DE10340926A1 - Verfahren zur Herstellung von elektronischen Bauelementen - Google Patents

Verfahren zur Herstellung von elektronischen Bauelementen Download PDF

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Publication number
DE10340926A1
DE10340926A1 DE10340926A DE10340926A DE10340926A1 DE 10340926 A1 DE10340926 A1 DE 10340926A1 DE 10340926 A DE10340926 A DE 10340926A DE 10340926 A DE10340926 A DE 10340926A DE 10340926 A1 DE10340926 A1 DE 10340926A1
Authority
DE
Germany
Prior art keywords
substrate
photoresist
electrodes
electronic components
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10340926A
Other languages
German (de)
English (en)
Inventor
Theodor Prof. Dr.-Ing. habil. Doll
Susanne Dr.-Ing. Scheinert
Axel Prof. Scherer
Gernot Prof. Paasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cufer Asset Ltd LLC
Original Assignee
Leibniz Institut fuer Festkorper und Werkstofforschung Dresden eV
Technische Universitaet Ilmenau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leibniz Institut fuer Festkorper und Werkstofforschung Dresden eV, Technische Universitaet Ilmenau filed Critical Leibniz Institut fuer Festkorper und Werkstofforschung Dresden eV
Priority to DE10340926A priority Critical patent/DE10340926A1/de
Priority to US10/570,839 priority patent/US8012791B2/en
Priority to EP04764691A priority patent/EP1665408A2/fr
Priority to PCT/EP2004/009729 priority patent/WO2005024972A2/fr
Publication of DE10340926A1 publication Critical patent/DE10340926A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/466Lateral bottom-gate IGFETs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621Providing a shape to conductive layers, e.g. patterning or selective deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)
DE10340926A 2003-09-03 2003-09-03 Verfahren zur Herstellung von elektronischen Bauelementen Withdrawn DE10340926A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE10340926A DE10340926A1 (de) 2003-09-03 2003-09-03 Verfahren zur Herstellung von elektronischen Bauelementen
US10/570,839 US8012791B2 (en) 2003-09-03 2004-09-01 Electronic components and methods for producing same
EP04764691A EP1665408A2 (fr) 2003-09-03 2004-09-01 Procede pour produire des composants electroniques
PCT/EP2004/009729 WO2005024972A2 (fr) 2003-09-03 2004-09-01 Procede pour produire des composants electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10340926A DE10340926A1 (de) 2003-09-03 2003-09-03 Verfahren zur Herstellung von elektronischen Bauelementen

Publications (1)

Publication Number Publication Date
DE10340926A1 true DE10340926A1 (de) 2005-03-31

Family

ID=34223364

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10340926A Withdrawn DE10340926A1 (de) 2003-09-03 2003-09-03 Verfahren zur Herstellung von elektronischen Bauelementen

Country Status (4)

Country Link
US (1) US8012791B2 (fr)
EP (1) EP1665408A2 (fr)
DE (1) DE10340926A1 (fr)
WO (1) WO2005024972A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8012791B2 (en) 2003-09-03 2011-09-06 Cantrele Telecom Co., L.L.C. Electronic components and methods for producing same

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KR100686120B1 (ko) * 2005-05-17 2007-02-26 엘지전자 주식회사 유기 el 소자의 제조방법
US20070048894A1 (en) * 2005-08-26 2007-03-01 Osram Opto Semiconductors Gmbh System and method for reduced material pileup
US7935977B2 (en) * 2006-07-25 2011-05-03 Lg Chem, Ltd. Method of manufacturing organic light emitting device and organic light emitting device manufactured by using the method
GB2441355B (en) * 2006-08-31 2009-05-20 Cambridge Display Tech Ltd Organic electronic device
FR2954856B1 (fr) * 2009-12-30 2012-06-15 Saint Gobain Cellule photovoltaique organique et module comprenant une telle cellule
TWI583036B (zh) * 2013-09-30 2017-05-11 樂金顯示科技股份有限公司 積層體及其製造方法
TWI568052B (zh) 2013-09-30 2017-01-21 樂金顯示科技股份有限公司 用於製造有機發光裝置之方法
EP3016161B1 (fr) * 2013-09-30 2019-09-04 LG Display Co., Ltd. Dispositif électroluminescent organique
KR102605208B1 (ko) 2016-06-28 2023-11-24 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
US10438848B2 (en) * 2017-11-01 2019-10-08 Semi Automation & Technologies, Inc. Inorganic lift-off profile process for semiconductor wafer processing
WO2023203429A1 (fr) * 2022-04-22 2023-10-26 株式会社半導体エネルギー研究所 Dispositif à semi-conducteurs et dispositif d'affichage

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EP0732868A1 (fr) * 1995-03-13 1996-09-18 Pioneer Electronic Corporation Panneau d'affichage électroluminescent en matière organique et procédé pour sa fabrication
WO1999026730A1 (fr) * 1997-11-24 1999-06-03 The Trustees Of Princeton University Procede de fabrication de dispositifs electroluminescents organiques et de formation de motifs sur ces derniers
DE19819200A1 (de) * 1998-04-29 1999-11-11 Fraunhofer Ges Forschung Verfahren zur Herstellung von Kontaktstrukturen in Halbleiterbauelementen
DE10116876A1 (de) * 2001-04-04 2002-10-17 Infineon Technologies Ag Selbstjustierte Kontaktdotierung für organische Feldeffekttransistoren
WO2003081687A2 (fr) * 2002-03-20 2003-10-02 International Business Machines Corporation Transistor a effet de champ muni d'un nanotube autoaligne et procede de fabrication correspondant

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US3369159A (en) * 1964-12-21 1968-02-13 Texas Instruments Inc Printed transistors and methods of making same
US4180604A (en) * 1977-12-30 1979-12-25 International Business Machines Corporation Two layer resist system
US5091288A (en) * 1989-10-27 1992-02-25 Rockwell International Corporation Method of forming detector array contact bumps for improved lift off of excess metal
JPH06333952A (ja) * 1993-05-21 1994-12-02 Kyocera Corp 薄膜トランジスタ
JPH08172102A (ja) 1994-12-20 1996-07-02 Murata Mfg Co Ltd 半導体装置の製造方法
DE19534668A1 (de) 1995-09-19 1997-03-20 Thera Ges Fuer Patente Kettenverlängerte Epoxidharze enthaltende, vorwiegend kationisch härtende Masse
US6326640B1 (en) * 1996-01-29 2001-12-04 Motorola, Inc. Organic thin film transistor with enhanced carrier mobility
US6720572B1 (en) * 1999-06-25 2004-04-13 The Penn State Research Foundation Organic light emitters with improved carrier injection
EP1129484A1 (fr) * 1999-08-24 2001-09-05 Koninklijke Philips Electronics N.V. Dispositif d'affichage
EP1243032B1 (fr) * 1999-12-21 2019-11-20 Flexenable Limited Circuits integres fabriques par jet d'encre
GB0013473D0 (en) * 2000-06-03 2000-07-26 Univ Liverpool A method of electronic component fabrication and an electronic component
US6605519B2 (en) * 2001-05-02 2003-08-12 Unaxis Usa, Inc. Method for thin film lift-off processes using lateral extended etching masks and device
US6794220B2 (en) * 2001-09-05 2004-09-21 Konica Corporation Organic thin-film semiconductor element and manufacturing method for the same
DE10153563A1 (de) * 2001-10-30 2003-05-15 Infineon Technologies Ag Verringerung des Kontaktwiderstandes in organischen Feldeffekttransistoren durch Einbettung von Nanopartikeln zur Erzeugung von Feldüberhöhungen
JP4360801B2 (ja) * 2001-12-25 2009-11-11 シャープ株式会社 トランジスタおよびそれを用いた表示装置
KR100892945B1 (ko) * 2002-02-22 2009-04-09 삼성전자주식회사 액티브 매트릭스형 유기전계발광 표시장치 및 그 제조방법
US6740900B2 (en) * 2002-02-27 2004-05-25 Konica Corporation Organic thin-film transistor and manufacturing method for the same
US20030183915A1 (en) * 2002-04-02 2003-10-02 Motorola, Inc. Encapsulated organic semiconductor device and method
US6946677B2 (en) * 2002-06-14 2005-09-20 Nokia Corporation Pre-patterned substrate for organic thin film transistor structures and circuits and related method for making same
US6764885B2 (en) * 2002-10-17 2004-07-20 Avery Dennison Corporation Method of fabricating transistor device
US6905908B2 (en) * 2002-12-26 2005-06-14 Motorola, Inc. Method of fabricating organic field effect transistors
ITTO20030145A1 (it) * 2003-02-28 2004-09-01 Infm Istituto Naz Per La Fisi Ca Della Mater Procedimento per la fabbricazione di dispositivi ad effetto di campo a film sottile privi di substrato e transistore a film sottile organico ottenibile mediante tale procedimento.
DE10340926A1 (de) 2003-09-03 2005-03-31 Technische Universität Ilmenau Abteilung Forschungsförderung und Technologietransfer Verfahren zur Herstellung von elektronischen Bauelementen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0732868A1 (fr) * 1995-03-13 1996-09-18 Pioneer Electronic Corporation Panneau d'affichage électroluminescent en matière organique et procédé pour sa fabrication
WO1999026730A1 (fr) * 1997-11-24 1999-06-03 The Trustees Of Princeton University Procede de fabrication de dispositifs electroluminescents organiques et de formation de motifs sur ces derniers
DE19819200A1 (de) * 1998-04-29 1999-11-11 Fraunhofer Ges Forschung Verfahren zur Herstellung von Kontaktstrukturen in Halbleiterbauelementen
DE10116876A1 (de) * 2001-04-04 2002-10-17 Infineon Technologies Ag Selbstjustierte Kontaktdotierung für organische Feldeffekttransistoren
WO2003081687A2 (fr) * 2002-03-20 2003-10-02 International Business Machines Corporation Transistor a effet de champ muni d'un nanotube autoaligne et procede de fabrication correspondant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8012791B2 (en) 2003-09-03 2011-09-06 Cantrele Telecom Co., L.L.C. Electronic components and methods for producing same

Also Published As

Publication number Publication date
US20070087468A1 (en) 2007-04-19
WO2005024972A3 (fr) 2006-08-24
EP1665408A2 (fr) 2006-06-07
US8012791B2 (en) 2011-09-06
WO2005024972A2 (fr) 2005-03-17

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: TECHNISCHE UNIVERSITAET ILMENAU, 98693 ILMENAU, DE

8127 New person/name/address of the applicant

Owner name: CANTRELE TELECOM CO., LLC, WILMINGTON, DEL., US

8128 New person/name/address of the agent

Representative=s name: ENGEL PATENTANWALTSKANZLEI, 98527 SUHL

8110 Request for examination paragraph 44
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120403