PL3366093T3 - Moduł elektryczny z komponentem elektrycznym - Google Patents

Moduł elektryczny z komponentem elektrycznym

Info

Publication number
PL3366093T3
PL3366093T3 PL15825604T PL15825604T PL3366093T3 PL 3366093 T3 PL3366093 T3 PL 3366093T3 PL 15825604 T PL15825604 T PL 15825604T PL 15825604 T PL15825604 T PL 15825604T PL 3366093 T3 PL3366093 T3 PL 3366093T3
Authority
PL
Poland
Prior art keywords
electrical
module
component
electrical component
electrical module
Prior art date
Application number
PL15825604T
Other languages
English (en)
Inventor
Stephan FRENKEL
Steffen PIERSTORF
Daniel Schmitt
Frank Schremmer
Marcus Wahle
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of PL3366093T3 publication Critical patent/PL3366093T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL15825604T 2015-12-22 2015-12-22 Moduł elektryczny z komponentem elektrycznym PL3366093T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15825604.0A EP3366093B1 (de) 2015-12-22 2015-12-22 Elektrisches modul mit elektrischer komponente
PCT/EP2015/081016 WO2017108104A1 (de) 2015-12-22 2015-12-22 Elektrisches modul mit elektrischer komponente

Publications (1)

Publication Number Publication Date
PL3366093T3 true PL3366093T3 (pl) 2021-04-19

Family

ID=55168218

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15825604T PL3366093T3 (pl) 2015-12-22 2015-12-22 Moduł elektryczny z komponentem elektrycznym

Country Status (5)

Country Link
EP (1) EP3366093B1 (pl)
CN (1) CN208987225U (pl)
ES (1) ES2837140T3 (pl)
PL (1) PL3366093T3 (pl)
WO (1) WO2017108104A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT521041B1 (de) 2018-05-25 2019-10-15 Miba Energy Holding Gmbh Leistungsbaugruppe mit Schottwand

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9802761D0 (en) * 1998-02-11 1998-04-08 Raychem Sa Nv Sealing arrangement
JP3830919B2 (ja) * 2003-06-12 2006-10-11 株式会社東芝 大型半導体モジュール
DE102004062880A1 (de) * 2004-12-27 2006-07-06 Siemens Ag Anzeigeinstrument und Verfahren zum Herstellen und zum Demontieren eines Anzeigeinstrumentes
JP4867280B2 (ja) * 2005-10-18 2012-02-01 株式会社ジェイテクト コーティング剤塗布方法
US9064737B2 (en) * 2007-11-13 2015-06-23 Siemens Aktiengesellschaft Power semiconductor module
KR101502655B1 (ko) * 2009-03-13 2015-03-13 지멘스 악티엔게젤샤프트 층상으로 형성된 절연 측벽을 구비한 파워 반도체 모듈
DE102011076039A1 (de) 2011-05-18 2012-11-22 Siemens Aktiengesellschaft Umrichteranordnung
DE102013102829B4 (de) * 2013-03-20 2017-10-19 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Anordnung hiermit

Also Published As

Publication number Publication date
EP3366093A1 (de) 2018-08-29
ES2837140T3 (es) 2021-06-29
CN208987225U (zh) 2019-06-14
WO2017108104A1 (de) 2017-06-29
EP3366093B1 (de) 2020-09-16

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