DE10296512T5 - Quasi-kontinuierliches diodengepumptes Festkörper-Uv-Lasersystem und Verfahren zu seiner Anwendung - Google Patents
Quasi-kontinuierliches diodengepumptes Festkörper-Uv-Lasersystem und Verfahren zu seiner Anwendung Download PDFInfo
- Publication number
- DE10296512T5 DE10296512T5 DE10296512T DE10296512T DE10296512T5 DE 10296512 T5 DE10296512 T5 DE 10296512T5 DE 10296512 T DE10296512 T DE 10296512T DE 10296512 T DE10296512 T DE 10296512T DE 10296512 T5 DE10296512 T5 DE 10296512T5
- Authority
- DE
- Germany
- Prior art keywords
- laser
- time interval
- current level
- current
- during
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
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- 239000000463 material Substances 0.000 claims abstract description 58
- 238000005086 pumping Methods 0.000 claims abstract description 54
- 239000013077 target material Substances 0.000 claims abstract 10
- 238000005553 drilling Methods 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 8
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- FOXXZZGDIAQPQI-XKNYDFJKSA-N Asp-Pro-Ser-Ser Chemical compound OC(=O)C[C@H](N)C(=O)N1CCC[C@H]1C(=O)N[C@@H](CO)C(=O)N[C@@H](CO)C(O)=O FOXXZZGDIAQPQI-XKNYDFJKSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
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- 239000002245 particle Substances 0.000 description 2
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 241000270730 Alligator mississippiensis Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000009102 absorption Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
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- 239000003990 capacitor Substances 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 201000009482 yaws Diseases 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27524601P | 2001-03-12 | 2001-03-12 | |
| US60/275,246 | 2001-03-12 | ||
| PCT/US2002/007486 WO2002073322A1 (en) | 2001-03-12 | 2002-03-12 | Quasi-cw diode-pumped, solid-state uv laser system and method employing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10296512T5 true DE10296512T5 (de) | 2004-04-29 |
Family
ID=23051465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10296512T Ceased DE10296512T5 (de) | 2001-03-12 | 2002-03-12 | Quasi-kontinuierliches diodengepumptes Festkörper-Uv-Lasersystem und Verfahren zu seiner Anwendung |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JP4583711B2 (enExample) |
| KR (1) | KR100853254B1 (enExample) |
| CN (1) | CN100351719C (enExample) |
| CA (1) | CA2440694A1 (enExample) |
| DE (1) | DE10296512T5 (enExample) |
| GB (1) | GB2390994B (enExample) |
| TW (1) | TW523435B (enExample) |
| WO (1) | WO2002073322A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100985018B1 (ko) * | 2010-04-06 | 2010-10-04 | 주식회사 엘앤피아너스 | 기판 가공 장치 |
| AU2013380267B2 (en) * | 2013-02-27 | 2017-03-30 | Alcon Inc. | Laser apparatus and method for laser processing a target material |
| CN105142853B (zh) * | 2013-02-28 | 2017-07-04 | Ipg光子公司 | 用于加工蓝宝石的激光系统和方法 |
| CN111478173B (zh) * | 2020-05-19 | 2021-03-05 | 中国科学院福建物质结构研究所 | 一种1.5微米被动调q激光器 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2547519B1 (fr) * | 1983-06-15 | 1987-07-03 | Snecma | Procede et dispositif de percage par laser |
| US5477043A (en) | 1989-10-30 | 1995-12-19 | Symbol Technologies, Inc. | Scanning arrangement for the implementation of scanning patterns over indicia by driving the scanning elements in different component directions |
| DE59006631D1 (de) * | 1990-06-05 | 1994-09-01 | Audemars S A R | Verfahren und Vorrichtung zum Schneiden von Material. |
| JPH0529693A (ja) * | 1990-09-19 | 1993-02-05 | Hitachi Ltd | マルチパルスレーザ発生装置、及びその方法、並びにそのマルチパルスレーザを用いた加工方法 |
| US5293025A (en) * | 1991-08-01 | 1994-03-08 | E. I. Du Pont De Nemours And Company | Method for forming vias in multilayer circuits |
| JP3315556B2 (ja) * | 1994-04-27 | 2002-08-19 | 三菱電機株式会社 | レーザ加工装置 |
| US5593606A (en) * | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
| US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US5751585A (en) | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
| JPH09163984A (ja) * | 1995-10-12 | 1997-06-24 | Sony Corp | 遺伝子組替え用レーザ装置およびこれを用いた遺伝子組替え方法 |
| US5822211A (en) | 1996-11-13 | 1998-10-13 | International Business Machines Corporation | Laser texturing apparatus with dual laser paths having an independently adjusted parameter |
| US5943351A (en) * | 1997-05-16 | 1999-08-24 | Excel/Quantronix, Inc. | Intra-cavity and inter-cavity harmonics generation in high-power lasers |
| JP4500374B2 (ja) * | 1997-05-27 | 2010-07-14 | ジェイディーエス ユニフエイズ コーポレーション | レーザーマーキングシステムおよびエネルギー制御方法 |
| US6188704B1 (en) | 1998-01-26 | 2001-02-13 | Rocky Mountain Instrument Co. | Diode-pumped laser drive |
| JPH11267867A (ja) * | 1998-03-23 | 1999-10-05 | Seiko Epson Corp | レーザ加工方法及び装置 |
| US6197133B1 (en) * | 1999-02-16 | 2001-03-06 | General Electric Company | Short-pulse high-peak laser shock peening |
| JP2000301372A (ja) * | 1999-04-23 | 2000-10-31 | Seiko Epson Corp | 透明材料のレーザ加工方法 |
| US6252195B1 (en) * | 1999-04-26 | 2001-06-26 | Ethicon, Inc. | Method of forming blind holes in surgical needles using a diode pumped Nd-YAG laser |
-
2002
- 2002-03-12 CN CNB028064038A patent/CN100351719C/zh not_active Expired - Fee Related
- 2002-03-12 WO PCT/US2002/007486 patent/WO2002073322A1/en not_active Ceased
- 2002-03-12 KR KR1020037011920A patent/KR100853254B1/ko not_active Expired - Fee Related
- 2002-03-12 TW TW091104537A patent/TW523435B/zh not_active IP Right Cessation
- 2002-03-12 GB GB0323441A patent/GB2390994B/en not_active Expired - Fee Related
- 2002-03-12 CA CA002440694A patent/CA2440694A1/en not_active Abandoned
- 2002-03-12 DE DE10296512T patent/DE10296512T5/de not_active Ceased
- 2002-03-12 JP JP2002572515A patent/JP4583711B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB2390994A (en) | 2004-01-28 |
| WO2002073322A1 (en) | 2002-09-19 |
| KR100853254B1 (ko) | 2008-08-21 |
| KR20030087017A (ko) | 2003-11-12 |
| CN1714318A (zh) | 2005-12-28 |
| GB2390994B (en) | 2004-10-13 |
| JP4583711B2 (ja) | 2010-11-17 |
| GB0323441D0 (en) | 2003-11-05 |
| CA2440694A1 (en) | 2002-09-19 |
| JP2004528984A (ja) | 2004-09-24 |
| TW523435B (en) | 2003-03-11 |
| CN100351719C (zh) | 2007-11-28 |
| WO2002073322B1 (en) | 2003-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8125 | Change of the main classification |
Ipc: B23K 26/36 AFI20051017BHDE |
|
| 8131 | Rejection |