DE10333557B8 - Verfahren zur Herstellung einer Speichereinrichtung, Speicherzelle, Speichereinrichtung und Verfahren zum Betrieb der Speichereinrichtung - Google Patents

Verfahren zur Herstellung einer Speichereinrichtung, Speicherzelle, Speichereinrichtung und Verfahren zum Betrieb der Speichereinrichtung Download PDF

Info

Publication number
DE10333557B8
DE10333557B8 DE10333557A DE10333557A DE10333557B8 DE 10333557 B8 DE10333557 B8 DE 10333557B8 DE 10333557 A DE10333557 A DE 10333557A DE 10333557 A DE10333557 A DE 10333557A DE 10333557 B8 DE10333557 B8 DE 10333557B8
Authority
DE
Germany
Prior art keywords
memory device
memory
producing
operating
cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10333557A
Other languages
English (en)
Other versions
DE10333557A1 (de
DE10333557B4 (de
Inventor
Michael Dr. Kund
Thomas Dr. Mikolajick
Cay-Uwe Dr. Pinnow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polaris Innovations Ltd
Original Assignee
Qimonda AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qimonda AG filed Critical Qimonda AG
Priority to DE10333557A priority Critical patent/DE10333557B8/de
Priority to PCT/DE2004/001588 priority patent/WO2005010983A2/de
Priority to KR1020067001512A priority patent/KR100767881B1/ko
Priority to US10/565,578 priority patent/US20070166924A1/en
Priority to CNB2004800275757A priority patent/CN100446183C/zh
Publication of DE10333557A1 publication Critical patent/DE10333557A1/de
Application granted granted Critical
Publication of DE10333557B4 publication Critical patent/DE10333557B4/de
Publication of DE10333557B8 publication Critical patent/DE10333557B8/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009—RRAM elements whose operation depends upon chemical change
    • G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Memories (AREA)
DE10333557A 2003-07-23 2003-07-23 Verfahren zur Herstellung einer Speichereinrichtung, Speicherzelle, Speichereinrichtung und Verfahren zum Betrieb der Speichereinrichtung Expired - Fee Related DE10333557B8 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE10333557A DE10333557B8 (de) 2003-07-23 2003-07-23 Verfahren zur Herstellung einer Speichereinrichtung, Speicherzelle, Speichereinrichtung und Verfahren zum Betrieb der Speichereinrichtung
PCT/DE2004/001588 WO2005010983A2 (de) 2003-07-23 2004-07-21 Speicherzelle und verfahren zur herstellung einer speichereinrichtung
KR1020067001512A KR100767881B1 (ko) 2003-07-23 2004-07-21 메모리 디바이스 제조 방법, 메모리 셀, 메모리 디바이스및 메모리 디바이스 동작 방법
US10/565,578 US20070166924A1 (en) 2003-07-23 2004-07-21 Memory cell and method for fabricating a memory device
CNB2004800275757A CN100446183C (zh) 2003-07-23 2004-07-21 存储单元和用于制作存储器的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10333557A DE10333557B8 (de) 2003-07-23 2003-07-23 Verfahren zur Herstellung einer Speichereinrichtung, Speicherzelle, Speichereinrichtung und Verfahren zum Betrieb der Speichereinrichtung

Publications (3)

Publication Number Publication Date
DE10333557A1 DE10333557A1 (de) 2005-02-24
DE10333557B4 DE10333557B4 (de) 2008-02-14
DE10333557B8 true DE10333557B8 (de) 2008-05-29

Family

ID=34088765

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10333557A Expired - Fee Related DE10333557B8 (de) 2003-07-23 2003-07-23 Verfahren zur Herstellung einer Speichereinrichtung, Speicherzelle, Speichereinrichtung und Verfahren zum Betrieb der Speichereinrichtung

Country Status (5)

Country Link
US (1) US20070166924A1 (de)
KR (1) KR100767881B1 (de)
CN (1) CN100446183C (de)
DE (1) DE10333557B8 (de)
WO (1) WO2005010983A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1717862A3 (de) * 2005-04-28 2012-10-10 Semiconductor Energy Laboratory Co., Ltd. Speicherelement und Halbleiterbauelement
US8890234B2 (en) * 2012-09-05 2014-11-18 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory device
US10163917B2 (en) * 2016-11-01 2018-12-25 Micron Technology, Inc. Cell disturb prevention using a leaker device to reduce excess charge from an electronic device
US10748931B2 (en) * 2018-05-08 2020-08-18 Micron Technology, Inc. Integrated assemblies having ferroelectric transistors with body regions coupled to carrier reservoirs
CN110526923A (zh) * 2019-08-09 2019-12-03 南京邮电大学 一种侧链修饰的卟啉分子及其应用
US20230223066A1 (en) * 2022-01-07 2023-07-13 Ferroelectric Memory Gmbh Memory cell and methods thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327062A (ja) * 1992-05-22 1993-12-10 Sharp Corp 強誘電体記憶素子
US6140672A (en) * 1999-03-05 2000-10-31 Symetrix Corporation Ferroelectric field effect transistor having a gate electrode being electrically connected to the bottom electrode of a ferroelectric capacitor
US6194752B1 (en) * 1997-06-16 2001-02-27 Sanyo Electric Co., Ltd. Dielectric device, dielectric memory and method of fabricating the same
US20010054732A1 (en) * 2000-06-27 2001-12-27 Yoshihisa Kato Semiconductor memory and method for driving the same
US20020070397A1 (en) * 2000-11-17 2002-06-13 Stmicroelectronics S.R.I. Contact structure for a ferroelectric memory device
US20030053351A1 (en) * 2001-09-14 2003-03-20 Sang-Hyun Oh Ferroelectric memory device and method for manufacturing the same
US6559469B1 (en) * 1992-10-23 2003-05-06 Symetrix Corporation Ferroelectric and high dielectric constant transistors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981335A (en) * 1997-11-20 1999-11-09 Vanguard International Semiconductor Corporation Method of making stacked gate memory cell structure
US6051467A (en) * 1998-04-02 2000-04-18 Chartered Semiconductor Manufacturing, Ltd. Method to fabricate a large planar area ONO interpoly dielectric in flash device
US6297989B1 (en) * 1999-02-26 2001-10-02 Micron Technology, Inc. Applications for non-volatile memory cells
US6674121B2 (en) * 2001-12-14 2004-01-06 The Regents Of The University Of California Method and system for molecular charge storage field effect transistor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327062A (ja) * 1992-05-22 1993-12-10 Sharp Corp 強誘電体記憶素子
US6559469B1 (en) * 1992-10-23 2003-05-06 Symetrix Corporation Ferroelectric and high dielectric constant transistors
US6194752B1 (en) * 1997-06-16 2001-02-27 Sanyo Electric Co., Ltd. Dielectric device, dielectric memory and method of fabricating the same
US6140672A (en) * 1999-03-05 2000-10-31 Symetrix Corporation Ferroelectric field effect transistor having a gate electrode being electrically connected to the bottom electrode of a ferroelectric capacitor
US20010054732A1 (en) * 2000-06-27 2001-12-27 Yoshihisa Kato Semiconductor memory and method for driving the same
US20020070397A1 (en) * 2000-11-17 2002-06-13 Stmicroelectronics S.R.I. Contact structure for a ferroelectric memory device
US20030053351A1 (en) * 2001-09-14 2003-03-20 Sang-Hyun Oh Ferroelectric memory device and method for manufacturing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ISHIWARA,H.: Current Status of FET-Type Ferroelectric Memories. In: Proceedings 22nd International Conf. on Microelectronics, Vol. 2, May 2000, S. 423-427 *

Also Published As

Publication number Publication date
CN1856865A (zh) 2006-11-01
KR20060052859A (ko) 2006-05-19
DE10333557A1 (de) 2005-02-24
CN100446183C (zh) 2008-12-24
US20070166924A1 (en) 2007-07-19
WO2005010983A2 (de) 2005-02-03
KR100767881B1 (ko) 2007-10-17
DE10333557B4 (de) 2008-02-14
WO2005010983A3 (de) 2005-03-24

Similar Documents

Publication Publication Date Title
DE602005018416D1 (de) Wärmeübertragungseinrichtung und Verfahren zu Herstellung und Betrieb derselben
ATE419260T1 (de) C-aryl-glucosid-sglt2-inhibitoren und verfahren zu ihrer herstellung
DE602004027079D1 (de) Gleiskette, gleiskettenvorrichtung und verfahren zur herstellung der gleiskette
DE602004016923D1 (de) Gleitelement und Verfahren zum Herstellen des Gleitelements
DE602005020467D1 (de) Dielektrische luneberglinse und verfahren zu ihrer herstellung
DE502004011667D1 (de) Steuergeräteeinheit und verfahren zur herstellung derselben
DE602005014378D1 (de) Verfahren und einrichtung zum erzeugen einer terahertzwelle
DE602004021927D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE502006003563D1 (de) Polyester-polysiloxan-copolymere und verfahren zu deren herstellung
DE602005026097D1 (de) Magnetisches Logikbauelement sowie Verfahren zur Herstellung und zum Betrieb desselben
SG113566A1 (en) Lithographic apparatus and device manufacturing method, as well as a device manufacturing thereby
DE60337036D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE10393101D2 (de) Anordnung aus einem Bauteil und einer Kontrollvorrichtung, Verfahren zum Herstellen der Anordnung und Verwendung der Anordnung
DE60336570D1 (de) Kommunikationsvorrichtung und verfahren zum umkonfigurieren der kommunikationsvorrichtung
DE50310782D1 (de) Piezoaktor und verfahren zu dessen herstellung
SG115686A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
DE602004008991D1 (de) Umlenkbeschlag und verfahren zu dessen herstellung
DE60144157D1 (de) Elektrochemische einrichtung und verfahren zu ihrer herstellung
ATE496046T1 (de) Arylvinylazacycloalkan-verbindungen und verfahren zu deren herstellung und verwendung
SG109611A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
DE502004005578D1 (de) Hochtackige klebmasse, verfahren zu deren herstellung und deren verwendung
DE60333978D1 (de) Vorrichtung zum Kultivieren, Verfahren zur Herstellung dieser Vorrichtung, Verfahren zum Kultivieren
SG110195A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
SG109002A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
SG108996A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: QIMONDA AG, 81739 MUENCHEN, DE

8396 Reprint of erroneous front page
8364 No opposition during term of opposition
R081 Change of applicant/patentee

Owner name: INFINEON TECHNOLOGIES AG, DE

Free format text: FORMER OWNER: QIMONDA AG, 81739 MUENCHEN, DE

Owner name: POLARIS INNOVATIONS LTD., IE

Free format text: FORMER OWNER: QIMONDA AG, 81739 MUENCHEN, DE

R081 Change of applicant/patentee

Owner name: POLARIS INNOVATIONS LTD., IE

Free format text: FORMER OWNER: INFINEON TECHNOLOGIES AG, 85579 NEUBIBERG, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021824700

Ipc: H01L0027115600