KR100853254B1 - 콰자이-ｃｗ 다이오드-펌핑, 고체 ｕｖ 레이저 시스템 및이 시스템을 사용하는 방법 - Google Patents

콰자이-ｃｗ 다이오드-펌핑, 고체 ｕｖ 레이저 시스템 및이 시스템을 사용하는 방법 Download PDF

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Publication number
KR100853254B1
KR100853254B1 KR1020037011920A KR20037011920A KR100853254B1 KR 100853254 B1 KR100853254 B1 KR 100853254B1 KR 1020037011920 A KR1020037011920 A KR 1020037011920A KR 20037011920 A KR20037011920 A KR 20037011920A KR 100853254 B1 KR100853254 B1 KR 100853254B1
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South Korea
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laser
current
time interval
during
pumping
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English (en)
Korean (ko)
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KR20030087017A (ko
Inventor
리차드 에스. 해리스
윤롱 선
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일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
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Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20030087017A publication Critical patent/KR20030087017A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
KR1020037011920A 2001-03-12 2002-03-12 콰자이-ｃｗ 다이오드-펌핑, 고체 ｕｖ 레이저 시스템 및이 시스템을 사용하는 방법 Expired - Fee Related KR100853254B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27524601P 2001-03-12 2001-03-12
US60/275,246 2001-03-12
PCT/US2002/007486 WO2002073322A1 (en) 2001-03-12 2002-03-12 Quasi-cw diode-pumped, solid-state uv laser system and method employing same

Publications (2)

Publication Number Publication Date
KR20030087017A KR20030087017A (ko) 2003-11-12
KR100853254B1 true KR100853254B1 (ko) 2008-08-21

Family

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Family Applications (1)

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KR1020037011920A Expired - Fee Related KR100853254B1 (ko) 2001-03-12 2002-03-12 콰자이-ｃｗ 다이오드-펌핑, 고체 ｕｖ 레이저 시스템 및이 시스템을 사용하는 방법

Country Status (8)

Country Link
JP (1) JP4583711B2 (enExample)
KR (1) KR100853254B1 (enExample)
CN (1) CN100351719C (enExample)
CA (1) CA2440694A1 (enExample)
DE (1) DE10296512T5 (enExample)
GB (1) GB2390994B (enExample)
TW (1) TW523435B (enExample)
WO (1) WO2002073322A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100985018B1 (ko) * 2010-04-06 2010-10-04 주식회사 엘앤피아너스 기판 가공 장치
AU2013380267B2 (en) * 2013-02-27 2017-03-30 Alcon Inc. Laser apparatus and method for laser processing a target material
CN105142853B (zh) * 2013-02-28 2017-07-04 Ipg光子公司 用于加工蓝宝石的激光系统和方法
CN111478173B (zh) * 2020-05-19 2021-03-05 中国科学院福建物质结构研究所 一种1.5微米被动调q激光器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5293025A (en) 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US5481099A (en) 1989-10-30 1996-01-02 Symbol Technologies, Inc. Scanning arrangement for the implementation of omni-directional scanning patterns over indicia
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5822211A (en) 1996-11-13 1998-10-13 International Business Machines Corporation Laser texturing apparatus with dual laser paths having an independently adjusted parameter
US6188704B1 (en) 1998-01-26 2001-02-13 Rocky Mountain Instrument Co. Diode-pumped laser drive

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2547519B1 (fr) * 1983-06-15 1987-07-03 Snecma Procede et dispositif de percage par laser
DE59006631D1 (de) * 1990-06-05 1994-09-01 Audemars S A R Verfahren und Vorrichtung zum Schneiden von Material.
JPH0529693A (ja) * 1990-09-19 1993-02-05 Hitachi Ltd マルチパルスレーザ発生装置、及びその方法、並びにそのマルチパルスレーザを用いた加工方法
JP3315556B2 (ja) * 1994-04-27 2002-08-19 三菱電機株式会社 レーザ加工装置
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JPH09163984A (ja) * 1995-10-12 1997-06-24 Sony Corp 遺伝子組替え用レーザ装置およびこれを用いた遺伝子組替え方法
US5943351A (en) * 1997-05-16 1999-08-24 Excel/Quantronix, Inc. Intra-cavity and inter-cavity harmonics generation in high-power lasers
JP4500374B2 (ja) * 1997-05-27 2010-07-14 ジェイディーエス ユニフエイズ コーポレーション レーザーマーキングシステムおよびエネルギー制御方法
JPH11267867A (ja) * 1998-03-23 1999-10-05 Seiko Epson Corp レーザ加工方法及び装置
US6197133B1 (en) * 1999-02-16 2001-03-06 General Electric Company Short-pulse high-peak laser shock peening
JP2000301372A (ja) * 1999-04-23 2000-10-31 Seiko Epson Corp 透明材料のレーザ加工方法
US6252195B1 (en) * 1999-04-26 2001-06-26 Ethicon, Inc. Method of forming blind holes in surgical needles using a diode pumped Nd-YAG laser

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5481099A (en) 1989-10-30 1996-01-02 Symbol Technologies, Inc. Scanning arrangement for the implementation of omni-directional scanning patterns over indicia
US5293025A (en) 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5822211A (en) 1996-11-13 1998-10-13 International Business Machines Corporation Laser texturing apparatus with dual laser paths having an independently adjusted parameter
US6188704B1 (en) 1998-01-26 2001-02-13 Rocky Mountain Instrument Co. Diode-pumped laser drive

Also Published As

Publication number Publication date
GB2390994A (en) 2004-01-28
WO2002073322A1 (en) 2002-09-19
KR20030087017A (ko) 2003-11-12
CN1714318A (zh) 2005-12-28
GB2390994B (en) 2004-10-13
JP4583711B2 (ja) 2010-11-17
DE10296512T5 (de) 2004-04-29
GB0323441D0 (en) 2003-11-05
CA2440694A1 (en) 2002-09-19
JP2004528984A (ja) 2004-09-24
TW523435B (en) 2003-03-11
CN100351719C (zh) 2007-11-28
WO2002073322B1 (en) 2003-02-20

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