DE1176758B - Verfahren zum Einlegieren eines pn-UEberganges in einen Halbleiterkoerper - Google Patents

Verfahren zum Einlegieren eines pn-UEberganges in einen Halbleiterkoerper

Info

Publication number
DE1176758B
DE1176758B DEG25115A DEG0025115A DE1176758B DE 1176758 B DE1176758 B DE 1176758B DE G25115 A DEG25115 A DE G25115A DE G0025115 A DEG0025115 A DE G0025115A DE 1176758 B DE1176758 B DE 1176758B
Authority
DE
Germany
Prior art keywords
wire
semiconductor body
melt
alloy
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEG25115A
Other languages
German (de)
English (en)
Inventor
Emrys Gwynne James
James Samuel Miller
John Reeves
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Company PLC
Original Assignee
General Electric Company PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company PLC filed Critical General Electric Company PLC
Publication of DE1176758B publication Critical patent/DE1176758B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
DEG25115A 1957-08-15 1958-08-14 Verfahren zum Einlegieren eines pn-UEberganges in einen Halbleiterkoerper Pending DE1176758B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB25846/57A GB849549A (en) 1957-08-15 1957-08-15 Improvements in or relating to methods of forming p-n junctions in semiconductors

Publications (1)

Publication Number Publication Date
DE1176758B true DE1176758B (de) 1964-08-27

Family

ID=10234293

Family Applications (1)

Application Number Title Priority Date Filing Date
DEG25115A Pending DE1176758B (de) 1957-08-15 1958-08-14 Verfahren zum Einlegieren eines pn-UEberganges in einen Halbleiterkoerper

Country Status (4)

Country Link
DE (1) DE1176758B (enrdf_load_html_response)
FR (1) FR1211516A (enrdf_load_html_response)
GB (1) GB849549A (enrdf_load_html_response)
NL (2) NL230537A (enrdf_load_html_response)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT177475B (de) * 1952-02-07 1954-02-10 Western Electric Co Verfahren zur Herstellung von Silizium-Schaltelementen unsymmetrischer Leitfähigkeit für die Signalumsetzung, insbesondere Gleichrichtung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT177475B (de) * 1952-02-07 1954-02-10 Western Electric Co Verfahren zur Herstellung von Silizium-Schaltelementen unsymmetrischer Leitfähigkeit für die Signalumsetzung, insbesondere Gleichrichtung

Also Published As

Publication number Publication date
GB849549A (en) 1960-09-28
NL107716C (enrdf_load_html_response) 1900-01-01
NL230537A (enrdf_load_html_response) 1900-01-01
FR1211516A (fr) 1960-03-16

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