DE1048624B - - Google Patents

Info

Publication number
DE1048624B
DE1048624B DENDAT1048624D DE1048624DA DE1048624B DE 1048624 B DE1048624 B DE 1048624B DE NDAT1048624 D DENDAT1048624 D DE NDAT1048624D DE 1048624D A DE1048624D A DE 1048624DA DE 1048624 B DE1048624 B DE 1048624B
Authority
DE
Germany
Prior art keywords
strips
contact elements
contact
parts
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1048624D
Other languages
German (de)
English (en)
Publication date
Publication of DE1048624B publication Critical patent/DE1048624B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/0056—Apparatus or processes specially adapted for the manufacture of electric switches comprising a successive blank-stamping, insert-moulding and severing operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DENDAT1048624D Pending DE1048624B (enrdf_load_stackoverflow)

Publications (1)

Publication Number Publication Date
DE1048624B true DE1048624B (enrdf_load_stackoverflow) 1959-01-15

Family

ID=589775

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1048624D Pending DE1048624B (enrdf_load_stackoverflow)

Country Status (1)

Country Link
DE (1) DE1048624B (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413713A (en) * 1965-06-18 1968-12-03 Motorola Inc Plastic encapsulated transistor and method of making same
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
DE1690028B1 (de) * 1967-08-11 1972-12-07 Siemens Ag Winkelstecker zum hoehesparenden anschluss von bauelementen an leiterplatten
US3753634A (en) * 1970-10-09 1973-08-21 T Bliven Molding means for strip frame semiconductive device
EP0590644A1 (de) * 1992-10-02 1994-04-06 TRW FAHRZEUGELEKTRIK GmbH & CO. KG Verfahrem zum Umspritzen von elektrischen Kontaktbahnen

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413713A (en) * 1965-06-18 1968-12-03 Motorola Inc Plastic encapsulated transistor and method of making same
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
DE1690028B1 (de) * 1967-08-11 1972-12-07 Siemens Ag Winkelstecker zum hoehesparenden anschluss von bauelementen an leiterplatten
US3753634A (en) * 1970-10-09 1973-08-21 T Bliven Molding means for strip frame semiconductive device
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
EP0590644A1 (de) * 1992-10-02 1994-04-06 TRW FAHRZEUGELEKTRIK GmbH & CO. KG Verfahrem zum Umspritzen von elektrischen Kontaktbahnen

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