DE112014002496A5 - Verfahren zur Herstellung eines pulverförmigen Precursormaterials, pulverförmiges Precursormaterial und seine Verwendung - Google Patents
Verfahren zur Herstellung eines pulverförmigen Precursormaterials, pulverförmiges Precursormaterial und seine Verwendung Download PDFInfo
- Publication number
- DE112014002496A5 DE112014002496A5 DE112014002496.1T DE112014002496T DE112014002496A5 DE 112014002496 A5 DE112014002496 A5 DE 112014002496A5 DE 112014002496 T DE112014002496 T DE 112014002496T DE 112014002496 A5 DE112014002496 A5 DE 112014002496A5
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- Germany
- Prior art keywords
- precursor material
- powdery precursor
- preparation
- powdery
- precursor
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- 239000000463 material Substances 0.000 title 2
- 239000002243 precursor Substances 0.000 title 2
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0602—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with two or more other elements chosen from metals, silicon or boron
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- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0605—Binary compounds of nitrogen with carbon
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
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- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
- C01P2002/52—Solid solutions containing elements as dopants
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- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3873—Silicon nitrides, e.g. silicon carbonitride, silicon oxynitride
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5409—Particle size related information expressed by specific surface values
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5463—Particle size distributions
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
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- C04B2235/5481—Monomodal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Luminescent Compositions (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Products (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013105307.6A DE102013105307A1 (de) | 2013-05-23 | 2013-05-23 | Verfahren zur Herstellung eines pulverförmigen Precursormaterials, pulverförmiges Precursormaterial und seine Verwendung |
DE102013105307.6 | 2013-05-23 | ||
PCT/EP2014/059361 WO2014187669A1 (de) | 2013-05-23 | 2014-05-07 | Verfahren zur herstellung eines pulverförmigen precursormaterials, pulverförmiges precursormaterial und seine verwendung |
Publications (3)
Publication Number | Publication Date |
---|---|
DE112014002496A5 true DE112014002496A5 (de) | 2016-03-03 |
DE112014002496B4 DE112014002496B4 (de) | 2019-08-29 |
DE112014002496B9 DE112014002496B9 (de) | 2019-11-14 |
Family
ID=50729483
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013105307.6A Withdrawn DE102013105307A1 (de) | 2013-05-23 | 2013-05-23 | Verfahren zur Herstellung eines pulverförmigen Precursormaterials, pulverförmiges Precursormaterial und seine Verwendung |
DE112014002496.1T Active DE112014002496B9 (de) | 2013-05-23 | 2014-05-07 | Verfahren zur Herstellung eines pulverförmigen Precursormaterials, pulverförmiges Precursormaterial und seine Verwendung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013105307.6A Withdrawn DE102013105307A1 (de) | 2013-05-23 | 2013-05-23 | Verfahren zur Herstellung eines pulverförmigen Precursormaterials, pulverförmiges Precursormaterial und seine Verwendung |
Country Status (6)
Country | Link |
---|---|
US (1) | US9828546B2 (de) |
JP (1) | JP6143949B2 (de) |
KR (1) | KR102333561B1 (de) |
CN (1) | CN105246859B (de) |
DE (2) | DE102013105307A1 (de) |
WO (1) | WO2014187669A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016044306A (ja) * | 2014-08-22 | 2016-04-04 | 太平洋セメント株式会社 | 窒化物蛍光体の製造方法 |
JP6536622B2 (ja) * | 2016-05-30 | 2019-07-03 | 日亜化学工業株式会社 | βサイアロン蛍光体の製造方法 |
CN107446575B (zh) | 2016-05-30 | 2021-08-31 | 日亚化学工业株式会社 | β赛隆荧光体的制造方法 |
JP7319508B2 (ja) * | 2018-11-30 | 2023-08-02 | 日亜化学工業株式会社 | セラミックス焼結体の製造方法、セラミックス焼結体及び発光装置 |
CN114163254B (zh) * | 2022-02-11 | 2022-04-26 | 北京利尔高温材料股份有限公司 | 一种高炉出铁沟主沟浇注料 |
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US5643674A (en) | 1992-12-18 | 1997-07-01 | E. I. Du Pont De Nemours And Company | Luminescent materials prepared by coating luminescent compositions onto substrate particles |
US5376602A (en) * | 1993-12-23 | 1994-12-27 | The Dow Chemical Company | Low temperature, pressureless sintering of silicon nitride |
JP2937850B2 (ja) * | 1996-03-15 | 1999-08-23 | 株式会社東芝 | 窒化アルミニウム焼結体の製造方法 |
EP1104799A1 (de) | 1999-11-30 | 2001-06-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Rotstrahlendes lumineszentes Material |
JP2001318604A (ja) | 2000-05-08 | 2001-11-16 | Nemoto & Co Ltd | 表示部材、その製造方法および時計 |
JP2002055637A (ja) * | 2000-08-11 | 2002-02-20 | Nemoto & Co Ltd | 表示体および時計 |
JP3969242B2 (ja) * | 2001-08-24 | 2007-09-05 | 三菱化学株式会社 | 蛍光体前駆体粒子及び蛍光体の製造方法 |
DE10146719A1 (de) | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE10147040A1 (de) | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
JP3830148B2 (ja) * | 2003-05-23 | 2006-10-04 | 根本特殊化学株式会社 | レチクルおよび光学機器 |
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EP2135920B1 (de) * | 2007-04-18 | 2016-12-21 | Mitsubishi Chemical Corporation | Verfahren zur herstellung einer anorganischen verbindung, fluoreszenzmaterial, fluoreszenzhaltige zusammensetzung, lumineszenzvorrichtung, beleuchter und bildanzeige |
WO2010018873A1 (ja) * | 2008-08-13 | 2010-02-18 | 宇部興産株式会社 | Li含有α-サイアロン系蛍光体とその製造方法、照明器具ならびに画像表示装置 |
DE102008058295A1 (de) * | 2008-11-20 | 2010-05-27 | Osram Gesellschaft mit beschränkter Haftung | Rot emittierender Leuchtstoff aus der Klasse der Nitridosilikate und Lichtquelle mit derartigem Leuchtstoff sowie Verfahren zur Herstellung des Leuchtstoffs |
JP5540322B2 (ja) * | 2009-03-26 | 2014-07-02 | 独立行政法人物質・材料研究機構 | 蛍光体、その製造方法、発光器具および画像表示装置 |
KR100984273B1 (ko) * | 2010-05-25 | 2010-10-01 | 충남대학교산학협력단 | 질화물 형광체, 이의 제조방법 및 상기 형광체를 포함하는 발광 소자 |
US9023240B2 (en) | 2010-08-04 | 2015-05-05 | Ube Industries, Ltd. | Silicon nitride powder for siliconnitride phosphor, CaAlSiN3 phosphor using same, Sr2Si5N8 phosphor using same, (Sr, Ca)AlSiN3 phosphor using same, La3Si6N11 Phosphor using same, and methods for producing the phosphors |
JP5782778B2 (ja) * | 2011-03-30 | 2015-09-24 | 宇部興産株式会社 | 窒化物蛍光体粉末の製造方法および窒化物蛍光体粉末 |
DE102011115879A1 (de) | 2011-10-12 | 2013-04-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Leuchtstoffe |
CN104024377B (zh) * | 2011-11-07 | 2017-05-17 | 国立研究开发法人物质·材料研究机构 | 荧光体及制备方法、使用荧光体的发光装置及图像显示装置 |
DE102013105304A1 (de) * | 2013-05-23 | 2014-11-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines pulverförmigen Precursormaterials, pulverförmiges Precursormaterial und seine Verwendung |
-
2013
- 2013-05-23 DE DE102013105307.6A patent/DE102013105307A1/de not_active Withdrawn
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2014
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- 2014-05-07 WO PCT/EP2014/059361 patent/WO2014187669A1/de active Application Filing
- 2014-05-07 US US14/889,405 patent/US9828546B2/en active Active
- 2014-05-07 JP JP2016514321A patent/JP6143949B2/ja active Active
- 2014-05-07 CN CN201480029775.XA patent/CN105246859B/zh active Active
- 2014-05-07 KR KR1020157035991A patent/KR102333561B1/ko active IP Right Grant
Also Published As
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US9828546B2 (en) | 2017-11-28 |
CN105246859A (zh) | 2016-01-13 |
CN105246859B (zh) | 2017-09-01 |
US20160122636A1 (en) | 2016-05-05 |
DE112014002496B4 (de) | 2019-08-29 |
DE112014002496B9 (de) | 2019-11-14 |
JP2016526072A (ja) | 2016-09-01 |
JP6143949B2 (ja) | 2017-06-07 |
KR20160012176A (ko) | 2016-02-02 |
KR102333561B1 (ko) | 2021-11-30 |
DE102013105307A1 (de) | 2014-11-27 |
WO2014187669A1 (de) | 2014-11-27 |
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