DE1174930B - Verfahren zum Laeppen der Oberflaechen von mit einem Lochueberzug versehenen Halbleiterkoerpern - Google Patents

Verfahren zum Laeppen der Oberflaechen von mit einem Lochueberzug versehenen Halbleiterkoerpern

Info

Publication number
DE1174930B
DE1174930B DES75519A DES0075519A DE1174930B DE 1174930 B DE1174930 B DE 1174930B DE S75519 A DES75519 A DE S75519A DE S0075519 A DES0075519 A DE S0075519A DE 1174930 B DE1174930 B DE 1174930B
Authority
DE
Germany
Prior art keywords
lapping
semiconductor bodies
bodies provided
hole coating
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES75519A
Other languages
German (de)
English (en)
Inventor
Dipl-Phys Dr-Ing Reimer Emeis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE621964D priority Critical patent/BE621964A/xx
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DES75519A priority patent/DE1174930B/de
Priority to CH770662A priority patent/CH401275A/de
Priority to FR907994A priority patent/FR1378016A/fr
Priority to GB33624/62A priority patent/GB996989A/en
Publication of DE1174930B publication Critical patent/DE1174930B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Ceramic Products (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DES75519A 1961-08-31 1961-08-31 Verfahren zum Laeppen der Oberflaechen von mit einem Lochueberzug versehenen Halbleiterkoerpern Pending DE1174930B (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
BE621964D BE621964A (https=) 1961-08-31
DES75519A DE1174930B (de) 1961-08-31 1961-08-31 Verfahren zum Laeppen der Oberflaechen von mit einem Lochueberzug versehenen Halbleiterkoerpern
CH770662A CH401275A (de) 1961-08-31 1962-06-27 Verfahren zur Oberflächenbehandlung von Halbleiterkörpern
FR907994A FR1378016A (fr) 1961-08-31 1962-08-28 Procédé de traitement des surfaces de corps semi-conducteurs
GB33624/62A GB996989A (en) 1961-08-31 1962-08-31 A process for the surface treatment of a semi-conductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES75519A DE1174930B (de) 1961-08-31 1961-08-31 Verfahren zum Laeppen der Oberflaechen von mit einem Lochueberzug versehenen Halbleiterkoerpern

Publications (1)

Publication Number Publication Date
DE1174930B true DE1174930B (de) 1964-07-30

Family

ID=7505414

Family Applications (1)

Application Number Title Priority Date Filing Date
DES75519A Pending DE1174930B (de) 1961-08-31 1961-08-31 Verfahren zum Laeppen der Oberflaechen von mit einem Lochueberzug versehenen Halbleiterkoerpern

Country Status (4)

Country Link
BE (1) BE621964A (https=)
CH (1) CH401275A (https=)
DE (1) DE1174930B (https=)
GB (1) GB996989A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112435954B (zh) * 2020-11-25 2024-01-26 西安奕斯伟材料科技股份有限公司 一种晶圆载体的处理方法和晶圆载体

Also Published As

Publication number Publication date
CH401275A (de) 1965-10-31
BE621964A (https=)
GB996989A (en) 1965-06-30

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