DE1446221A1 - Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen - Google Patents

Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen

Info

Publication number
DE1446221A1
DE1446221A1 DE19511446221 DE1446221A DE1446221A1 DE 1446221 A1 DE1446221 A1 DE 1446221A1 DE 19511446221 DE19511446221 DE 19511446221 DE 1446221 A DE1446221 A DE 1446221A DE 1446221 A1 DE1446221 A1 DE 1446221A1
Authority
DE
Germany
Prior art keywords
semiconductors
metals
wetting
soldered
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19511446221
Other languages
German (de)
English (en)
Other versions
DE1446221C3 (https=
DE1446221B2 (https=
Inventor
Horst Kutschera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Patentverwaltung GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH filed Critical Philips Patentverwaltung GmbH
Priority to DE19511446221 priority Critical patent/DE1446221A1/de
Priority to US87063A priority patent/US3128538A/en
Priority to GB8483/61A priority patent/GB958524A/en
Priority to FR855125A priority patent/FR1288290A/fr
Publication of DE1446221A1 publication Critical patent/DE1446221A1/de
Publication of DE1446221B2 publication Critical patent/DE1446221B2/de
Application granted granted Critical
Publication of DE1446221C3 publication Critical patent/DE1446221C3/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Amplifiers (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Exhaust Gas After Treatment (AREA)
DE19511446221 1951-01-28 1951-01-28 Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen Granted DE1446221A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19511446221 DE1446221A1 (de) 1951-01-28 1951-01-28 Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen
US87063A US3128538A (en) 1951-01-28 1961-02-06 Semiconductor-metal bonding method
GB8483/61A GB958524A (en) 1951-01-28 1961-03-08 Improvements in or relating to methods of wetting bodies and securing bodies together
FR855125A FR1288290A (fr) 1951-01-28 1961-03-09 Procédé d'humectation de semi-conducteurs et de métaux par des semi-conducteurs et des métaux

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19511446221 DE1446221A1 (de) 1951-01-28 1951-01-28 Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen
DEP0024590 1960-03-11

Publications (3)

Publication Number Publication Date
DE1446221A1 true DE1446221A1 (de) 1969-09-25
DE1446221B2 DE1446221B2 (https=) 1973-10-11
DE1446221C3 DE1446221C3 (https=) 1974-05-09

Family

ID=25752091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19511446221 Granted DE1446221A1 (de) 1951-01-28 1951-01-28 Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen

Country Status (3)

Country Link
US (1) US3128538A (https=)
DE (1) DE1446221A1 (https=)
GB (1) GB958524A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE630858A (https=) * 1962-04-10 1900-01-01
US3295196A (en) * 1964-01-30 1967-01-03 Zaeschmar Guenther Method for attaching indium arsenide semiconductor to electrical leads
US3678569A (en) * 1970-07-15 1972-07-25 Globe Union Inc Method for forming ohmic contacts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB483156A (en) * 1936-10-16 1938-04-13 Percy Warren Noble Improvements in and relating to the art of soldering
US2555001A (en) * 1947-02-04 1951-05-29 Bell Telephone Labor Inc Bonded article and method of bonding
US2964839A (en) * 1954-12-14 1960-12-20 Corning Glass Works Flux free bonded article and method
GB785467A (en) * 1954-12-23 1957-10-30 Gen Electric Co Ltd Improvements in or relating to the manufacture of semi-conductor devices
US3070466A (en) * 1959-04-30 1962-12-25 Ibm Diffusion in semiconductor material

Also Published As

Publication number Publication date
GB958524A (en) 1964-05-21
US3128538A (en) 1964-04-14
DE1446221C3 (https=) 1974-05-09
DE1446221B2 (https=) 1973-10-11

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971
C3 Grant after two publication steps (3rd publication)