DE1166938C2 - - Google Patents

Info

Publication number
DE1166938C2
DE1166938C2 DE1960S0069202 DES0069202A DE1166938C2 DE 1166938 C2 DE1166938 C2 DE 1166938C2 DE 1960S0069202 DE1960S0069202 DE 1960S0069202 DE S0069202 A DES0069202 A DE S0069202A DE 1166938 C2 DE1166938 C2 DE 1166938C2
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1960S0069202
Other versions
DE1166938B (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL266513D priority Critical patent/NL266513A/xx
Application filed filed Critical
Priority to DES69202A priority patent/DE1166938B/de
Priority to CH647261A priority patent/CH391111A/de
Priority to US117401A priority patent/US3242018A/en
Priority to FR866499A priority patent/FR1293869A/fr
Priority to GB23567/61A priority patent/GB918889A/en
Publication of DE1166938B publication Critical patent/DE1166938B/de
Application granted granted Critical
Publication of DE1166938C2 publication Critical patent/DE1166938C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/0245—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
DES69202A 1960-07-01 1960-07-01 Verfahren zur Herstellung einer Halbleiteranordnung Granted DE1166938B (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL266513D NL266513A (de) 1960-07-01
DES69202A DE1166938B (de) 1960-07-01 1960-07-01 Verfahren zur Herstellung einer Halbleiteranordnung
CH647261A CH391111A (de) 1960-07-01 1961-06-02 Verfahren zur Herstellung einer Halbleiteranordnung
US117401A US3242018A (en) 1960-07-01 1961-06-15 Semiconductor device and method of producing it
FR866499A FR1293869A (fr) 1960-07-01 1961-06-29 Procédé de fabrication d'un dispositif à semi-conducteur
GB23567/61A GB918889A (en) 1960-07-01 1961-06-29 Improvements in or relating to semi-conductor arrangements and to methods of making such arrangements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES69202A DE1166938B (de) 1960-07-01 1960-07-01 Verfahren zur Herstellung einer Halbleiteranordnung

Publications (2)

Publication Number Publication Date
DE1166938B DE1166938B (de) 1964-04-02
DE1166938C2 true DE1166938C2 (de) 1964-10-08

Family

ID=7500812

Family Applications (1)

Application Number Title Priority Date Filing Date
DES69202A Granted DE1166938B (de) 1960-07-01 1960-07-01 Verfahren zur Herstellung einer Halbleiteranordnung

Country Status (6)

Country Link
US (1) US3242018A (de)
CH (1) CH391111A (de)
DE (1) DE1166938B (de)
FR (1) FR1293869A (de)
GB (1) GB918889A (de)
NL (1) NL266513A (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200490A (en) * 1962-12-07 1965-08-17 Philco Corp Method of forming ohmic bonds to a germanium-coated silicon body with eutectic alloyforming materials
US4357183A (en) * 1980-08-13 1982-11-02 Massachusetts Institute Of Technology Heteroepitaxy of germanium silicon on silicon utilizing alloying control
US4861393A (en) * 1983-10-28 1989-08-29 American Telephone And Telegraph Company, At&T Bell Laboratories Semiconductor heterostructures having Gex Si1-x layers on Si utilizing molecular beam epitaxy
US4728998A (en) * 1984-09-06 1988-03-01 Fairchild Semiconductor Corporation CMOS circuit having a reduced tendency to latch
JPS61241985A (ja) * 1985-04-19 1986-10-28 Eizo Yamaga 赤外線検知装置
US5142641A (en) * 1988-03-23 1992-08-25 Fujitsu Limited CMOS structure for eliminating latch-up of parasitic thyristor
US5140400A (en) * 1989-03-29 1992-08-18 Canon Kabushiki Kaisha Semiconductor device and photoelectric converting apparatus using the same
US5245204A (en) * 1989-03-29 1993-09-14 Canon Kabushiki Kaisha Semiconductor device for use in an improved image pickup apparatus
US5095358A (en) * 1990-04-18 1992-03-10 National Semiconductor Corporation Application of electronic properties of germanium to inhibit n-type or p-type diffusion in silicon
JP3214868B2 (ja) * 1991-07-19 2001-10-02 ローム株式会社 ヘテロ接合バイポーラトランジスタの製造方法
JP2971246B2 (ja) * 1992-04-15 1999-11-02 株式会社東芝 ヘテロバイポーラトランジスタの製造方法
US6861324B2 (en) 2001-06-15 2005-03-01 Maxim Integrated Products, Inc. Method of forming a super self-aligned hetero-junction bipolar transistor
US7772060B2 (en) * 2006-06-21 2010-08-10 Texas Instruments Deutschland Gmbh Integrated SiGe NMOS and PMOS transistors
KR102069345B1 (ko) * 2018-03-06 2020-01-22 에스케이씨 주식회사 반도체 공정용 조성물 및 반도체 공정

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB815564A (en) * 1957-06-21 1959-06-24 Gen Motors Corp Improvements in or relating to fuel injection systems
DE883784C (de) * 1949-04-06 1953-06-03 Sueddeutsche App Fabrik G M B Verfahren zur Herstellung von Flaechengleichrichtern und Kristallverstaerkerschichten aus Elementen
BE509317A (de) * 1951-03-07 1900-01-01
GB742237A (en) * 1951-10-24 1955-12-21 Ass Elect Ind Improvements in barrier layer cells
US2695852A (en) * 1952-02-15 1954-11-30 Bell Telephone Labor Inc Fabrication of semiconductors for signal translating devices
DE966848C (de) * 1952-07-29 1957-08-29 Licentia Gmbh Verfahren zum Herstellen von scharf abgegrenzten Schichten entgegengesetzten Leitfaehigkeitstyps auf einem fertigen Halbleiterkristall eines bestimmten Leitfaehigkeitstyps
NL98697C (de) * 1952-08-20
GB778383A (en) * 1953-10-02 1957-07-03 Standard Telephones Cables Ltd Improvements in or relating to the production of material for semi-conductors
BE537841A (de) * 1954-05-03 1900-01-01
DE1240188B (de) * 1954-10-29 1967-05-11 Telefunken Patent Verfahren zum Herstellen von Halbleiterbauelementen mit einem oder mehreren einlegierten p-n-UEbergaengen
DE1046196B (de) * 1954-11-27 1958-12-11 Siemens Ag Verfahren zur Herstellung eines Halbleiters fuer Flaechengleichrichter, -transistoren od. dgl. mit mehreren Bereichen verschiedener Leitfaehigkeit
GB805493A (en) * 1955-04-07 1958-12-10 Telefunken Gmbh Improved method for the production of semi-conductor devices of npn or pnp type
DE1029941B (de) * 1955-07-13 1958-05-14 Siemens Ag Verfahren zur Herstellung von einkristallinen Halbleiterschichten
US2855334A (en) * 1955-08-17 1958-10-07 Sprague Electric Co Method of preparing semiconducting crystals having symmetrical junctions
GB843407A (en) * 1956-12-04 1960-08-04 Sylvania Thorn Colour Television Laboratories Ltd Improvements in and relating to semi-conductor devices
US3099588A (en) * 1959-03-11 1963-07-30 Westinghouse Electric Corp Formation of semiconductor transition regions by alloy vaporization and deposition
FR1148316A (fr) * 1959-10-20 1957-12-06 Thomson Houston Comp Francaise Procédé et appareil pour la réalisation de circuits imprimés

Also Published As

Publication number Publication date
FR1293869A (fr) 1962-05-18
US3242018A (en) 1966-03-22
DE1166938B (de) 1964-04-02
GB918889A (en) 1963-02-20
CH391111A (de) 1965-04-30
NL266513A (de)

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