GB958524A - Improvements in or relating to methods of wetting bodies and securing bodies together - Google Patents

Improvements in or relating to methods of wetting bodies and securing bodies together

Info

Publication number
GB958524A
GB958524A GB8483/61A GB848361A GB958524A GB 958524 A GB958524 A GB 958524A GB 8483/61 A GB8483/61 A GB 8483/61A GB 848361 A GB848361 A GB 848361A GB 958524 A GB958524 A GB 958524A
Authority
GB
United Kingdom
Prior art keywords
germanium
bodies
conductor
semi
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8483/61A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB958524A publication Critical patent/GB958524A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Amplifiers (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Exhaust Gas After Treatment (AREA)
GB8483/61A 1951-01-28 1961-03-08 Improvements in or relating to methods of wetting bodies and securing bodies together Expired GB958524A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19511446221 DE1446221A1 (de) 1951-01-28 1951-01-28 Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen
DEP0024590 1960-03-11

Publications (1)

Publication Number Publication Date
GB958524A true GB958524A (en) 1964-05-21

Family

ID=25752091

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8483/61A Expired GB958524A (en) 1951-01-28 1961-03-08 Improvements in or relating to methods of wetting bodies and securing bodies together

Country Status (3)

Country Link
US (1) US3128538A (https=)
DE (1) DE1446221A1 (https=)
GB (1) GB958524A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE630858A (https=) * 1962-04-10 1900-01-01
US3295196A (en) * 1964-01-30 1967-01-03 Zaeschmar Guenther Method for attaching indium arsenide semiconductor to electrical leads
US3678569A (en) * 1970-07-15 1972-07-25 Globe Union Inc Method for forming ohmic contacts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB483156A (en) * 1936-10-16 1938-04-13 Percy Warren Noble Improvements in and relating to the art of soldering
US2555001A (en) * 1947-02-04 1951-05-29 Bell Telephone Labor Inc Bonded article and method of bonding
US2964839A (en) * 1954-12-14 1960-12-20 Corning Glass Works Flux free bonded article and method
GB785467A (en) * 1954-12-23 1957-10-30 Gen Electric Co Ltd Improvements in or relating to the manufacture of semi-conductor devices
US3070466A (en) * 1959-04-30 1962-12-25 Ibm Diffusion in semiconductor material

Also Published As

Publication number Publication date
DE1446221A1 (de) 1969-09-25
US3128538A (en) 1964-04-14
DE1446221C3 (https=) 1974-05-09
DE1446221B2 (https=) 1973-10-11

Similar Documents

Publication Publication Date Title
GB926163A (en) Improvements in or relating to leading-in members
GB807995A (en) Improvements in or relating to the production of semiconductor bodies
GB905553A (en) Improvements in or relating to the production of semi-conductor devices
GB958524A (en) Improvements in or relating to methods of wetting bodies and securing bodies together
GB1027525A (https=)
GB817918A (en) Improvements in or relating to methods of manufacturing radiation-sensitive sinteredbodies containing cadmium sulphide
GB996174A (en) Improvements in and relating to semi-conductor thermo-electric devices
GB841576A (en) Process for manufacture of sintered bodies
GB625371A (en) Improvements in and relating to ceramic seals and method of making same
GB962228A (en) Process for the production of alkali metal borohydrides
GB865592A (en) Improvements in or relating to methods of joining graphite to graphite and graphite to metal surfaces
GB809693A (en) Improvements in or relating to the production of metals
GB727460A (en) A method of making electrical and/or mechanical connections
GB636841A (en) Improvements in and relating to ceramic seals
GB916921A (en) Improvements in or relating to electrical contact members
GB622512A (en) Improvements relating to electric accumulators
GB919373A (en) Improvements in or relating to refractory bodies
GB906551A (en) Improvements in and relating to thermoelements
GB912175A (en) Improvements in and relating to thermoelement positive electrodes
GB841884A (en) The production of granules of red lead and/or litharge
GB749056A (en) Improvements in or relating to the chromium-diffusion treatment of metals
GB981683A (en) Improvements in or relating to methods of manufacturing semiconductor devices
GB927611A (en) Improvements in or relating to methods of forming an adherent layer on a sintered ceramic body
GB841616A (en) Improvements in or relating to magnetic materials
GB648186A (en) Improvements relating to germanium rectifiers