US3360349A - Copper layer bonded to a non-conductive layer by means of a copper alloy - Google Patents

Copper layer bonded to a non-conductive layer by means of a copper alloy Download PDF

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Publication number
US3360349A
US3360349A US444849A US44484965A US3360349A US 3360349 A US3360349 A US 3360349A US 444849 A US444849 A US 444849A US 44484965 A US44484965 A US 44484965A US 3360349 A US3360349 A US 3360349A
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US
United States
Prior art keywords
copper
electrodeposited
aluminum
copper alloy
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US444849A
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English (en)
Inventor
Alfred A Adomines
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Sperry Rand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sperry Rand Corp filed Critical Sperry Rand Corp
Priority to US444849A priority Critical patent/US3360349A/en
Priority to GB12837/66A priority patent/GB1095080A/en
Priority to FR54834A priority patent/FR1471982A/fr
Priority to BE678387A priority patent/BE678387A/xx
Priority to DE19661521006 priority patent/DE1521006B2/de
Priority to CH470566A priority patent/CH468475A/de
Priority to NL6604397A priority patent/NL6604397A/xx
Application granted granted Critical
Publication of US3360349A publication Critical patent/US3360349A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/928—Magnetic property
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/938—Vapor deposition or gas diffusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Definitions

  • this invention relates to structures containing electrodeposited copper and an inert, non-conductive substrate and to improving the adhesion of electrodeposited copper to selected substrate materials, particularly inert, non-conductive substrate materials, such as glass, alumina, ceramic materials, organic plastic materials, e.g., Mylar film, and the like. This is accomplished by using a particular alloy containing copper.
  • Another object of this invention is to provide structures containing electrodeposited copper which exhibits excellent and improved adhesion to the underlying material.
  • Still another object of this invention is to provide an improved method of preparing structures containing electrodeposited copper.
  • an improved structure containing electrodeposited copper is provided by a structure made up of an inert, non-conductive substrate, vapor deposited material chemically similar to copper deposited thereon and an electrodeposited copper deposited upon said vapor deposited material.
  • vapor deposited materials which are useful for improving and increasing the adhesion of electrodeposited copper include substantially all materials chemically similar to copper and capable of volatilization and vapor deposition upon the inert, non-conductive substrate materials.
  • vapor-deposited materials useful in accordance with the practice of this invention for improving the adhesion of electrodeposited copper include the various copper alloys, particularly the bronzes, such as the aluminum bronzes and chromium bronzes. Copper 3,360,349 Patented Dec. 26, 1967 alloys capable of volatilization and vapor deposition in accordance with the practice of this invention and analyzing 20-95% copper and higher and 805% other alloying metal or metals, such as aluminum and chromium, have been found to be suitable.
  • a tungsten boat charged with a mixture comprising about -80% by Weight copper and 20-25% by weight aluminum was placed in a vacuum system.
  • a substrate material such as a glass plate or slide, the glass plate or slide being separated from the tungsten boat by a shutter.
  • the system was then evacuated to a low pressure, about l 10 mm. Hg.
  • the copper and aluminum in the tungsten boat were slowly heated to the melting point and the glass substrate material was heated by suitable means to a temperature of about 300 C.
  • the shutter between the tungsten boat and the glass substrate material was removed for a desired period of time with the result that there was deposited by vapor deposition onto the glass substrate material a layer of aluminum-copper metallic material of about 4,000 A. thickness.
  • This aluminum-copper material thus vapor deposited on the heated glass substrate analyzed 92% by weight copper and 8% by weight aluminum,
  • the shutter was closed and the system shut down and permitted to cool under vacuum for approximately 4 hours or to about room temperature.
  • the resulting copper-aluminum coated glass substrate material was removed from the system and a layer of copper was electroplated thereon, such as a layer of copper of about 1 mil in thickness.
  • the electrodeposited copper exhibited superior and excellent adhesion to the aluminum-copper coated glass substrate material.
  • the electrodeposited copper layer could not be removed or peeled by the conventional test methods, such as peeling with Scotch tape or scraping with a razor or scribing and prying at the edges with a razor.
  • the layers thus deposited on the glass substrate material i.e., the copper-aluminum vapor de posited layer and the electrodeposited copper layer, were easily etched by conventional copper etchant solutions, such as ferric chloride copper etching solution, and this combination of layers showed no obvious difference from pure copper except for the superior and excellent adhesion of the electrodeposited copper to the underlying substrate material.
  • a vapor deposited film such as aluminum bronze or chromium bronze or other metallic materials chemically similar to copper
  • the electrodeposited copper film is extremely bright and suitable for electrodeposition thereon of an additional metallic film, such as a magnetic nickel-iron film. Therefore, the practice of this invention is particularly suitable for the preparation of a firm, well-adhering copper base layer for integrated circuit mountings and as a sub-layer in an electroplated memory structure.
  • a structure comprising an inert, non-conductive substrate, copper alloy material analyzing -95% copper and 805% of a metal selected from the group consisting of aluminum and chromium deposited on the surface of said substrate and copper electrodeposited on said copper alloy material.
  • a structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material analyzing 5-80% aluminum and 95-20% copper.
  • a structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material analyzing 580% chromium and 95-20% copper.
  • a structure comprising an inert, non-conductive substrate, copper alloy material deposited on the surface of said substrate and copper electrodeposited on said copper alloy material, said copper alloy material having the composition 92% by weight copper and 8% by weight aluminum and a thickness of approximately 4,000 A. and said electrodeposited copper having a thickness of about 1 mil.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
US444849A 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy Expired - Lifetime US3360349A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US444849A US3360349A (en) 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy
GB12837/66A GB1095080A (en) 1965-04-01 1966-03-23 Preparation of a non-conductive material for electroplating with copper
FR54834A FR1471982A (fr) 1965-04-01 1966-03-24 Procédé de préparation d'un substrat de matière non conductrice pour recevoir une couche de cuivre déposée par électrolyse
BE678387A BE678387A (enrdf_load_stackoverflow) 1965-04-01 1966-03-24
DE19661521006 DE1521006B2 (de) 1965-04-01 1966-03-26 Verfahren zur vorbehandlung von nichtleitenden unterlagen fuer das galvanische aufbringen von guthaftenden kupfer schichten fuer elektrische schaltungen
CH470566A CH468475A (de) 1965-04-01 1966-03-31 Verfahren zur Vorbereitung einer Unterlage aus einem nichtleitenden Material für die Aufnahme von elektrolytisch aufgebrachtem Kupfer
NL6604397A NL6604397A (enrdf_load_stackoverflow) 1965-04-01 1966-04-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US444849A US3360349A (en) 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy

Publications (1)

Publication Number Publication Date
US3360349A true US3360349A (en) 1967-12-26

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US444849A Expired - Lifetime US3360349A (en) 1965-04-01 1965-04-01 Copper layer bonded to a non-conductive layer by means of a copper alloy

Country Status (6)

Country Link
US (1) US3360349A (enrdf_load_stackoverflow)
BE (1) BE678387A (enrdf_load_stackoverflow)
CH (1) CH468475A (enrdf_load_stackoverflow)
DE (1) DE1521006B2 (enrdf_load_stackoverflow)
GB (1) GB1095080A (enrdf_load_stackoverflow)
NL (1) NL6604397A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512946A (en) * 1967-04-17 1970-05-19 Lash Mfg Inc Composite material for shielding electrical and magnetic energy
DE2001515A1 (de) * 1969-01-15 1970-08-27 Ibm Verbesserte Metallisierung auf einem Monolithen
US3852148A (en) * 1970-10-07 1974-12-03 Olin Corp Architectural products formed of glass or ceramic-to-metal composites
US4500383A (en) * 1982-02-18 1985-02-19 Kabushiki Kaisha Meidensha Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
US4863808A (en) * 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same
CH675323A5 (enrdf_load_stackoverflow) * 1987-12-24 1990-09-14 Contraves Ag
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
US20100091414A1 (en) * 2008-09-26 2010-04-15 Kabushiki Kaisha Toshiba Method for manufacturing a magneto-resistance effect element and magnetic recording and reproducing apparatus
US20110205669A1 (en) * 2010-02-22 2011-08-25 Kabushiki Kaisha Toshiba Method for manufacturing magneto-resistance effect element, magnetic head assembly, and magnetic recording and reproducing apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482178A (en) * 1944-02-29 1949-09-20 Western Electric Co Composite structure for forming a seal with glass
US2966427A (en) * 1958-11-07 1960-12-27 Union Carbide Corp Gas plating of alloys
US2988630A (en) * 1957-09-06 1961-06-13 Ici Ltd Method of inert-gas metal arc-welding
US3206325A (en) * 1961-09-14 1965-09-14 Alloyd Corp Process for producing magnetic product
US3294654A (en) * 1965-07-28 1966-12-27 Ethyl Corp Metal plating process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482178A (en) * 1944-02-29 1949-09-20 Western Electric Co Composite structure for forming a seal with glass
US2988630A (en) * 1957-09-06 1961-06-13 Ici Ltd Method of inert-gas metal arc-welding
US2966427A (en) * 1958-11-07 1960-12-27 Union Carbide Corp Gas plating of alloys
US3206325A (en) * 1961-09-14 1965-09-14 Alloyd Corp Process for producing magnetic product
US3294654A (en) * 1965-07-28 1966-12-27 Ethyl Corp Metal plating process

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512946A (en) * 1967-04-17 1970-05-19 Lash Mfg Inc Composite material for shielding electrical and magnetic energy
DE2001515A1 (de) * 1969-01-15 1970-08-27 Ibm Verbesserte Metallisierung auf einem Monolithen
US3852148A (en) * 1970-10-07 1974-12-03 Olin Corp Architectural products formed of glass or ceramic-to-metal composites
US4500383A (en) * 1982-02-18 1985-02-19 Kabushiki Kaisha Meidensha Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
US4863808A (en) * 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
CH675323A5 (enrdf_load_stackoverflow) * 1987-12-24 1990-09-14 Contraves Ag
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
US20100091414A1 (en) * 2008-09-26 2010-04-15 Kabushiki Kaisha Toshiba Method for manufacturing a magneto-resistance effect element and magnetic recording and reproducing apparatus
US20110205669A1 (en) * 2010-02-22 2011-08-25 Kabushiki Kaisha Toshiba Method for manufacturing magneto-resistance effect element, magnetic head assembly, and magnetic recording and reproducing apparatus

Also Published As

Publication number Publication date
DE1521006B2 (de) 1971-03-18
GB1095080A (en) 1967-12-13
DE1521006A1 (de) 1970-08-20
BE678387A (enrdf_load_stackoverflow) 1966-09-01
CH468475A (de) 1969-02-15
NL6604397A (enrdf_load_stackoverflow) 1966-10-03

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