EP1568978B1 - Capteur de température - Google Patents

Capteur de température Download PDF

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Publication number
EP1568978B1
EP1568978B1 EP05101048.6A EP05101048A EP1568978B1 EP 1568978 B1 EP1568978 B1 EP 1568978B1 EP 05101048 A EP05101048 A EP 05101048A EP 1568978 B1 EP1568978 B1 EP 1568978B1
Authority
EP
European Patent Office
Prior art keywords
temperature sensor
temperature
substrate
sensitive element
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05101048.6A
Other languages
German (de)
English (en)
Other versions
EP1568978A1 (fr
Inventor
Stephan Jonas
Norbert Reichenbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1568978A1 publication Critical patent/EP1568978A1/fr
Application granted granted Critical
Publication of EP1568978B1 publication Critical patent/EP1568978B1/fr
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/20—Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a temperature sensor, in particular for semiconductor devices.
  • Temperature sensors are known in which temperature-sensitive elements in SMD design are used.
  • SMD element offers cost and manufacturing advantages over conventional temperature sensors.
  • considerable measurement errors also occur here, in particular if the sensor element is subjected to forced convection, for example caused by a fan.
  • EP 0 547 750 A1 is a arranged on an electrically insulating support layer temperature sensor, which can be provided with a thermally insulating housing. Alternatively, it is described to encapsulate the temperature sensor by means of a plastic material. Both measures lead, inter alia, to a reduction in the thermal effects of the connection lines on the temperature sensor. The accuracy of the temperature measurement can thus be increased slightly, but is still not satisfactory.
  • the temperature sensor located in a housing in this case has a sensor element and an outwardly leading connection cable. This temperature sensor enables a defined heat transfer.
  • the penetrating into the housing heat flow is divided into at least two partial streams, wherein the partial flow is passed to the sensor element via a higher thermal resistance than the partial flow to the connecting cable.
  • the object of the present invention is to enable an even more accurate, independent of the ambient conditions temperature measurement. This object is achieved by a temperature sensor according to claim 1.
  • a basic idea of the invention is to minimize measurement errors by a novel design of the temperature sensor.
  • a surface-mountable design (SMD construction) executed arranged temperature-sensitive element.
  • SMD construction surface-mountable design
  • the temperature-sensitive element for example a thermistor (temperature-dependent resistor)
  • the thickness of the carrier is chosen as thin as possible according to the required electrical isolation capability and the manufacturing requirements.
  • the thermal resistance of the carrier is, the lower the temperature differences on the insulating support, which are caused by parasitic heat flows.
  • the cover is designed such that it preferably causes an electrical insulation of all applied to the support electrically conductive parts and ensures thermal insulation of at least the temperature-sensitive element.
  • the cover is formed by a poorly heat-conductive casting with sufficient electrical insulation properties, which is enclosed by a lid.
  • the encapsulation covers at least the temperature-sensitive element, but preferably all applied to the carrier electrical components, so that a sufficient electrical and thermal insulation is given. As a result, attention to creepage distances and clearances is not necessary, which allows a small design. At the same time, the encapsulation takes over the function of a strain relief for the connection lines of the temperature-sensitive element.
  • the temperature sensor according to the invention is not only inexpensive to produce. He also has comparatively small dimensions, so that an application under tight space conditions is possible.
  • the temperature sensor can also be used for potential differences between the measuring object and the temperature evaluation unit. The influence of the measurement result due to high temperature differences, for example 120 K, between the measuring point and the environment is minimal.
  • the cooling conditions to which the temperature sensor is exposed at the installation site also have only a minor influence on the measurement result.
  • the temperature sensor according to the invention can, for example in the measurement of the temperature of a heat sink, on which a semiconductor device is arranged, are used.
  • the temperature of the semiconductor component can be determined with the measured heat sink temperature with the aid of a temperature evaluation unit and converted into suitable control signals for the semiconductor component by a control unit. This makes it possible, for example, to turn off the semiconductor device when exceeding a maximum semiconductor temperature.
  • the semiconductor temperature can be determined more accurately, with a tighter dimensioning of the semiconductor device without a larger margin of safety and thus a saving of material and / or manufacturing costs is possible.
  • the temperature sensor is not limited to use with semiconductor devices. He is rather universally applicable.
  • the cover preferably encloses or encloses in the manner of a bell, preferably all the electrically conductive parts applied to the carrier.
  • the lid is preferably connected directly to the carrier and forms a kind of housing together with the carrier.
  • the lid is preferably made of a thermally and electrically insulating material, for example of a plastic material.
  • a particularly secure mounting is possible when the lid is positively connected using adhesive with the carrier.
  • To the dimensions of the carrier as low as possible keep the adhesive seam sufficiently electrically insulated in order to avoid a flashover.
  • the reaction time of the temperature-sensitive element is comparatively short in this embodiment, since no potting material has to be heated. Therefore, this embodiment of the temperature sensor is particularly suitable for applications in which it depends on a rapid detection of temperature fluctuations.
  • the lid is pressed onto the carrier while forming a latching, snap-fitting or clamping connection.
  • Lid and / or carrier are designed accordingly for this purpose. They have or corresponding latching, snap or clamping elements and / or are matched in their dimensions to form such compounds to each other. For a particularly simple, yet secure fixation is possible.
  • the lid when the lid forms a casting mold for the casting in the assembled state.
  • the lid for this purpose has at least one opening through which the potting material can be filled.
  • This embodiment is particularly suitable for the use of liquid potting material. Lid and carrier then form a mold that fixes the potting until curing.
  • connection surfaces applied to the support for electrical contacting of the temperature-sensitive element are arranged spatially separated from the temperature-sensitive element by connecting lines. This serves to avoid parasitic heat flows from the temperature-sensitive element to the connection lines.
  • the interconnects formed on the carrier for electrical connection of the temperature-sensitive element to the connection surfaces have the smallest possible cross-section.
  • the temperature-sensitive element is preferably connected via irregular, in particular meandering or zigzag running conductor tracks with the pads for the connecting lines. This also serves to minimize parasitic heat flows from the temperature-sensitive element to the connecting lines.
  • the temperature-sensitive element has contact surfaces for contacting the carrier. These have according to the invention at least twice the base area of the temperature-sensitive element. By this measure, the heat flow from the measurement object is concentrated on the temperature-sensitive element. The thermal coupling to the measurement object is improved, which reduces the influence of parasitic heat flows.
  • the carrier consists of a printed circuit board material.
  • a printed circuit board material having a thickness of 0.5 to 1.0 mm is preferably used.
  • a thin carrier for a good thermal coupling of the temperature-sensitive element is in principle the use of a thin carrier as an advantage.
  • a two-sided copper-clad printed circuit board material with a thickness of 0.5 to 1.0 mm is used as the carrier.
  • the copper cladding is achieved that in the case of a non-planar resting of the carrier on the measuring object in the region of the temperature-sensitive element and heat flows from such areas that lie flat, are passed to the temperature-sensitive element.
  • an electrically insulating, thermally conductive ceramic is used in a further embodiment of the invention as a carrier material.
  • Such ceramics have, compared to printed circuit board material, a much higher thermal conductivity. Parasitic heat flows only play a minor role.
  • carrier thicknesses in the range of 0.4 to 0.63 mm have proved to be particularly advantageous. To increase the handling and assembly safety and to avoid damage to the carrier high-strength ceramics are preferably used.
  • suitable fastening means are provided in a further embodiment of the invention.
  • one-hole fasteners have been found to be particularly suitable.
  • the carrier has a preferably centrally arranged attachment opening for forming a screw or plug connection or the like.
  • the temperature sensor can be glued to the test object.
  • FIG. 1 shows a temperature sensor 1 according to the invention with a square support 2 and arranged thereon a temperature-sensitive element 3 in SMD construction.
  • the temperature-sensitive element 3 has two contact surfaces 4, 5 made of copper, which are connected to the carrier 2 by a solder joint. From the temperature-sensitive element 3 with its two contact surfaces 4, 5 go two conductor tracks 6, 7 to each one of the temperature-sensitive element 3 spaced terminal surface 8, 9, to each of which a connecting line 22 (see. FIG. 3 ) is soldered.
  • the carrier material is standard circuit board material FR4 of thickness 0.6 mm.
  • the dimensions of the carrier 2 are 12 x 12 x 0.6 mm (L x W x H). It is copper-clad on both sides.
  • the insulation resistance of the carrier 2 is sufficient for operating voltages up to 1000 V AC.
  • the carrier 2 has a centrally disposed bore 10 for attachment to a heat sink of a semiconductor element or the like (not shown).
  • the temperature sensor 1 is formed in the manner of a housing in this embodiment. This is composed on the one hand from the carrier 2 and on the other hand from a housing cover 11 made of polyamide. A temperature sensor 1 with attached housing cover 11 shows FIG. 2 , The housing cover 11 covers the components applied to the carrier 2. To form a one-hole screw fastening, the housing cover 11 has on its upper side 12 a to the bore 10 in the carrier 2 in alignment arranged centrally opening 13 which extends as limited by a side wall 14 implementation 15 to the bottom 16 of the housing cover 11 out.
  • housing cover 11 For fixing the housing cover 11, this is pressed onto the carrier 2, cf. FIG. 3 , The outer walls 17 of the housing cover 11 are connected to the boundary edges 18 of the carrier 2. The side wall 14 of the bushing 15 rests on the carrier 2 in the mounted state. Housing cover 11 and support 2 form in other words a housing with a leading around the bushing chamber 19. 19 This chamber 19 forms the mold for a potting 20, which after assembly of the housing cover 11 by one or more of the top 12 of the housing cover 11 provided four further housing openings 21 is filled.
  • a potting material for example, a two-component epoxy resin such as araldite or the like can be used.
  • the potting 20 fills the chamber 19 at least partially such that the components applied to the carrier 2 are covered. Preferably, however, the chamber 19 is completely filled with the potting material.
  • the casting 20 assumes both the thermal insulation of the temperature-sensitive Elements 3 and the electrical insulation of all electrically conductive parts 4, 5, 6, 7, 8, 9 within the chamber 19.
  • the connection lines 22 are guided through two of the housing openings 20 to the outside.
  • a housing cover 11 is glued to the carrier 2.
  • the adhesive seams 23 extend both on the outer walls 17 of the housing cover 11 and on the side wall 14 of the passage 15. The bonding is carried out so that the electrical insulation between a below the support 2 arranged heat sink (not shown) and the electrically conductive Parts 3, 4, 5, 6, 7, 8, 9 of the temperature sensor 1 in the chamber 19 is ensured.
  • the air enclosed by the chamber 19 serves for thermal insulation.
  • FIG. 5 shows a further embodiment of the temperature sensor 1 without forming a housing which does not correspond to the claimed invention.
  • a tough potting 20 is applied, which takes over the electrical and thermal insulation.
  • the carrier 2 made of printed circuit board material on two laterally arranged holes 24.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Claims (15)

  1. Capteur ( 1 ) de température
    - comprenant un support ( 2 ) isolant du point de vue électrique,
    - comprenant un élément ( 3 ) en mode de construction SMD sensible à la température, déposé sur le support ( 2 ), et
    - comprenant un recouvrement sous la forme, d'un scellement ( 20 ) en un matériau isolant du point de vue thermique et du point de vue électrique qui isole, du point de vue thermique et du point de vue électrique, au moins l'élément ( 3 ) sensible à la température et qui est entouré d'un couvercle ( 11 ), dans lequel l'élément ( 3 ) sensible à la température à au moins une surface ( 4, 5 ) de contact avec le support ( 2 ),
    caractérisé en ce que
    la surface de contact a au moins le double de la surface de base de l'élément ( 3 ) sensible à la température.
  2. Capteur ( 1 ) de température suivant la revendication 1, caractérisé en ce que le couvercle ( 11 ) comprend des parties conductrices de l'électricité, qui sont mises sur le support ( 2 ).
  3. Capteur ( 1 ) de température suivant la revendication 2, caractérisé en ce que le couvercle ( 11 ) est en un matériau isolant du point de vue thermique et du point de vue électrique.
  4. Capteur ( 1 ) de température suivant la revendication 2 ou 3,
    caractérisé en ce que le couvercle ( 11 ) est relié au support ( 2 ) à complémentarité de force et/ou à complémentarité de forme.
  5. Capteur ( 1 ) de température suivant l'une des revendications 1 à 4,
    caractérisé en ce que le couvercle ( 11 ) forme, à l'état de montage, un moule de coulée pour le scellement ( 20 ).
  6. Capteur ( 1 ) de température suivant l'une des revendications 1 à 5,
    caractérisé par des surfaces ( 8, 9 ) de connexion reliées électriquement à l'élément ( 3 ) sensible à la température, séparées spatialement de l'élément ( 3 ) sensible à la température et déposées sur le support ( 2 ).
  7. Capteur ( 1 ) de température suivant la revendication 6,
    caractérisé par des pistes ( 6, 7 ) conductrices de section transversale petite pour la liaison électrique de l'élément ( 3 ) sensible à la température aux surfaces ( 8, 9 ) de connexion.
  8. Capteur ( 1 ) de température suivant la revendication 6 ou 7,
    caractérisé par des pistes ( 6, 7 ) conductrices sinueuses ou en zigzag pour la liaison électrique de l'élément ( 3 ) sensible à la température aux surfaces ( 8, 9 ) de connexion.
  9. Capteur ( 1 ) de température suivant l'une des revendications 1 à 8,
    caractérisé en ce que le support ( 2 ) est en un matériau de plaquette à semiconducteur.
  10. Capteur ( 1 ) de température suivant la revendication 9,
    caractérisé en ce que l'épaisseur du support va de 0,5 à 1,0 mm.
  11. Capteur ( 1 ) de température suivant la revendication 9 ou 10,
    caractérisé en ce que le matériau de plaquette à circuit imprimé est plaqué de cuivre sur les deux faces.
  12. Capteur ( 1 ) de température suivant l'une des revendications 1 à 8,
    caractérisé en ce que le support ( 2 ) est en une céramique isolante du point de vue électrique et conductrice de la chaleur.
  13. Capteur ( 1 ) de température suivant la revendication 12,
    caractérisé en ce que l'épaisseur du support va de 0,40 à 0,63 mm.
  14. Capteur ( 1 ) de température suivant l'une des revendications 1 à 13,
    caractérisé par au moins un élément ( 10, 13, 15, 24 ) de fixation pour l'immobilisation du support ( 2 ) sur un objet à mesurer.
  15. Capteur ( 1 ) de température suivant la revendication 14,
    caractérisé en ce que le support ( 2 ) a un trou ( 10 ) de fixation unique pour la formation d'une fixation par un seul trou.
EP05101048.6A 2004-02-24 2005-02-14 Capteur de température Active EP1568978B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004008977 2004-02-24
DE102004008977 2004-02-24

Publications (2)

Publication Number Publication Date
EP1568978A1 EP1568978A1 (fr) 2005-08-31
EP1568978B1 true EP1568978B1 (fr) 2014-06-04

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ID=34745262

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Application Number Title Priority Date Filing Date
EP05101048.6A Active EP1568978B1 (fr) 2004-02-24 2005-02-14 Capteur de température

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EP (1) EP1568978B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449137B (zh) * 2006-03-23 2014-08-11 Ceramtec Ag 構件或電路用的攜帶體
ES2948869T3 (es) * 2017-06-30 2023-09-20 PGT Thermprozesstechnik GmbH Procedimiento para la fabricación de un sensor eléctrico, pieza moldeada y sensor eléctrico con pieza moldeada
DE102019108307A1 (de) * 2019-03-29 2020-10-01 Efficient Energy Gmbh Temperaturfühler für punktförmige Messungen
EP4068349B1 (fr) 2021-03-30 2023-09-20 Siemens Aktiengesellschaft Module de puissance

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19802296A1 (de) * 1997-09-20 1999-03-25 Temperaturmestechnik Geraberg Verfahren und Temperaturfühler zur Messung von Oberflächentemperaturen
DE19742236A1 (de) * 1997-09-25 1999-04-22 Heraeus Sensor Nite Gmbh Elektrischer Sensor, insbesondere Temperatur-Sensor, mit Leiterplatte

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices
US5372427A (en) * 1991-12-19 1994-12-13 Texas Instruments Incorporated Temperature sensor
WO2001090710A1 (fr) * 2000-05-25 2001-11-29 Kamel Fauzi Razali Thermocouple traversant une matiere d'encapsulation de circuit integre
DE10225602A1 (de) * 2002-06-07 2004-01-08 Heraeus Sensor-Nite Gmbh Halbleiterbauelement mit integrierter Schaltung, Kühlkörper und Temperatursensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19802296A1 (de) * 1997-09-20 1999-03-25 Temperaturmestechnik Geraberg Verfahren und Temperaturfühler zur Messung von Oberflächentemperaturen
DE19742236A1 (de) * 1997-09-25 1999-04-22 Heraeus Sensor Nite Gmbh Elektrischer Sensor, insbesondere Temperatur-Sensor, mit Leiterplatte

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Publication number Publication date
EP1568978A1 (fr) 2005-08-31

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