CN100351719C - 准连续波二极管泵浦固体紫外激光系统及其使用方法 - Google Patents

准连续波二极管泵浦固体紫外激光系统及其使用方法 Download PDF

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Publication number
CN100351719C
CN100351719C CNB028064038A CN02806403A CN100351719C CN 100351719 C CN100351719 C CN 100351719C CN B028064038 A CNB028064038 A CN B028064038A CN 02806403 A CN02806403 A CN 02806403A CN 100351719 C CN100351719 C CN 100351719C
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China
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laser
current
current level
time interval
output
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Expired - Fee Related
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CNB028064038A
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English (en)
Chinese (zh)
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CN1714318A (zh
Inventor
Y·孙
R·S·哈里斯
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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Publication of CN1714318A publication Critical patent/CN1714318A/zh
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Publication of CN100351719C publication Critical patent/CN100351719C/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
CNB028064038A 2001-03-12 2002-03-12 准连续波二极管泵浦固体紫外激光系统及其使用方法 Expired - Fee Related CN100351719C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27524601P 2001-03-12 2001-03-12
US60/275,246 2001-03-12

Publications (2)

Publication Number Publication Date
CN1714318A CN1714318A (zh) 2005-12-28
CN100351719C true CN100351719C (zh) 2007-11-28

Family

ID=23051465

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028064038A Expired - Fee Related CN100351719C (zh) 2001-03-12 2002-03-12 准连续波二极管泵浦固体紫外激光系统及其使用方法

Country Status (8)

Country Link
JP (1) JP4583711B2 (enExample)
KR (1) KR100853254B1 (enExample)
CN (1) CN100351719C (enExample)
CA (1) CA2440694A1 (enExample)
DE (1) DE10296512T5 (enExample)
GB (1) GB2390994B (enExample)
TW (1) TW523435B (enExample)
WO (1) WO2002073322A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100985018B1 (ko) * 2010-04-06 2010-10-04 주식회사 엘앤피아너스 기판 가공 장치
AU2013380267B2 (en) * 2013-02-27 2017-03-30 Alcon Inc. Laser apparatus and method for laser processing a target material
CN105142853B (zh) * 2013-02-28 2017-07-04 Ipg光子公司 用于加工蓝宝石的激光系统和方法
CN111478173B (zh) * 2020-05-19 2021-03-05 中国科学院福建物质结构研究所 一种1.5微米被动调q激光器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1115703A (zh) * 1994-04-18 1996-01-31 三菱电机株式会社 激光加工设备及其控制方法
US5822211A (en) * 1996-11-13 1998-10-13 International Business Machines Corporation Laser texturing apparatus with dual laser paths having an independently adjusted parameter
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US6188704B1 (en) * 1998-01-26 2001-02-13 Rocky Mountain Instrument Co. Diode-pumped laser drive

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2547519B1 (fr) * 1983-06-15 1987-07-03 Snecma Procede et dispositif de percage par laser
US5477043A (en) 1989-10-30 1995-12-19 Symbol Technologies, Inc. Scanning arrangement for the implementation of scanning patterns over indicia by driving the scanning elements in different component directions
DE59006631D1 (de) * 1990-06-05 1994-09-01 Audemars S A R Verfahren und Vorrichtung zum Schneiden von Material.
JPH0529693A (ja) * 1990-09-19 1993-02-05 Hitachi Ltd マルチパルスレーザ発生装置、及びその方法、並びにそのマルチパルスレーザを用いた加工方法
US5293025A (en) * 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
JPH09163984A (ja) * 1995-10-12 1997-06-24 Sony Corp 遺伝子組替え用レーザ装置およびこれを用いた遺伝子組替え方法
US5943351A (en) * 1997-05-16 1999-08-24 Excel/Quantronix, Inc. Intra-cavity and inter-cavity harmonics generation in high-power lasers
JP4500374B2 (ja) * 1997-05-27 2010-07-14 ジェイディーエス ユニフエイズ コーポレーション レーザーマーキングシステムおよびエネルギー制御方法
JPH11267867A (ja) * 1998-03-23 1999-10-05 Seiko Epson Corp レーザ加工方法及び装置
US6197133B1 (en) * 1999-02-16 2001-03-06 General Electric Company Short-pulse high-peak laser shock peening
JP2000301372A (ja) * 1999-04-23 2000-10-31 Seiko Epson Corp 透明材料のレーザ加工方法
US6252195B1 (en) * 1999-04-26 2001-06-26 Ethicon, Inc. Method of forming blind holes in surgical needles using a diode pumped Nd-YAG laser

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1115703A (zh) * 1994-04-18 1996-01-31 三菱电机株式会社 激光加工设备及其控制方法
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
CN1213997A (zh) * 1996-05-17 1999-04-14 电科学工业公司 采用可变功率密度的紫外激光脉冲在多层靶上形成盲通道的方法
US5822211A (en) * 1996-11-13 1998-10-13 International Business Machines Corporation Laser texturing apparatus with dual laser paths having an independently adjusted parameter
US6188704B1 (en) * 1998-01-26 2001-02-13 Rocky Mountain Instrument Co. Diode-pumped laser drive

Also Published As

Publication number Publication date
GB2390994A (en) 2004-01-28
WO2002073322A1 (en) 2002-09-19
KR100853254B1 (ko) 2008-08-21
KR20030087017A (ko) 2003-11-12
CN1714318A (zh) 2005-12-28
GB2390994B (en) 2004-10-13
JP4583711B2 (ja) 2010-11-17
DE10296512T5 (de) 2004-04-29
GB0323441D0 (en) 2003-11-05
CA2440694A1 (en) 2002-09-19
JP2004528984A (ja) 2004-09-24
TW523435B (en) 2003-03-11
WO2002073322B1 (en) 2003-02-20

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Granted publication date: 20071128

Termination date: 20160312