DE112017000178T5 - Leitender Film und Verfahren zu dessen Herstellung - Google Patents

Leitender Film und Verfahren zu dessen Herstellung Download PDF

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Publication number
DE112017000178T5
DE112017000178T5 DE112017000178.1T DE112017000178T DE112017000178T5 DE 112017000178 T5 DE112017000178 T5 DE 112017000178T5 DE 112017000178 T DE112017000178 T DE 112017000178T DE 112017000178 T5 DE112017000178 T5 DE 112017000178T5
Authority
DE
Germany
Prior art keywords
conductive film
conductive
liquid composition
graphite powder
elastomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112017000178.1T
Other languages
German (de)
English (en)
Inventor
Yutaro TAGUCHI
Hiroaki Ito
Yusaku TAKAGAKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Riko Co Ltd
Original Assignee
Sumitomo Riko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Riko Co Ltd filed Critical Sumitomo Riko Co Ltd
Publication of DE112017000178T5 publication Critical patent/DE112017000178T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
DE112017000178.1T 2016-03-30 2017-03-09 Leitender Film und Verfahren zu dessen Herstellung Pending DE112017000178T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-067488 2016-03-30
JP2016067488 2016-03-30
PCT/JP2017/009470 WO2017169627A1 (ja) 2016-03-30 2017-03-09 導電性膜およびその製造方法

Publications (1)

Publication Number Publication Date
DE112017000178T5 true DE112017000178T5 (de) 2018-07-19

Family

ID=59963126

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112017000178.1T Pending DE112017000178T5 (de) 2016-03-30 2017-03-09 Leitender Film und Verfahren zu dessen Herstellung

Country Status (5)

Country Link
US (1) US10978216B2 (zh)
JP (1) JP6321894B2 (zh)
CN (1) CN108885919B (zh)
DE (1) DE112017000178T5 (zh)
WO (1) WO2017169627A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6630007B1 (ja) 2019-01-31 2020-01-15 住友理工株式会社 圧電センサおよびその製造方法
CN113795557A (zh) * 2019-07-30 2021-12-14 积水保力马科技株式会社 导电性组合物、导电性膜、触点构件以及导电性组合物的制造方法
KR20220040824A (ko) * 2020-09-24 2022-03-31 삼성전자주식회사 연신 소자용 적층 구조체, 연신 소자 및 그 제조 방법, 표시 패널, 센서 및 전자 장치
EP4239652A4 (en) * 2020-12-25 2024-06-05 Sumitomo Riko Company Limited ELECTRICALLY CONDUCTIVE COMPOSITION, FILM-SHAPED FLEXIBLE ELECTRODE COMPRISING THE SAME AND METHOD FOR PRODUCING THE ELECTRODE
JP7466125B2 (ja) * 2021-04-15 2024-04-12 株式会社常光 薄片化黒鉛の製造方法
TWI815112B (zh) * 2021-05-07 2023-09-11 財團法人紡織產業綜合研究所 導電塗料和其製備方法
CN113436787B (zh) * 2021-06-30 2023-02-28 江苏科麦特科技发展有限公司 一种热敏性导电膜及其制备方法和用途

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227985A (ja) 2008-02-26 2009-10-08 Nsk Ltd エラストマートランスデューサーおよび導電性ゴム組成物ならびに誘電性ゴム組成物
WO2013146254A1 (ja) 2012-03-29 2013-10-03 東海ゴム工業株式会社 導電性組成物および導電膜

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037400A (en) * 1997-08-25 2000-03-14 Hitachi Maxell, Ltd Composition for prevention of electric wave in wide range and electric wave absorber coping with all directions using same
US7282260B2 (en) * 1998-09-11 2007-10-16 Unitech, Llc Electrically conductive and electromagnetic radiation absorptive coating compositions and the like
US20100000441A1 (en) * 2008-07-01 2010-01-07 Jang Bor Z Nano graphene platelet-based conductive inks
JP5711124B2 (ja) * 2009-06-30 2015-04-30 住友理工株式会社 柔軟導電材料およびトランスデューサ
KR101346416B1 (ko) * 2010-05-19 2014-01-02 도카이 고무 고교 가부시키가이샤 도전막, 및 그것을 사용한 트랜스듀서, 플렉시블 배선판
EP2582752B1 (en) * 2010-06-18 2014-12-03 Union Carbide Chemicals & Plastics Technology LLC Electrically conductive olefin multiblock copolymer compositions
EP2562766A1 (de) 2011-08-22 2013-02-27 Bayer MaterialScience AG Kohlenstoffnanoröhren und Graphenplättchen umfassende Dispersionen
CN103946927A (zh) * 2012-03-29 2014-07-23 东海橡塑工业株式会社 导电性组合物和导电膜
JP2015079725A (ja) * 2013-09-13 2015-04-23 東洋紡株式会社 導電性ペースト
US20160059444A1 (en) 2014-08-29 2016-03-03 Yanbo Wang Production of highly conductive graphitic films from polymer films

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227985A (ja) 2008-02-26 2009-10-08 Nsk Ltd エラストマートランスデューサーおよび導電性ゴム組成物ならびに誘電性ゴム組成物
WO2013146254A1 (ja) 2012-03-29 2013-10-03 東海ゴム工業株式会社 導電性組成物および導電膜

Also Published As

Publication number Publication date
WO2017169627A1 (ja) 2017-10-05
JP6321894B2 (ja) 2018-05-09
CN108885919B (zh) 2020-03-31
US20180233250A1 (en) 2018-08-16
CN108885919A (zh) 2018-11-23
JPWO2017169627A1 (ja) 2018-04-05
US10978216B2 (en) 2021-04-13

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