DE112021005223T5 - Chip-Widerstand und Verfahren zum Herstellen desselben - Google Patents

Chip-Widerstand und Verfahren zum Herstellen desselben Download PDF

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Publication number
DE112021005223T5
DE112021005223T5 DE112021005223.3T DE112021005223T DE112021005223T5 DE 112021005223 T5 DE112021005223 T5 DE 112021005223T5 DE 112021005223 T DE112021005223 T DE 112021005223T DE 112021005223 T5 DE112021005223 T5 DE 112021005223T5
Authority
DE
Germany
Prior art keywords
layer
electrode
conductive
conductive sub
electrode layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021005223.3T
Other languages
German (de)
English (en)
Inventor
Kosaku TANAKA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112021005223T5 publication Critical patent/DE112021005223T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/12—Arrangements of current collectors
    • H01C1/125—Arrangements of current collectors of fluid contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
DE112021005223.3T 2020-11-02 2021-09-22 Chip-Widerstand und Verfahren zum Herstellen desselben Pending DE112021005223T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020183490 2020-11-02
JP2020-183490 2020-11-02
PCT/JP2021/034732 WO2022091643A1 (ja) 2020-11-02 2021-09-22 チップ抵抗器及びその製造方法

Publications (1)

Publication Number Publication Date
DE112021005223T5 true DE112021005223T5 (de) 2023-08-24

Family

ID=81382333

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021005223.3T Pending DE112021005223T5 (de) 2020-11-02 2021-09-22 Chip-Widerstand und Verfahren zum Herstellen desselben

Country Status (5)

Country Link
US (1) US12525377B2 (https=)
JP (1) JP7779850B2 (https=)
CN (1) CN116508118A (https=)
DE (1) DE112021005223T5 (https=)
WO (1) WO2022091643A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020184267A (ja) 2019-05-09 2020-11-12 福井コンピュータホールディングス株式会社 ３次元ｃａｄ装置、及び３次元ｃａｄプログラム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3848286B2 (ja) * 2003-04-16 2006-11-22 ローム株式会社 チップ抵抗器
JP4358664B2 (ja) 2004-03-24 2009-11-04 ローム株式会社 チップ抵抗器およびその製造方法
TWI430293B (zh) * 2006-08-10 2014-03-11 Kamaya Electric Co Ltd Production method of corner plate type chip resistor and corner plate type chip resistor
US8242878B2 (en) * 2008-09-05 2012-08-14 Vishay Dale Electronics, Inc. Resistor and method for making same
CN102379012B (zh) * 2009-04-01 2014-05-07 釜屋电机株式会社 电流检测用金属板电阻器及其制造方法
JP5933956B2 (ja) * 2011-10-20 2016-06-15 ローム株式会社 電子部品の電極構造
JP6730106B2 (ja) 2016-06-27 2020-07-29 Koa株式会社 シャント抵抗器の実装構造および実装基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020184267A (ja) 2019-05-09 2020-11-12 福井コンピュータホールディングス株式会社 ３次元ｃａｄ装置、及び３次元ｃａｄプログラム

Also Published As

Publication number Publication date
CN116508118A (zh) 2023-07-28
US12525377B2 (en) 2026-01-13
WO2022091643A1 (ja) 2022-05-05
US20230343492A1 (en) 2023-10-26
JP7779850B2 (ja) 2025-12-03
JPWO2022091643A1 (https=) 2022-05-05

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Legal Events

Date Code Title Description
R012 Request for examination validly filed