DE131265T1 - Mehrschichtige leitende schienen hoher kapazitaet. - Google Patents

Mehrschichtige leitende schienen hoher kapazitaet.

Info

Publication number
DE131265T1
DE131265T1 DE198484107859T DE84107859T DE131265T1 DE 131265 T1 DE131265 T1 DE 131265T1 DE 198484107859 T DE198484107859 T DE 198484107859T DE 84107859 T DE84107859 T DE 84107859T DE 131265 T1 DE131265 T1 DE 131265T1
Authority
DE
Germany
Prior art keywords
conductive
elements
solder
capacitive element
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE198484107859T
Other languages
German (de)
English (en)
Inventor
Giorgio I-20090 Segrate Tosti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MECONDOR SpA MAILAND/MILANO IT
Original Assignee
MECONDOR SpA MAILAND/MILANO IT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MECONDOR SpA MAILAND/MILANO IT filed Critical MECONDOR SpA MAILAND/MILANO IT
Publication of DE131265T1 publication Critical patent/DE131265T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00—Installations of bus-bars
    • H02G5/005—Laminated bus-bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
    • Y10T29/49201—Assembling elongated conductors, e.g., splicing, etc. with overlapping orienting

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Coating With Molten Metal (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Linear Motors (AREA)
DE198484107859T 1983-07-06 1984-07-05 Mehrschichtige leitende schienen hoher kapazitaet. Pending DE131265T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT21954/83A IT1194301B (it) 1983-07-06 1983-07-06 Metodo per la fabbricazioni ad alta capacita' con connessioni elettriche ottenute per la saldatura,e relative barre prodotte secondo tale metodo

Publications (1)

Publication Number Publication Date
DE131265T1 true DE131265T1 (de) 1985-08-14

Family

ID=11189344

Family Applications (2)

Application Number Title Priority Date Filing Date
DE198484107859T Pending DE131265T1 (de) 1983-07-06 1984-07-05 Mehrschichtige leitende schienen hoher kapazitaet.
DE8484107859T Expired - Fee Related DE3482227D1 (de) 1983-07-06 1984-07-05 Mehrschichtige leitende schienen hoher kapazitaet.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8484107859T Expired - Fee Related DE3482227D1 (de) 1983-07-06 1984-07-05 Mehrschichtige leitende schienen hoher kapazitaet.

Country Status (6)

Country Link
US (1) US4584768A (enExample)
EP (1) EP0131265B1 (enExample)
JP (1) JPS6037610A (enExample)
AT (1) ATE52641T1 (enExample)
DE (2) DE131265T1 (enExample)
IT (1) IT1194301B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005044392A1 (de) * 2005-09-16 2007-03-29 Siemens Ag Piezoaktor mit verbesserter Verbindung zwischen Aktorkörper und Kontaktstift

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166867A (en) * 1985-12-31 1992-11-24 Fujitsu Limited Bus bar for a circuit board
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors
US6498546B1 (en) * 2000-08-25 2002-12-24 James Leych Lau Utilization of proximity effect in ripple noise filtering
KR100731293B1 (ko) * 2006-02-24 2007-06-27 경신공업 주식회사 버스 바의 전기접속부 제조방법 및 제조장치
ATE521118T1 (de) * 2007-02-16 2011-09-15 World Properties Inc Laminierte sammelschienen und verfahren zu ihrer herstellung
JP4905254B2 (ja) * 2007-05-25 2012-03-28 トヨタ自動車株式会社 コンデンサ一体バスバーの製造方法
JP2009076320A (ja) * 2007-09-20 2009-04-09 Yaskawa Electric Corp 積層バスバー回路板の製造装置および製造方法、これによって製造されるバスバー、電力変換装置
US20100239899A1 (en) * 2009-03-23 2010-09-23 Joe Brown Gauntlet motive battery
US9979173B2 (en) * 2011-04-29 2018-05-22 Ge Energy Power Conversion Technology Limited Bus bar assembly and method of manufacturing same
DE102016206459B3 (de) * 2016-04-18 2017-10-05 Continental Automotive Gmbh Kombination, umfassend ein Gehäuse und einen Flansch, und Anordnung
FR3065575B1 (fr) * 2017-04-20 2020-02-21 Auxel Fabrication d'un dispositif a plaques conductrices
JP6618504B2 (ja) * 2017-04-28 2019-12-11 矢崎総業株式会社 バスバー及びバスバーの製造方法
US10850623B2 (en) 2017-10-30 2020-12-01 Sf Motors, Inc. Stacked electric vehicle inverter cells
US10790758B2 (en) 2018-03-08 2020-09-29 Chongqing Jinkang New Energy Vehicle Co., Ltd. Power converter for electric vehicle drive systems
US10756649B2 (en) 2018-03-23 2020-08-25 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
US10779445B2 (en) 2018-03-23 2020-09-15 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
US10594230B2 (en) 2018-03-23 2020-03-17 Sf Motors, Inc. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
US10778117B2 (en) 2018-04-17 2020-09-15 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module of an electric vehicle
US10772242B2 (en) 2018-04-17 2020-09-08 Chongqing Jinkang New Energy Vehicle Co., Ltd. Inverter module of an electric vehicle
US10600577B2 (en) 2018-04-26 2020-03-24 Sf Motors, Inc. Electric vehicle inverter module capacitors
US10608423B2 (en) * 2018-04-26 2020-03-31 Sf Motors, Inc. Electric vehicle inverter module laminated bus bar
US10660242B2 (en) 2018-04-26 2020-05-19 Chongqing Jinkang New Energy Vehicle Co., Ltd. Electric vehicle inverter module heat sink
US10600578B2 (en) 2018-04-26 2020-03-24 Sf Motors, Inc. Electric vehicle inverter module capacitors
US10998706B2 (en) * 2019-10-08 2021-05-04 Hamilton Sundstrand Corporation Laminated bus bars
US11832390B2 (en) 2022-03-07 2023-11-28 Rolls-Royce Corporation Multilayer copper bus bars with soldered through hole components
US11876364B2 (en) 2022-03-07 2024-01-16 Rolls-Royce Corporation Multilayer electronic components with soldered through holes

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021451B2 (ja) * 1977-10-08 1985-05-28 日本メクトロン株式会社 コンデンサ内蔵型積層母線
US4236046A (en) * 1978-10-10 1980-11-25 Rogers Corporation High capacitance bus bar
JPS5566335U (enExample) * 1978-10-31 1980-05-07
JPS55111328U (enExample) * 1979-01-29 1980-08-05
JPS55160417A (en) * 1979-05-31 1980-12-13 Nippon Mektron Kk Capacitor internally containing laminate bus and method of fabricating same
US4236038A (en) * 1979-07-19 1980-11-25 Rogers Corporation High capacitance multilayer bus bar and method of manufacture thereof
US4420653A (en) * 1980-05-29 1983-12-13 Rogers Corporation High capacitance bus bar and method of manufacture thereof
US4381423A (en) * 1981-03-31 1983-04-26 Rogers Corporation High capacitance bus bar manufacturing technique
US4399321A (en) * 1981-03-31 1983-08-16 Rogers Corporation High capacitance bus bar including multilayer ceramic capacitors
US4440972A (en) * 1981-03-31 1984-04-03 Rogers Corporation Miniaturized bus bar with capacitors and method of making same
US4394532A (en) * 1981-03-31 1983-07-19 Rogers Corporation Multilayer current distribution systems and methods of fabrication thereof
US4436953A (en) * 1981-03-31 1984-03-13 Rogers Corporation Bus bar assembly with discrete capacitor elements
US4430522A (en) * 1982-07-16 1984-02-07 Eldre Components, Inc. Laminated bus bar with capacitors and method of making same
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005044392A1 (de) * 2005-09-16 2007-03-29 Siemens Ag Piezoaktor mit verbesserter Verbindung zwischen Aktorkörper und Kontaktstift

Also Published As

Publication number Publication date
IT8321954A1 (it) 1985-01-06
DE3482227D1 (de) 1990-06-13
EP0131265B1 (en) 1990-05-09
IT8321954A0 (it) 1983-07-06
JPS6037610A (ja) 1985-02-27
ATE52641T1 (de) 1990-05-15
EP0131265A3 (en) 1986-08-20
JPH0572041B2 (enExample) 1993-10-08
IT1194301B (it) 1988-09-14
EP0131265A2 (en) 1985-01-16
US4584768A (en) 1986-04-29

Similar Documents

Publication Publication Date Title
DE131265T1 (de) Mehrschichtige leitende schienen hoher kapazitaet.
DE3787366T2 (de) Keramische/organische mehrschichtenanschlussplatte.
DE69218319T2 (de) Mehrschichtige Leiterplatte aus Polyimid und Verfahren zur Herstellung
DE69120198T2 (de) Mehrschichtige, gedruckte Leiterplatte und Verfahren zu ihrer Herstellung
DE69428181T2 (de) Vorrichtung mit Chipgehäuse und Verfahren zu Ihrer Herstellung
DE3414961C2 (enExample)
DE1640457C2 (enExample)
DE2247902A1 (de) Gedruckte schaltungsplatte und verfahren zu deren herstellung
DE3221199A1 (de) Halbleiteranordnung des isolierten typs
DE2345149A1 (de) Elektronisches hybrid-bauteil mit halbleiter-chips
EP2524394A2 (de) Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil
EP1841299A2 (de) Verbindungseinrichtung für elektronishche Bauelemente
DE2536316A1 (de) Elektrische schaltungsanordnung in kompaktbauweise
DE3335848C2 (enExample)
EP0450122B1 (de) Kondensatorbatterie mit niederinduktiver Verschaltung
DE3243689C2 (enExample)
DE1915501C3 (de) Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
DE102004059389B4 (de) Halbleiterbauelement mit Ausgleichsmetallisierung
DE3018846C2 (enExample)
EP0530656B1 (de) Gedruckte Schaltung mit oberflächen montierter Steckerleiste
EP0278484A2 (de) Verfahren zur Herstellung eines Digitalisiertabletts
EP0776041A2 (de) Leistungs-Halbleitermodul
DE1964652A1 (de) Verfahren zur Verbindung von dicht nebeneinanderliegenden Leitungen
DE3035717C2 (de) Verfahren zur serienmäßigen Herstellung von Folienwiderständen oder Netzwerken von Folienwiderständen
DE10121969C1 (de) Schaltungsanordnung in Druckkontaktierung und Verfahren zu seiner Herstellung