DE112012000823B4 - Kombinierter Sensor - Google Patents

Kombinierter Sensor Download PDF

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Publication number
DE112012000823B4
DE112012000823B4 DE112012000823.5T DE112012000823T DE112012000823B4 DE 112012000823 B4 DE112012000823 B4 DE 112012000823B4 DE 112012000823 T DE112012000823 T DE 112012000823T DE 112012000823 B4 DE112012000823 B4 DE 112012000823B4
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DE
Germany
Prior art keywords
potential
dummy
movable
movable portion
combined sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112012000823.5T
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German (de)
English (en)
Other versions
DE112012000823T5 (de
Inventor
Heewon JEONG
Masahide Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
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Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of DE112012000823T5 publication Critical patent/DE112012000823T5/de
Application granted granted Critical
Publication of DE112012000823B4 publication Critical patent/DE112012000823B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5726—Signal processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5769—Manufacturing; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Signal Processing (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
DE112012000823.5T 2011-02-16 2012-01-10 Kombinierter Sensor Expired - Fee Related DE112012000823B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-030790 2011-02-16
JP2011030790A JP5425824B2 (ja) 2011-02-16 2011-02-16 複合センサ
PCT/JP2012/050214 WO2012111357A1 (ja) 2011-02-16 2012-01-10 複合センサ

Publications (2)

Publication Number Publication Date
DE112012000823T5 DE112012000823T5 (de) 2013-12-05
DE112012000823B4 true DE112012000823B4 (de) 2015-11-05

Family

ID=46672300

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112012000823.5T Expired - Fee Related DE112012000823B4 (de) 2011-02-16 2012-01-10 Kombinierter Sensor

Country Status (4)

Country Link
US (1) US9151776B2 (https=)
JP (1) JP5425824B2 (https=)
DE (1) DE112012000823B4 (https=)
WO (1) WO2012111357A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5963567B2 (ja) * 2012-06-26 2016-08-03 日立オートモティブシステムズ株式会社 慣性センサ
JP6084473B2 (ja) * 2013-02-01 2017-02-22 日立オートモティブシステムズ株式会社 複合センサ
JP6123613B2 (ja) * 2013-09-26 2017-05-10 株式会社デンソー 物理量センサおよびその製造方法
JP6187305B2 (ja) * 2014-02-18 2017-08-30 株式会社デンソー ジャイロセンサ
JP2015161640A (ja) * 2014-02-28 2015-09-07 セイコーエプソン株式会社 電子デバイス、電子機器、および移動体
KR101565684B1 (ko) * 2014-03-14 2015-11-03 삼성전기주식회사 Mems 센서용 검출모듈 및 이를 포함하는 mems 센서
JP6331535B2 (ja) * 2014-03-18 2018-05-30 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP6451062B2 (ja) 2014-03-18 2019-01-16 セイコーエプソン株式会社 電子デバイス、電子モジュール、電子機器および移動体
JP6380737B2 (ja) * 2014-04-18 2018-08-29 セイコーエプソン株式会社 電子デバイス、電子機器、および移動体
JP6372361B2 (ja) * 2015-01-16 2018-08-15 株式会社デンソー 複合センサ
JP6572603B2 (ja) 2015-04-13 2019-09-11 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
US9505140B1 (en) 2015-06-02 2016-11-29 Irobot Corporation Contact sensors for a mobile robot
JP6372450B2 (ja) * 2015-08-21 2018-08-15 株式会社デンソー 複合センサ
JP6641878B2 (ja) 2015-10-21 2020-02-05 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP7155498B2 (ja) * 2017-03-29 2022-10-19 セイコーエプソン株式会社 光学フィルターデバイス
JP6400795B1 (ja) * 2017-06-29 2018-10-03 タイコエレクトロニクスジャパン合同会社 印刷回路基板
JP7159548B2 (ja) * 2017-11-28 2022-10-25 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器および移動体
JP7456988B2 (ja) * 2021-09-15 2024-03-27 株式会社東芝 センサ及び電気装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530736A1 (de) * 1995-02-10 1996-08-14 Bosch Gmbh Robert Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors
DE10107327A1 (de) * 2000-02-18 2001-08-23 Denso Corp Zur Verhinderung einer unnötigen Oszillation geeigneter Winkelgeschwindigkeitssensor
DE10060091A1 (de) * 2000-12-02 2002-06-13 Eads Deutschland Gmbh Mikromechanischer Inertialsensor
JP3435665B2 (ja) * 2000-06-23 2003-08-11 株式会社村田製作所 複合センサ素子およびその製造方法
DE102005012155A1 (de) * 2004-03-19 2005-10-06 Denso Corp., Kariya Vibrations-Winkelgeschwindigkeitssensor
JP2009145321A (ja) * 2007-11-19 2009-07-02 Hitachi Ltd 慣性センサ
JP2009168777A (ja) * 2008-01-21 2009-07-30 Hitachi Ltd 慣性センサ
WO2010119573A1 (ja) * 2009-04-17 2010-10-21 株式会社日立製作所 慣性センサおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3489505B2 (ja) * 1999-09-22 2004-01-19 トヨタ自動車株式会社 半導体センサ
WO2004065968A1 (en) * 2003-01-16 2004-08-05 The Regents Of The University Of Michigan Micromachined capacitive lateral accelerometer device and monolithic, three-axis accelerometer having same
US7059190B2 (en) * 2003-10-08 2006-06-13 Denso Corporation Semiconductor dynamic sensor having variable capacitor formed on laminated substrate
JP4515069B2 (ja) * 2003-10-08 2010-07-28 株式会社デンソー 半導体力学量センサ
EP2060871A3 (en) * 2007-11-19 2012-12-26 Hitachi Ltd. Inertial sensor
JP2010127763A (ja) * 2008-11-27 2010-06-10 Hitachi Ltd 半導体力学量検出センサ及びそれを用いた制御装置
JP4962482B2 (ja) * 2008-12-18 2012-06-27 株式会社デンソー 半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530736A1 (de) * 1995-02-10 1996-08-14 Bosch Gmbh Robert Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors
DE10107327A1 (de) * 2000-02-18 2001-08-23 Denso Corp Zur Verhinderung einer unnötigen Oszillation geeigneter Winkelgeschwindigkeitssensor
JP3435665B2 (ja) * 2000-06-23 2003-08-11 株式会社村田製作所 複合センサ素子およびその製造方法
DE10060091A1 (de) * 2000-12-02 2002-06-13 Eads Deutschland Gmbh Mikromechanischer Inertialsensor
DE102005012155A1 (de) * 2004-03-19 2005-10-06 Denso Corp., Kariya Vibrations-Winkelgeschwindigkeitssensor
JP2009145321A (ja) * 2007-11-19 2009-07-02 Hitachi Ltd 慣性センサ
JP2009168777A (ja) * 2008-01-21 2009-07-30 Hitachi Ltd 慣性センサ
WO2010119573A1 (ja) * 2009-04-17 2010-10-21 株式会社日立製作所 慣性センサおよびその製造方法

Also Published As

Publication number Publication date
JP5425824B2 (ja) 2014-02-26
JP2012168097A (ja) 2012-09-06
DE112012000823T5 (de) 2013-12-05
US9151776B2 (en) 2015-10-06
WO2012111357A1 (ja) 2012-08-23
US20130312517A1 (en) 2013-11-28

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Owner name: HITACHI ASTEMO, LTD., HITACHINAKA-SHI, JP

Free format text: FORMER OWNER: HITACHI AUTOMOTIVE SYSTEMS, LTD., HITACHINAKA-SHI, IBARAKI, JP

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Representative=s name: MERH-IP MATIAS ERNY REICHL HOFFMANN PATENTANWA, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee