DE112014003479T8 - GaN-Komponente mit verringerter Ausgangskapazität und Verfahren zur Herstellung derselben - Google Patents

GaN-Komponente mit verringerter Ausgangskapazität und Verfahren zur Herstellung derselben Download PDF

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Publication number
DE112014003479T8
DE112014003479T8 DE112014003479.7T DE112014003479T DE112014003479T8 DE 112014003479 T8 DE112014003479 T8 DE 112014003479T8 DE 112014003479 T DE112014003479 T DE 112014003479T DE 112014003479 T8 DE112014003479 T8 DE 112014003479T8
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Germany
Prior art keywords
making
same
output capacity
reduced output
gan component
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Active
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DE112014003479.7T
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English (en)
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DE112014003479T5 (de
Inventor
Stephen L. Colino
Jianjun Cao
Robert Beach
Alexander Lidow
Alana Nakata
Guangyuan Zhao
Yanping Ma
Robert Strittmatter
Michael A. De Rooji
Chunhua ZHOU
Seshadri Kolluri
Fang Chang Liu
Ming-Kun Chiang
Jiali Cao
Agus Jauhar
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Efficient Power Conversion Corp
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Efficient Power Conversion Corp
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Publication of DE112014003479T5 publication Critical patent/DE112014003479T5/de
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Publication of DE112014003479T8 publication Critical patent/DE112014003479T8/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642—Isolation within the component, i.e. internal isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003—Nitride compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE112014003479.7T 2013-07-29 2014-07-29 GaN-Komponente mit verringerter Ausgangskapazität und Verfahren zur Herstellung derselben Active DE112014003479T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361859508P 2013-07-29 2013-07-29
US61/859,508 2013-07-29
PCT/US2014/048586 WO2015017396A2 (en) 2013-07-29 2014-07-29 GaN DEVICE WITH REDUCED OUTPUT CAPACITANCE AND PROCESS FOR MAKING SAME

Publications (2)

Publication Number Publication Date
DE112014003479T5 DE112014003479T5 (de) 2016-04-28
DE112014003479T8 true DE112014003479T8 (de) 2016-10-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE112014003479.7T Active DE112014003479T8 (de) 2013-07-29 2014-07-29 GaN-Komponente mit verringerter Ausgangskapazität und Verfahren zur Herstellung derselben

Country Status (7)

Country Link
US (1) US9331191B2 (de)
JP (1) JP6393758B2 (de)
KR (1) KR102193086B1 (de)
CN (1) CN105409007B (de)
DE (1) DE112014003479T8 (de)
TW (1) TWI555209B (de)
WO (1) WO2015017396A2 (de)

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US9871108B2 (en) * 2015-04-23 2018-01-16 Rohm Co., Ltd. Nitride semiconductor device
JP6642883B2 (ja) * 2015-10-08 2020-02-12 ローム株式会社 窒化物半導体装置およびその製造方法
CN109196650B (zh) * 2016-06-01 2022-04-29 宜普电源转换公司 多台阶表面钝化结构及其制造方法
US9853145B1 (en) * 2016-10-04 2017-12-26 Vanguard International Semiconductor Corporation High-voltage semiconductor device and method of manufacturing the same
US10818787B1 (en) 2019-04-18 2020-10-27 Semiconductor Components Industries, Llc Electronic device including a high electron mobility transistor including a gate electrode and a dielectric film
US11049991B2 (en) * 2019-09-09 2021-06-29 Lite-On Singapore Pte. Ltd. Manufacturing method of an optical module
US11876118B2 (en) * 2020-02-14 2024-01-16 Vanguard International Semiconductor Corporation Semiconductor structure with gate metal layer
CN112038336B (zh) * 2020-06-15 2023-03-24 湖南三安半导体有限责任公司 氮化物器件及其esd防护结构和制作方法
TWI794650B (zh) * 2020-09-24 2023-03-01 世界先進積體電路股份有限公司 半導體結構及其製作方法
US11552188B2 (en) 2020-11-24 2023-01-10 Vanguard International Semiconductor Corporation High-voltage semiconductor structure

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JPH0783108B2 (ja) * 1986-07-25 1995-09-06 株式会社日立製作所 半導体装置
EP1410444B1 (de) * 2001-07-24 2012-08-22 Cree, Inc. Isolierendes Gate AlGaN/GaN HEMT
US7501669B2 (en) * 2003-09-09 2009-03-10 Cree, Inc. Wide bandgap transistor devices with field plates
JP2007165446A (ja) * 2005-12-12 2007-06-28 Oki Electric Ind Co Ltd 半導体素子のオーミックコンタクト構造
JP5065616B2 (ja) * 2006-04-21 2012-11-07 株式会社東芝 窒化物半導体素子
US8399911B2 (en) * 2006-06-07 2013-03-19 Imec Enhancement mode field effect device and the method of production thereof
US8823057B2 (en) * 2006-11-06 2014-09-02 Cree, Inc. Semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices
JP2008263140A (ja) * 2007-04-13 2008-10-30 Toshiba Corp 窒化物半導体素子
JP2008288289A (ja) * 2007-05-16 2008-11-27 Oki Electric Ind Co Ltd 電界効果トランジスタとその製造方法
US8076699B2 (en) 2008-04-02 2011-12-13 The Hong Kong Univ. Of Science And Technology Integrated HEMT and lateral field-effect rectifier combinations, methods, and systems
US8785973B2 (en) * 2010-04-19 2014-07-22 National Semiconductor Corporation Ultra high voltage GaN ESD protection device
US8742460B2 (en) * 2010-12-15 2014-06-03 Transphorm Inc. Transistors with isolation regions
JP5845638B2 (ja) * 2011-06-02 2016-01-20 住友電気工業株式会社 半導体装置
US8653559B2 (en) * 2011-06-29 2014-02-18 Hrl Laboratories, Llc AlGaN/GaN hybrid MOS-HFET
JP5899803B2 (ja) * 2011-10-28 2016-04-06 サンケン電気株式会社 窒化物半導体装置
KR20130066396A (ko) 2011-12-12 2013-06-20 삼성전기주식회사 질화물 반도체 소자 및 그 제조 방법
US8803246B2 (en) * 2012-07-16 2014-08-12 Transphorm Inc. Semiconductor electronic components with integrated current limiters
US9202906B2 (en) * 2013-03-14 2015-12-01 Northrop Grumman Systems Corporation Superlattice crenelated gate field effect transistor

Also Published As

Publication number Publication date
JP2016529709A (ja) 2016-09-23
DE112014003479T5 (de) 2016-04-28
CN105409007A (zh) 2016-03-16
KR102193086B1 (ko) 2020-12-21
WO2015017396A2 (en) 2015-02-05
TW201515223A (zh) 2015-04-16
TWI555209B (zh) 2016-10-21
JP6393758B2 (ja) 2018-09-19
KR20160040617A (ko) 2016-04-14
US9331191B2 (en) 2016-05-03
CN105409007B (zh) 2019-02-22
US20150028390A1 (en) 2015-01-29
WO2015017396A3 (en) 2015-11-05

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