DE112017002565A5 - Anordnung mit einem elektrischen bauteil - Google Patents

Anordnung mit einem elektrischen bauteil Download PDF

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Publication number
DE112017002565A5
DE112017002565A5 DE112017002565.6T DE112017002565T DE112017002565A5 DE 112017002565 A5 DE112017002565 A5 DE 112017002565A5 DE 112017002565 T DE112017002565 T DE 112017002565T DE 112017002565 A5 DE112017002565 A5 DE 112017002565A5
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DE
Germany
Prior art keywords
arrangement
electrical component
electrical
component
Prior art date
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Granted
Application number
DE112017002565.6T
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English (en)
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DE112017002565B4 (de
Inventor
Hubert Halbritter
Andreas Wojcik
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Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication of DE112017002565A5 publication Critical patent/DE112017002565A5/de
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0427—Electrical excitation ; Circuits therefor for applying modulation to the laser

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Lasers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE112017002565.6T 2016-05-17 2017-05-16 Anordnung mit einem elektrischen Bauteil und Verfahren zu deren Herstellung Active DE112017002565B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016208431.3A DE102016208431A1 (de) 2016-05-17 2016-05-17 Anordnung mit einem elektrischen Bauteil
DE102016208431.3 2016-05-17
PCT/EP2017/061736 WO2017198668A1 (de) 2016-05-17 2017-05-16 Anordnung mit einem elektrischen bauteil

Publications (2)

Publication Number Publication Date
DE112017002565A5 true DE112017002565A5 (de) 2019-02-28
DE112017002565B4 DE112017002565B4 (de) 2023-03-09

Family

ID=58794050

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102016208431.3A Withdrawn DE102016208431A1 (de) 2016-05-17 2016-05-17 Anordnung mit einem elektrischen Bauteil
DE112017002565.6T Active DE112017002565B4 (de) 2016-05-17 2017-05-16 Anordnung mit einem elektrischen Bauteil und Verfahren zu deren Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102016208431.3A Withdrawn DE102016208431A1 (de) 2016-05-17 2016-05-17 Anordnung mit einem elektrischen Bauteil

Country Status (5)

Country Link
US (2) US10637206B2 (de)
JP (1) JP6895987B2 (de)
CN (1) CN109155307B (de)
DE (2) DE102016208431A1 (de)
WO (1) WO2017198668A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018109211A1 (de) * 2018-04-18 2019-10-24 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Bauteil
US20200136611A1 (en) 2018-10-30 2020-04-30 Excelitas Canada, Inc. High Speed Switching Circuit Configuration
CN112956090A (zh) * 2018-11-01 2021-06-11 埃赛力达加拿大有限公司 用于侧面发射激光二极管的四方扁平无引线封装件
JP7318305B2 (ja) 2019-05-17 2023-08-01 富士フイルムビジネスイノベーション株式会社 発光装置
US20220285911A1 (en) * 2019-07-23 2022-09-08 Rohm Co., Ltd. Semiconductor laser device
EP4254011A3 (de) * 2020-01-07 2023-11-01 Elmos Semiconductor SE Lichtmodul und lidar-vorrichtung mit mindestens einem derartigen lichtmodul
JP7327202B2 (ja) * 2020-02-20 2023-08-16 株式会社デンソー レーザ発光装置
DE102020105005A1 (de) * 2020-02-26 2021-08-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Substrat und halbleiterlaser
EP4047760A4 (de) * 2020-04-20 2022-12-28 Shenzhen Goodix Technology Co., Ltd. Laseremitter
US20210376563A1 (en) * 2020-05-26 2021-12-02 Excelitas Canada, Inc. Semiconductor Side Emitting Laser Leadframe Package and Method of Producing Same
WO2021256053A1 (ja) * 2020-06-15 2021-12-23 パナソニックＩｐマネジメント株式会社 発光装置および距離測定装置

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JPS61216454A (ja) * 1985-03-22 1986-09-26 Toshiba Corp 樹脂封止型半導体装置
JPS62241383A (ja) * 1986-04-11 1987-10-22 Koudenshi Kogyo Kenkyusho:Kk パルス発光デバイス
JP2708320B2 (ja) * 1992-04-17 1998-02-04 三菱電機株式会社 マルチチップ型半導体装置及びその製造方法
JP3571450B2 (ja) * 1996-02-27 2004-09-29 ローム株式会社 リードフレームの製法および発光素子の製法
JP3225847B2 (ja) * 1996-08-30 2001-11-05 株式会社日立製作所 半導体モジュール
JP3391372B2 (ja) * 1998-03-02 2003-03-31 サンケン電気株式会社 絶縁物封止型電子装置及びその製造方法
JP2000150763A (ja) * 1998-11-16 2000-05-30 Matsushita Electronics Industry Corp リードフレームおよびリードフレームを用いた半導体装置
DE10041079A1 (de) * 2000-08-22 2002-03-14 Osram Opto Semiconductors Gmbh Lasermodul mit Ansteuerschaltung
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Also Published As

Publication number Publication date
JP6895987B2 (ja) 2021-06-30
WO2017198668A1 (de) 2017-11-23
US20200328572A1 (en) 2020-10-15
DE112017002565B4 (de) 2023-03-09
US11177628B2 (en) 2021-11-16
DE102016208431A1 (de) 2017-11-23
US20190312407A1 (en) 2019-10-10
JP2019511128A (ja) 2019-04-18
US10637206B2 (en) 2020-04-28
CN109155307B (zh) 2022-05-10
CN109155307A (zh) 2019-01-04

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