DE102020116018A1 - Sensor - Google Patents

Sensor Download PDF

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Publication number
DE102020116018A1
DE102020116018A1 DE102020116018.6A DE102020116018A DE102020116018A1 DE 102020116018 A1 DE102020116018 A1 DE 102020116018A1 DE 102020116018 A DE102020116018 A DE 102020116018A DE 102020116018 A1 DE102020116018 A1 DE 102020116018A1
Authority
DE
Germany
Prior art keywords
sensor
housing
sensor element
silicone resin
electrical lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102020116018.6A
Other languages
German (de)
English (en)
Inventor
Abraham Kho
Andi Permana
Heinz Strallhofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
TDK Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Electronics AG filed Critical TDK Electronics AG
Priority to DE102020116018.6A priority Critical patent/DE102020116018A1/de
Priority to CN202180005093.5A priority patent/CN114364949A/zh
Priority to JP2022508858A priority patent/JP7307268B2/ja
Priority to EP21734085.0A priority patent/EP4168746A1/fr
Priority to PCT/EP2021/066067 priority patent/WO2021255005A1/fr
Priority to US17/633,334 priority patent/US20220291053A1/en
Publication of DE102020116018A1 publication Critical patent/DE102020116018A1/de
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R22/00—Arrangements for measuring time integral of electric power or current, e.g. electricity meters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
DE102020116018.6A 2020-06-17 2020-06-17 Sensor Pending DE102020116018A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102020116018.6A DE102020116018A1 (de) 2020-06-17 2020-06-17 Sensor
CN202180005093.5A CN114364949A (zh) 2020-06-17 2021-06-15 具有壳体和硅树脂填充物的传感器
JP2022508858A JP7307268B2 (ja) 2020-06-17 2021-06-15 センサ
EP21734085.0A EP4168746A1 (fr) 2020-06-17 2021-06-15 Capteur doté d'un boîtier et d'une charge en résine de silicone
PCT/EP2021/066067 WO2021255005A1 (fr) 2020-06-17 2021-06-15 Capteur doté d'un boîtier et d'une charge en résine de silicone
US17/633,334 US20220291053A1 (en) 2020-06-17 2021-06-15 Sensor with Housing and Silicone Resin Filler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020116018.6A DE102020116018A1 (de) 2020-06-17 2020-06-17 Sensor

Publications (1)

Publication Number Publication Date
DE102020116018A1 true DE102020116018A1 (de) 2021-12-23

Family

ID=76584493

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102020116018.6A Pending DE102020116018A1 (de) 2020-06-17 2020-06-17 Sensor

Country Status (6)

Country Link
US (1) US20220291053A1 (fr)
EP (1) EP4168746A1 (fr)
JP (1) JP7307268B2 (fr)
CN (1) CN114364949A (fr)
DE (1) DE102020116018A1 (fr)
WO (1) WO2021255005A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2351956C2 (de) 1972-10-24 1982-12-30 Texas Instruments Inc., 75222 Dallas, Tex. Eingekapseltes Heizelement mit positivem Temperaturkoeffizient
DE10360542A1 (de) 2003-12-22 2005-07-28 Epcos Ag Meßfühler, Verfahren zu dessen Herstellung und elektrisches Gerät mit dem Meßfühler
DE60130065T2 (de) 2000-06-12 2008-05-15 Hitachi, Ltd. Elektronische Vorrichtung und Halbleitervorrichtung
DE102019129521A1 (de) 2019-08-26 2021-03-04 Tdk Electronics Ag Sensor

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931427A (ja) * 1982-08-14 1984-02-20 Matsushita Electric Works Ltd センサ−部のシリコン樹脂の充填方法
DE29913950U1 (de) * 1999-08-10 2000-12-21 David & Baader DBK Spezialfabrik elektrischer Apparate und Heizwiderstände GmbH, 76870 Kandel Temperaturfühler
JP2001141573A (ja) 1999-11-17 2001-05-25 Denso Corp 温度センサ
JP4620400B2 (ja) * 2004-07-16 2011-01-26 日本特殊陶業株式会社 温度センサ、温度センサの製造方法
JP4530169B2 (ja) 2005-12-09 2010-08-25 Ｔｄｋ株式会社 サーミスタ装置、及び、サーミスタ装置の製造方法
DE102006034248B3 (de) * 2006-07-21 2007-10-18 Beru Ag Temperaturfühler für ein Widerstandsthermometer, insbesondere zur Verwendung im Abgasstrang von Verbrennungsmotoren
JP2008203031A (ja) * 2007-02-19 2008-09-04 Valcom:Kk 圧力センサ
DE102007010403B4 (de) * 2007-03-01 2016-02-11 Heraeus Sensor Technology Gmbh Temperatursensor und dessen Verwendung in einer Turboladerüberhitzungssicherung
CN101583858B (zh) 2007-06-19 2011-11-09 株式会社村田制作所 带引线的温度传感器
EP2093548B1 (fr) * 2008-02-20 2017-03-22 UST Umweltsensortechnik GmbH Capteur de haute température et son procédé de fabrication
JP2009300237A (ja) 2008-06-12 2009-12-24 Denso Corp 温度センサおよびその製造方法
JP2010032237A (ja) 2008-07-25 2010-02-12 Worldwing Co Ltd 温度センサ
JP5262448B2 (ja) * 2008-08-28 2013-08-14 Ｔｄｋ株式会社 サーミスタ
JP5523982B2 (ja) * 2010-08-16 2014-06-18 株式会社芝浦電子 温度センサ
JP5574117B2 (ja) 2011-03-30 2014-08-20 三菱マテリアル株式会社 温度センサ
US20130248777A1 (en) * 2012-03-26 2013-09-26 Heraeus Precious Metals North America Conshohocken Llc Low silver content paste composition and method of making a conductive film therefrom
DE102012110822A1 (de) 2012-11-12 2014-05-15 Epcos Ag Temperatursensorsystem und Verfahren zur Herstellung eines Temperatursensorsystems
JP6350400B2 (ja) 2014-10-31 2018-07-04 株式会社デンソー 温度センサ
CN105258820A (zh) 2015-11-05 2016-01-20 广东爱晟电子科技有限公司 一种用硅树脂封装的温度传感器的制作方法及温度传感器
CN106225945B (zh) * 2016-07-26 2018-10-09 肇庆爱晟传感器技术有限公司 一种防水防潮温度传感器及其制备方法
DE102016118522B4 (de) * 2016-09-29 2021-03-25 Sick Atech Gmbh Positionssensor
CN108088577A (zh) * 2017-11-30 2018-05-29 四川泛华航空仪表电器有限公司 一种温度传感器封装结构
JP6756342B2 (ja) 2018-04-03 2020-09-16 Tdk株式会社 温度センサ装置
EP3842775B1 (fr) * 2019-11-15 2022-09-21 Shibaura Electronics Co., Ltd. Capteur de température, élément de capteur de température et procédé de fabrication d'un capteur de température

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2351956C2 (de) 1972-10-24 1982-12-30 Texas Instruments Inc., 75222 Dallas, Tex. Eingekapseltes Heizelement mit positivem Temperaturkoeffizient
DE60130065T2 (de) 2000-06-12 2008-05-15 Hitachi, Ltd. Elektronische Vorrichtung und Halbleitervorrichtung
DE10360542A1 (de) 2003-12-22 2005-07-28 Epcos Ag Meßfühler, Verfahren zu dessen Herstellung und elektrisches Gerät mit dem Meßfühler
DE102019129521A1 (de) 2019-08-26 2021-03-04 Tdk Electronics Ag Sensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LITTLE, Alistair: Leistungsstarke Harze zum Schutz von elektronischen Systemen. Online-Artikel vom 24.10.2016. URL: https://www.all-electronics.de/leistungsstarke-harze-zum-schutz-von-elektronischen-systemen/ [abgerufen am 22.3.21]

Also Published As

Publication number Publication date
EP4168746A1 (fr) 2023-04-26
JP2022544658A (ja) 2022-10-20
CN114364949A (zh) 2022-04-15
US20220291053A1 (en) 2022-09-15
JP7307268B2 (ja) 2023-07-11
WO2021255005A1 (fr) 2021-12-23

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