DE1110319B - Waermeleitende Halterung fuer einen Transistor - Google Patents

Waermeleitende Halterung fuer einen Transistor

Info

Publication number
DE1110319B
DE1110319B DES55861A DES0055861A DE1110319B DE 1110319 B DE1110319 B DE 1110319B DE S55861 A DES55861 A DE S55861A DE S0055861 A DES0055861 A DE S0055861A DE 1110319 B DE1110319 B DE 1110319B
Authority
DE
Germany
Prior art keywords
transistor
holder
chassis plate
thermally conductive
away
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES55861A
Other languages
German (de)
English (en)
Inventor
Stanley Thomas Deakin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Edison Swan Ltd
Original Assignee
Siemens Edison Swan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB3468256A external-priority patent/GB877481A/en
Application filed by Siemens Edison Swan Ltd filed Critical Siemens Edison Swan Ltd
Priority claimed from US695647A external-priority patent/US2917286A/en
Publication of DE1110319B publication Critical patent/DE1110319B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Rectifiers (AREA)
DES55861A 1956-11-13 1957-11-12 Waermeleitende Halterung fuer einen Transistor Pending DE1110319B (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB3468256A GB877481A (en) 1956-11-13 1956-11-13 Improvements relating to electronic equipment
US695647A US2917286A (en) 1956-11-13 1957-11-12 Electronic equipment
US805064A US3038703A (en) 1956-11-13 1959-04-08 Electronic equipment

Publications (1)

Publication Number Publication Date
DE1110319B true DE1110319B (de) 1961-07-06

Family

ID=32397675

Family Applications (1)

Application Number Title Priority Date Filing Date
DES55861A Pending DE1110319B (de) 1956-11-13 1957-11-12 Waermeleitende Halterung fuer einen Transistor

Country Status (5)

Country Link
US (1) US3038703A (en:Method)
BE (1) BE562344A (en:Method)
DE (1) DE1110319B (en:Method)
FR (1) FR1186007A (en:Method)
GB (2) GB877483A (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1616507B1 (de) * 1967-03-02 1971-09-30 Cts Corp Lagerstuetze fuer eine Schaltungselemente tragende Grundplatte
DE3810716A1 (de) * 1988-03-30 1989-11-02 Loewe Opta Gmbh Halter fuer flache bauelemente

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE639515A (en:Method) * 1962-11-07
US3248078A (en) * 1964-04-30 1966-04-26 Radar Relay Inc Support bracket
JPS5124193Y2 (en:Method) * 1971-06-18 1976-06-21
JPS6247166Y2 (en:Method) * 1978-06-16 1987-12-25
JPH04343306A (ja) * 1991-05-21 1992-11-30 Toshiba Corp レ−ザ発振装置の取付装置
KR0137912B1 (ko) 1992-04-02 1998-05-01 리타 버그스트롬 에폭사이드-인 함유 산-환상 무수물의 반응생성물 및 이들의 피막 조성물에서의 용도
US5615735A (en) * 1994-09-29 1997-04-01 Hewlett-Packard Co. Heat sink spring clamp
US6029330A (en) * 1997-09-25 2000-02-29 Hewlett-Packard Company Tool for compressing a torsional spring for clamping a heat sink
US7448822B2 (en) 2006-03-15 2008-11-11 The Boeing Company Retaining member and method for use with a seat track

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH176472A (fr) * 1933-07-24 1935-04-15 Cie Gen De Signalisation Appareil pour redresser les courants électriques alternatifs.
US2555151A (en) * 1948-07-01 1951-05-29 Aircraft Radio Corp Crystal detector assembly
BE500891A (fr) * 1950-02-21 1952-04-11 Westinghouse Freins & Signaux Montage perfectionne d'elements redresseurs de courant.
FR1070025A (fr) * 1952-01-22 1954-07-15 Siemens Ag Dispositif redresseur à sec

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2601027A (en) * 1948-03-09 1952-06-17 Gen Electric Electron tube support and cooling device
US2627385A (en) * 1949-08-29 1953-02-03 Tinnerman Products Inc Support
US2798271A (en) * 1953-10-30 1957-07-09 Tinnerman Products Inc Separable fastener
US2911575A (en) * 1955-09-01 1959-11-03 Tinnerman Products Inc Selenium and like rectifier stack

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH176472A (fr) * 1933-07-24 1935-04-15 Cie Gen De Signalisation Appareil pour redresser les courants électriques alternatifs.
US2555151A (en) * 1948-07-01 1951-05-29 Aircraft Radio Corp Crystal detector assembly
BE500891A (fr) * 1950-02-21 1952-04-11 Westinghouse Freins & Signaux Montage perfectionne d'elements redresseurs de courant.
FR1070025A (fr) * 1952-01-22 1954-07-15 Siemens Ag Dispositif redresseur à sec

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1616507B1 (de) * 1967-03-02 1971-09-30 Cts Corp Lagerstuetze fuer eine Schaltungselemente tragende Grundplatte
DE3810716A1 (de) * 1988-03-30 1989-11-02 Loewe Opta Gmbh Halter fuer flache bauelemente

Also Published As

Publication number Publication date
FR1186007A (fr) 1959-08-12
BE562344A (en:Method)
US3038703A (en) 1962-06-12
GB877483A (en) 1961-09-13
GB877482A (en) 1961-09-13

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