DE1297234B - Verfahren zur Herstellung des Halbleiterelementes eines stossspannungsfesten Halbleitergleichrichters - Google Patents
Verfahren zur Herstellung des Halbleiterelementes eines stossspannungsfesten HalbleitergleichrichtersInfo
- Publication number
- DE1297234B DE1297234B DEA50455A DEA0050455A DE1297234B DE 1297234 B DE1297234 B DE 1297234B DE A50455 A DEA50455 A DE A50455A DE A0050455 A DEA0050455 A DE A0050455A DE 1297234 B DE1297234 B DE 1297234B
- Authority
- DE
- Germany
- Prior art keywords
- zone
- semiconductor
- atoms
- doping
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 10
- 230000015556 catabolic process Effects 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 8
- 230000005684 electric field Effects 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 229910001245 Sb alloy Inorganic materials 0.000 claims description 2
- KAPYVWKEUSXLKC-UHFFFAOYSA-N [Sb].[Au] Chemical compound [Sb].[Au] KAPYVWKEUSXLKC-UHFFFAOYSA-N 0.000 claims description 2
- 239000002140 antimony alloy Substances 0.000 claims description 2
- 238000002604 ultrasonography Methods 0.000 claims description 2
- 239000002019 doping agent Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 230000000903 blocking effect Effects 0.000 description 6
- 238000005275 alloying Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R19/00—Wheel guards; Radiator guards, e.g. grilles; Obstruction removers; Fittings damping bouncing force in collisions
- B60R19/02—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects
- B60R19/04—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects formed from more than one section in a side-by-side arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thyristors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Body Structure For Vehicles (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1252565A CH426020A (de) | 1965-09-08 | 1965-09-08 | Verfahren zur Herstellung des Halbleiterelementes eines stossspannungsfesten Halbleiterventils, sowie ein mit Hilfe dieses Verfahrens hergestelltes Halbleiterelement |
| US68467367A | 1967-11-21 | 1967-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1297234B true DE1297234B (de) | 1969-06-12 |
Family
ID=25710429
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEA50455A Withdrawn DE1297234B (de) | 1965-09-08 | 1965-10-11 | Verfahren zur Herstellung des Halbleiterelementes eines stossspannungsfesten Halbleitergleichrichters |
| DE6606125U Expired DE6606125U (de) | 1965-09-08 | 1965-10-11 | Halbleiterelement fuer ein stosspanungsfestes halbleiterventil |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE6606125U Expired DE6606125U (de) | 1965-09-08 | 1965-10-11 | Halbleiterelement fuer ein stosspanungsfestes halbleiterventil |
Country Status (7)
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3628107A (en) * | 1969-05-05 | 1971-12-14 | Gen Electric | Passivated semiconductor device with peripheral protective junction |
| US3675947A (en) * | 1971-02-16 | 1972-07-11 | Leon Blagg | Coupler-aligning trailer hitch |
| DE2310453C3 (de) * | 1973-03-02 | 1981-11-19 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen eines gegen Überspannungen geschützten Halbleiterbauelementes |
| US3912139A (en) * | 1974-01-17 | 1975-10-14 | Jimmy W Bowman | Removable vehicle mounted cycle carrier |
| US4117942A (en) * | 1976-08-24 | 1978-10-03 | Sperry Rand Corporation | Means for adjusting the sideboard |
| JPS5346285A (en) * | 1976-10-08 | 1978-04-25 | Hitachi Ltd | Mesa type high breakdown voltage semiconductor device |
| US4215496A (en) * | 1978-11-13 | 1980-08-05 | Wehr Thomas L | Vehicle bumper |
| US4255757A (en) * | 1978-12-05 | 1981-03-10 | International Rectifier Corporation | High reverse voltage semiconductor device with fast recovery time with central depression |
| EP0144876B1 (de) * | 1983-12-07 | 1988-03-09 | BBC Brown Boveri AG | Halbleiterbauelement |
| EP0230278A3 (de) * | 1986-01-24 | 1989-09-06 | Siemens Aktiengesellschaft | Thyristor mit integrierter Stromversorgung für eine zugeordnete Schaltungseinheit und Verfahren zu seiner Herstellung |
| US4825192A (en) * | 1987-11-24 | 1989-04-25 | Wells Kenneth A | Retractable guard for vehicles |
| US6390525B2 (en) * | 1999-03-22 | 2002-05-21 | Innovative Fabworks | Vehicle extension slide |
| US7222905B2 (en) * | 2003-04-04 | 2007-05-29 | Edward Jaeck | Reconfigurable truck bed or vehicle body |
| USD746215S1 (en) * | 2013-07-19 | 2015-12-29 | Robert N. Leavitt | Vehicle plow mount cover |
| GB2526692A (en) * | 2015-05-07 | 2015-12-02 | Daimler Ag | Method for manufacturing an underrun protection device for a vehicle as well as modular system for a plurality of variance of an underrun protection device |
| US9743543B2 (en) * | 2015-07-29 | 2017-08-22 | International Business Machines Corporation | Electronics rack with integrated anti-tip mechanism |
| US10124656B2 (en) * | 2017-01-16 | 2018-11-13 | Mark Lawson | Pickup truck bed cover |
| US10118472B2 (en) * | 2017-01-16 | 2018-11-06 | Mark Lawson | Pickup truck bed cover |
| KR102681634B1 (ko) * | 2019-09-06 | 2024-07-04 | 현대자동차주식회사 | 가변형 백빔 및 충돌 시 가변형 백빔이 인플레이터에 의해 가변되는 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1018557B (de) * | 1954-08-26 | 1957-10-31 | Philips Nv | Verfahren zur Herstellung von gleichrichtenden Legierungskontakten auf einem Halbleiterkoerper |
| DE1024640B (de) * | 1953-07-22 | 1958-02-20 | Int Standard Electric Corp | Verfahren zur Herstellung von Kristalloden |
| AT201114B (de) * | 1956-04-03 | 1958-12-10 | Philips Nv | Verfahren zur Herstellung von halbleitenden Vorrichtungen |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1326795A (en) * | 1919-12-30 | Cojhbibteb | ||
| US1146355A (en) * | 1914-09-21 | 1915-07-13 | Owen C Fuqua | Safety device for automobiles. |
| US1474929A (en) * | 1922-08-24 | 1923-11-20 | Walter Smith | Attachable bed and carrier for vehicles |
| US1530429A (en) * | 1924-10-03 | 1925-03-17 | Sjolander Gustaf | Combined bumper and jack |
| NL240714A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1958-07-02 | |||
| NL243218A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1958-12-24 | |||
| NL280641A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1961-07-07 |
-
1965
- 1965-09-08 CH CH1252565A patent/CH426020A/de unknown
- 1965-10-11 DE DEA50455A patent/DE1297234B/de not_active Withdrawn
- 1965-10-11 DE DE6606125U patent/DE6606125U/de not_active Expired
-
1966
- 1966-07-28 NL NL6610617A patent/NL6610617A/xx unknown
- 1966-08-25 US US575173A patent/US3449826A/en not_active Expired - Lifetime
- 1966-09-06 GB GB39743/66A patent/GB1140139A/en not_active Expired
- 1966-09-06 BE BE686485D patent/BE686485A/xx unknown
- 1966-09-06 SE SE11991/66A patent/SE326769B/xx unknown
-
1967
- 1967-11-21 US US684673A patent/US3447826A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1024640B (de) * | 1953-07-22 | 1958-02-20 | Int Standard Electric Corp | Verfahren zur Herstellung von Kristalloden |
| DE1018557B (de) * | 1954-08-26 | 1957-10-31 | Philips Nv | Verfahren zur Herstellung von gleichrichtenden Legierungskontakten auf einem Halbleiterkoerper |
| AT201114B (de) * | 1956-04-03 | 1958-12-10 | Philips Nv | Verfahren zur Herstellung von halbleitenden Vorrichtungen |
Also Published As
| Publication number | Publication date |
|---|---|
| BE686485A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1967-02-15 |
| SE326769B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1970-08-03 |
| DE6606125U (de) | 1970-09-03 |
| US3449826A (en) | 1969-06-17 |
| US3447826A (en) | 1969-06-03 |
| CH426020A (de) | 1966-12-15 |
| GB1140139A (en) | 1969-01-15 |
| NL6610617A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1967-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E77 | Valid patent as to the heymanns-index 1977 | ||
| EHJ | Ceased/non-payment of the annual fee |