DE102018210721A8 - Halbleitermodul, Verfahren zum Herstellen desselben und Vorrichtung zur Umwandlung elektrischer Leistung - Google Patents

Halbleitermodul, Verfahren zum Herstellen desselben und Vorrichtung zur Umwandlung elektrischer Leistung Download PDF

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Publication number
DE102018210721A8
DE102018210721A8 DE102018210721.1A DE102018210721A DE102018210721A8 DE 102018210721 A8 DE102018210721 A8 DE 102018210721A8 DE 102018210721 A DE102018210721 A DE 102018210721A DE 102018210721 A8 DE102018210721 A8 DE 102018210721A8
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Prior art keywords
making
same
electrical power
semiconductor module
converting electrical
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DE102018210721.1A
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DE102018210721A1 (de
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Yasunari Hino
Yuji Sato
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
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JP7030846B2 (ja) * 2017-02-01 2022-03-07 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 短絡故障モードを有するパワー半導体モジュール
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JP7313315B2 (ja) * 2020-05-19 2023-07-24 三菱電機株式会社 半導体装置の製造方法及び電力制御回路の製造方法
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JP7404208B2 (ja) 2020-09-24 2023-12-25 株式会社東芝 半導体装置
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