DE1206087B - Verfahren zum Herstellen eines Halbleiter-bauelements mit einem scheibenfoermigen Halbleiterkoerper - Google Patents

Verfahren zum Herstellen eines Halbleiter-bauelements mit einem scheibenfoermigen Halbleiterkoerper

Info

Publication number
DE1206087B
DE1206087B DER30636A DER0030636A DE1206087B DE 1206087 B DE1206087 B DE 1206087B DE R30636 A DER30636 A DE R30636A DE R0030636 A DER0030636 A DE R0030636A DE 1206087 B DE1206087 B DE 1206087B
Authority
DE
Germany
Prior art keywords
base electrode
electrode
shaped
semiconductor body
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DER30636A
Other languages
German (de)
English (en)
Inventor
Derek Thorne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of DE1206087B publication Critical patent/DE1206087B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
DER30636A 1960-07-20 1961-06-29 Verfahren zum Herstellen eines Halbleiter-bauelements mit einem scheibenfoermigen Halbleiterkoerper Pending DE1206087B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4420560A 1960-07-20 1960-07-20
US449674A US3224069A (en) 1960-07-20 1965-04-01 Method of fabricating semiconductor devices

Publications (1)

Publication Number Publication Date
DE1206087B true DE1206087B (de) 1965-12-02

Family

ID=26721284

Family Applications (1)

Application Number Title Priority Date Filing Date
DER30636A Pending DE1206087B (de) 1960-07-20 1961-06-29 Verfahren zum Herstellen eines Halbleiter-bauelements mit einem scheibenfoermigen Halbleiterkoerper

Country Status (4)

Country Link
US (1) US3224069A (enExample)
DE (1) DE1206087B (enExample)
GB (1) GB977131A (enExample)
NL (1) NL267267A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3355635A (en) * 1964-05-28 1967-11-28 Rca Corp Semiconductor device assemblage having two convex tabs
US3757414A (en) * 1971-03-26 1973-09-11 Honeywell Inc Method for batch fabricating semiconductor devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1082473A (fr) * 1952-08-13 1954-12-29 Elliott Brothers London Ltd Perfectionnements aux dispositifs électriques employant des matières semi-conductrices
GB804696A (en) * 1955-02-03 1958-11-19 Siemens Ag Improvements in or relating to alloy transistors
US2913642A (en) * 1953-05-28 1959-11-17 Rca Corp Method and apparatus for making semi-conductor devices
FR1202029A (fr) * 1957-09-10 1960-01-07 Pye Ltd Perfectionnements aux transistrons

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2857527A (en) * 1955-04-28 1958-10-21 Rca Corp Semiconductor devices including biased p+p or n+n rectifying barriers
US2927222A (en) * 1955-05-27 1960-03-01 Philco Corp Polarizing semiconductive apparatus
US3094764A (en) * 1957-04-03 1963-06-25 Rauland Corp Apparatus for manufacturing semiconductor devices
US3073006A (en) * 1958-09-16 1963-01-15 Westinghouse Electric Corp Method and apparatus for the fabrication of alloyed transistors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1082473A (fr) * 1952-08-13 1954-12-29 Elliott Brothers London Ltd Perfectionnements aux dispositifs électriques employant des matières semi-conductrices
US2913642A (en) * 1953-05-28 1959-11-17 Rca Corp Method and apparatus for making semi-conductor devices
GB804696A (en) * 1955-02-03 1958-11-19 Siemens Ag Improvements in or relating to alloy transistors
FR1202029A (fr) * 1957-09-10 1960-01-07 Pye Ltd Perfectionnements aux transistrons

Also Published As

Publication number Publication date
US3224069A (en) 1965-12-21
NL267267A (enExample)
GB977131A (en) 1964-12-02

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