposition (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US444849A US3360349A (en) | 1965-04-01 | 1965-04-01 | Copper layer bonded to a non-conductive layer by means of a copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE1521006A1 DE1521006A1 (de) | 1970-08-20 |
| DE1521006B2 true DE1521006B2 (de) | 1971-03-18 |
Family
ID=23766608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19661521006 Withdrawn DE1521006B2 (de) | 1965-04-01 | 1966-03-26 | Verfahren zur vorbehandlung von nichtleitenden unterlagen fuer das galvanische aufbringen von guthaftenden kupfer schichten fuer elektrische schaltungen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3360349A (enrdf_load_stackoverflow) |
| BE (1) | BE678387A (enrdf_load_stackoverflow) |
| CH (1) | CH468475A (enrdf_load_stackoverflow) |
| DE (1) | DE1521006B2 (enrdf_load_stackoverflow) |
| GB (1) | GB1095080A (enrdf_load_stackoverflow) |
| NL (1) | NL6604397A (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3512946A (en) * | 1967-04-17 | 1970-05-19 | Lash Mfg Inc | Composite material for shielding electrical and magnetic energy |
| NL87258C (enrdf_load_stackoverflow) * | 1969-01-15 | |||
| US3852148A (en) * | 1970-10-07 | 1974-12-03 | Olin Corp | Architectural products formed of glass or ceramic-to-metal composites |
| US4500383A (en) * | 1982-02-18 | 1985-02-19 | Kabushiki Kaisha Meidensha | Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy |
| US4996584A (en) * | 1985-01-31 | 1991-02-26 | Gould, Inc. | Thin-film electrical connections for integrated circuits |
| US4863808A (en) * | 1985-09-13 | 1989-09-05 | Gould Inc. | Copper-chromium-polyimide composite |
| CH675323A5 (enrdf_load_stackoverflow) * | 1987-12-24 | 1990-09-14 | Contraves Ag | |
| US4910077A (en) * | 1988-08-04 | 1990-03-20 | B.F. Goodrich Company | Polynorbornene laminates and method of making the same |
| US6171714B1 (en) | 1996-04-18 | 2001-01-09 | Gould Electronics Inc. | Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
| JP5032430B2 (ja) * | 2008-09-26 | 2012-09-26 | 株式会社東芝 | 磁気抵抗効果素子の製造方法、磁気抵抗効果素子、磁気ヘッドアセンブリ及び磁気記録再生装置 |
| JP5460375B2 (ja) * | 2010-02-22 | 2014-04-02 | 株式会社東芝 | 磁気抵抗効果素子の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2482178A (en) * | 1944-02-29 | 1949-09-20 | Western Electric Co | Composite structure for forming a seal with glass |
| US2988630A (en) * | 1957-09-06 | 1961-06-13 | Ici Ltd | Method of inert-gas metal arc-welding |
| US2966427A (en) * | 1958-11-07 | 1960-12-27 | Union Carbide Corp | Gas plating of alloys |
| US3206325A (en) * | 1961-09-14 | 1965-09-14 | Alloyd Corp | Process for producing magnetic product |
| US3294654A (en) * | 1965-07-28 | 1966-12-27 | Ethyl Corp | Metal plating process |
-
1965
- 1965-04-01 US US444849A patent/US3360349A/en not_active Expired - Lifetime
-
1966
- 1966-03-23 GB GB12837/66A patent/GB1095080A/en not_active Expired
- 1966-03-24 BE BE678387A patent/BE678387A/xx unknown
- 1966-03-26 DE DE19661521006 patent/DE1521006B2/de not_active Withdrawn
- 1966-03-31 CH CH470566A patent/CH468475A/de unknown
- 1966-04-01 NL NL6604397A patent/NL6604397A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BE678387A (enrdf_load_stackoverflow) | 1966-09-01 |
| US3360349A (en) | 1967-12-26 |
| NL6604397A (enrdf_load_stackoverflow) | 1966-10-03 |
| GB1095080A (en) | 1967-12-13 |
| DE1521006A1 (de) | 1970-08-20 |
| CH468475A (de) | 1969-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2810523C2 (de) | Verfahren zur Herstellung eines Basismaterials für gedruckte Schaltkreise | |
| DE4343946C2 (de) | Galvanisches Kupferbad und Verfahren zur galvanischen Abscheidung von Kupfer | |
| DE69408189T2 (de) | Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung | |
| DE3687250T2 (de) | Kupfer-chrom-polyimid-verbundwerkstoffe. | |
| US3898369A (en) | Metal coated heat-recoverable articles | |
| DE1521006B2 (de) | Verfahren zur vorbehandlung von nichtleitenden unterlagen fuer das galvanische aufbringen von guthaftenden kupfer schichten fuer elektrische schaltungen | |
| DE69005214T2 (de) | Polyimidsubstrat mit texturierter Oberfläche und Metallbeschichtung solch eines Substrates. | |
| DE4433097A1 (de) | Verfahren zum Herstellen einer lichtabsorbierenden Schicht einer Solarzelle | |
| DE2160821C3 (de) | Verfahren zur Abscheidung von Kupferschichten auf Formkörpern aus Polyimiden | |
| DE3029171A1 (de) | Verfahren zur herstellung von poroesen metallfilmen | |
| DE2826630A1 (de) | Verfahren zur verbesserung der korrosionseigenschaften von mit chrom plattierten gegenstaenden aus aluminium und aluminiumlegierungen | |
| DE69220566T2 (de) | Verfahren zur bildung einer beschichtung mittels aufdampfen | |
| DE3637447C2 (enrdf_load_stackoverflow) | ||
| JPS6179799A (ja) | クロムメッキ方法 | |
| DE4140171A1 (de) | Verfahren zur oberflaechenbehandlung von kupferfolien fuer leiterplatten, und kupferfolie fuer leiterplatten | |
| DE3708869A1 (de) | Verfahren zur herstellung eines schutzueberzuges auf einem werkstueck aus titan oder einer titanlegierung | |
| DE2536985B2 (de) | Elektrischer kontakt, insbesondere steckkontakt und verfahren zu dessen herstellung | |
| US3268422A (en) | Electroplating bath containing aluminum and manganese-bearing materials and method of forming aluminummanganese alloy coatings on metallic bases | |
| DE1521006C (de) | Verfahren zur Vorbehandlung von nicht leitenden Unterlagen fur das galvanische Aufbringen von guthaftenden Kupferschich ten fur elektrische Schaltungen | |
| EP1533401A1 (de) | Galvanisches Beschichten von Substraten gefolgt von einem Diffusionsschritt | |
| DE2114543B2 (de) | Verfahren zur herstellung einer elektrode zur verwendung in elektrolytischen verfahren | |
| DE2905133C2 (de) | Verwendung einer Palladiumlegierung zur Vorbehandlung keramischer Teile für eine galvanische Metallisierung | |
| EP1484433B1 (de) | Zinkbeschichtung von elektrisch nicht leitenden Oberflächen | |
| DE2166977C3 (de) | Verfahren zum Aufdampfen von Kupferüberzügen auf geformte Körper aus Kunststoff | |
| EP0328128A1 (de) | Verfahren zur Haftvermittlung zwischen Metallwerkstoffen und galvanischen Aluminiumschichten und hierbei eingesetzte nichtwässrige Elektrolyte |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E77 | Valid patent as to the heymanns-index 1977 | ||
| EGA | New person/name/address of the applicant | ||
| EHJ | Ceased/non-payment of the annual fee |