DE10340926A1 - Verfahren zur Herstellung von elektronischen Bauelementen - Google Patents
Verfahren zur Herstellung von elektronischen Bauelementen Download PDFInfo
- Publication number
- DE10340926A1 DE10340926A1 DE10340926A DE10340926A DE10340926A1 DE 10340926 A1 DE10340926 A1 DE 10340926A1 DE 10340926 A DE10340926 A DE 10340926A DE 10340926 A DE10340926 A DE 10340926A DE 10340926 A1 DE10340926 A1 DE 10340926A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- photoresist
- electrodes
- electronic components
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 229920002120 photoresistant polymer Polymers 0.000 claims description 19
- 239000012212 insulator Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 2
- 230000005669 field effect Effects 0.000 abstract description 9
- 229920000642 polymer Polymers 0.000 abstract description 5
- 238000005442 molecular electronic Methods 0.000 abstract description 2
- 238000001459 lithography Methods 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- -1 Si 3 N 4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 101150101567 pat-2 gene Proteins 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10340926A DE10340926A1 (de) | 2003-09-03 | 2003-09-03 | Verfahren zur Herstellung von elektronischen Bauelementen |
US10/570,839 US8012791B2 (en) | 2003-09-03 | 2004-09-01 | Electronic components and methods for producing same |
EP04764691A EP1665408A2 (fr) | 2003-09-03 | 2004-09-01 | Procede pour produire des composants electroniques |
PCT/EP2004/009729 WO2005024972A2 (fr) | 2003-09-03 | 2004-09-01 | Procede pour produire des composants electroniques |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10340926A DE10340926A1 (de) | 2003-09-03 | 2003-09-03 | Verfahren zur Herstellung von elektronischen Bauelementen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10340926A1 true DE10340926A1 (de) | 2005-03-31 |
Family
ID=34223364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10340926A Withdrawn DE10340926A1 (de) | 2003-09-03 | 2003-09-03 | Verfahren zur Herstellung von elektronischen Bauelementen |
Country Status (4)
Country | Link |
---|---|
US (1) | US8012791B2 (fr) |
EP (1) | EP1665408A2 (fr) |
DE (1) | DE10340926A1 (fr) |
WO (1) | WO2005024972A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8012791B2 (en) | 2003-09-03 | 2011-09-06 | Cantrele Telecom Co., L.L.C. | Electronic components and methods for producing same |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100686120B1 (ko) * | 2005-05-17 | 2007-02-26 | 엘지전자 주식회사 | 유기 el 소자의 제조방법 |
US20070048894A1 (en) * | 2005-08-26 | 2007-03-01 | Osram Opto Semiconductors Gmbh | System and method for reduced material pileup |
US7935977B2 (en) * | 2006-07-25 | 2011-05-03 | Lg Chem, Ltd. | Method of manufacturing organic light emitting device and organic light emitting device manufactured by using the method |
GB2441355B (en) * | 2006-08-31 | 2009-05-20 | Cambridge Display Tech Ltd | Organic electronic device |
FR2954856B1 (fr) * | 2009-12-30 | 2012-06-15 | Saint Gobain | Cellule photovoltaique organique et module comprenant une telle cellule |
TWI583036B (zh) * | 2013-09-30 | 2017-05-11 | 樂金顯示科技股份有限公司 | 積層體及其製造方法 |
TWI568052B (zh) | 2013-09-30 | 2017-01-21 | 樂金顯示科技股份有限公司 | 用於製造有機發光裝置之方法 |
EP3016161B1 (fr) * | 2013-09-30 | 2019-09-04 | LG Display Co., Ltd. | Dispositif électroluminescent organique |
KR102605208B1 (ko) | 2016-06-28 | 2023-11-24 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
US10438848B2 (en) * | 2017-11-01 | 2019-10-08 | Semi Automation & Technologies, Inc. | Inorganic lift-off profile process for semiconductor wafer processing |
WO2023203429A1 (fr) * | 2022-04-22 | 2023-10-26 | 株式会社半導体エネルギー研究所 | Dispositif à semi-conducteurs et dispositif d'affichage |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0732868A1 (fr) * | 1995-03-13 | 1996-09-18 | Pioneer Electronic Corporation | Panneau d'affichage électroluminescent en matière organique et procédé pour sa fabrication |
WO1999026730A1 (fr) * | 1997-11-24 | 1999-06-03 | The Trustees Of Princeton University | Procede de fabrication de dispositifs electroluminescents organiques et de formation de motifs sur ces derniers |
DE19819200A1 (de) * | 1998-04-29 | 1999-11-11 | Fraunhofer Ges Forschung | Verfahren zur Herstellung von Kontaktstrukturen in Halbleiterbauelementen |
DE10116876A1 (de) * | 2001-04-04 | 2002-10-17 | Infineon Technologies Ag | Selbstjustierte Kontaktdotierung für organische Feldeffekttransistoren |
WO2003081687A2 (fr) * | 2002-03-20 | 2003-10-02 | International Business Machines Corporation | Transistor a effet de champ muni d'un nanotube autoaligne et procede de fabrication correspondant |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3369159A (en) * | 1964-12-21 | 1968-02-13 | Texas Instruments Inc | Printed transistors and methods of making same |
US4180604A (en) * | 1977-12-30 | 1979-12-25 | International Business Machines Corporation | Two layer resist system |
US5091288A (en) * | 1989-10-27 | 1992-02-25 | Rockwell International Corporation | Method of forming detector array contact bumps for improved lift off of excess metal |
JPH06333952A (ja) * | 1993-05-21 | 1994-12-02 | Kyocera Corp | 薄膜トランジスタ |
JPH08172102A (ja) | 1994-12-20 | 1996-07-02 | Murata Mfg Co Ltd | 半導体装置の製造方法 |
DE19534668A1 (de) | 1995-09-19 | 1997-03-20 | Thera Ges Fuer Patente | Kettenverlängerte Epoxidharze enthaltende, vorwiegend kationisch härtende Masse |
US6326640B1 (en) * | 1996-01-29 | 2001-12-04 | Motorola, Inc. | Organic thin film transistor with enhanced carrier mobility |
US6720572B1 (en) * | 1999-06-25 | 2004-04-13 | The Penn State Research Foundation | Organic light emitters with improved carrier injection |
EP1129484A1 (fr) * | 1999-08-24 | 2001-09-05 | Koninklijke Philips Electronics N.V. | Dispositif d'affichage |
EP1243032B1 (fr) * | 1999-12-21 | 2019-11-20 | Flexenable Limited | Circuits integres fabriques par jet d'encre |
GB0013473D0 (en) * | 2000-06-03 | 2000-07-26 | Univ Liverpool | A method of electronic component fabrication and an electronic component |
US6605519B2 (en) * | 2001-05-02 | 2003-08-12 | Unaxis Usa, Inc. | Method for thin film lift-off processes using lateral extended etching masks and device |
US6794220B2 (en) * | 2001-09-05 | 2004-09-21 | Konica Corporation | Organic thin-film semiconductor element and manufacturing method for the same |
DE10153563A1 (de) * | 2001-10-30 | 2003-05-15 | Infineon Technologies Ag | Verringerung des Kontaktwiderstandes in organischen Feldeffekttransistoren durch Einbettung von Nanopartikeln zur Erzeugung von Feldüberhöhungen |
JP4360801B2 (ja) * | 2001-12-25 | 2009-11-11 | シャープ株式会社 | トランジスタおよびそれを用いた表示装置 |
KR100892945B1 (ko) * | 2002-02-22 | 2009-04-09 | 삼성전자주식회사 | 액티브 매트릭스형 유기전계발광 표시장치 및 그 제조방법 |
US6740900B2 (en) * | 2002-02-27 | 2004-05-25 | Konica Corporation | Organic thin-film transistor and manufacturing method for the same |
US20030183915A1 (en) * | 2002-04-02 | 2003-10-02 | Motorola, Inc. | Encapsulated organic semiconductor device and method |
US6946677B2 (en) * | 2002-06-14 | 2005-09-20 | Nokia Corporation | Pre-patterned substrate for organic thin film transistor structures and circuits and related method for making same |
US6764885B2 (en) * | 2002-10-17 | 2004-07-20 | Avery Dennison Corporation | Method of fabricating transistor device |
US6905908B2 (en) * | 2002-12-26 | 2005-06-14 | Motorola, Inc. | Method of fabricating organic field effect transistors |
ITTO20030145A1 (it) * | 2003-02-28 | 2004-09-01 | Infm Istituto Naz Per La Fisi Ca Della Mater | Procedimento per la fabbricazione di dispositivi ad effetto di campo a film sottile privi di substrato e transistore a film sottile organico ottenibile mediante tale procedimento. |
DE10340926A1 (de) | 2003-09-03 | 2005-03-31 | Technische Universität Ilmenau Abteilung Forschungsförderung und Technologietransfer | Verfahren zur Herstellung von elektronischen Bauelementen |
-
2003
- 2003-09-03 DE DE10340926A patent/DE10340926A1/de not_active Withdrawn
-
2004
- 2004-09-01 EP EP04764691A patent/EP1665408A2/fr not_active Withdrawn
- 2004-09-01 WO PCT/EP2004/009729 patent/WO2005024972A2/fr active Application Filing
- 2004-09-01 US US10/570,839 patent/US8012791B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0732868A1 (fr) * | 1995-03-13 | 1996-09-18 | Pioneer Electronic Corporation | Panneau d'affichage électroluminescent en matière organique et procédé pour sa fabrication |
WO1999026730A1 (fr) * | 1997-11-24 | 1999-06-03 | The Trustees Of Princeton University | Procede de fabrication de dispositifs electroluminescents organiques et de formation de motifs sur ces derniers |
DE19819200A1 (de) * | 1998-04-29 | 1999-11-11 | Fraunhofer Ges Forschung | Verfahren zur Herstellung von Kontaktstrukturen in Halbleiterbauelementen |
DE10116876A1 (de) * | 2001-04-04 | 2002-10-17 | Infineon Technologies Ag | Selbstjustierte Kontaktdotierung für organische Feldeffekttransistoren |
WO2003081687A2 (fr) * | 2002-03-20 | 2003-10-02 | International Business Machines Corporation | Transistor a effet de champ muni d'un nanotube autoaligne et procede de fabrication correspondant |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8012791B2 (en) | 2003-09-03 | 2011-09-06 | Cantrele Telecom Co., L.L.C. | Electronic components and methods for producing same |
Also Published As
Publication number | Publication date |
---|---|
US20070087468A1 (en) | 2007-04-19 |
WO2005024972A3 (fr) | 2006-08-24 |
EP1665408A2 (fr) | 2006-06-07 |
US8012791B2 (en) | 2011-09-06 |
WO2005024972A2 (fr) | 2005-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: TECHNISCHE UNIVERSITAET ILMENAU, 98693 ILMENAU, DE |
|
8127 | New person/name/address of the applicant |
Owner name: CANTRELE TELECOM CO., LLC, WILMINGTON, DEL., US |
|
8128 | New person/name/address of the agent |
Representative=s name: ENGEL PATENTANWALTSKANZLEI, 98527 SUHL |
|
8110 | Request for examination paragraph 44 | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20120403 |