DE102018201263B3 - Ein verfahren und eine vorrichtung zum herstellen eines pin-fin-leistungsmoduls - Google Patents

Ein verfahren und eine vorrichtung zum herstellen eines pin-fin-leistungsmoduls Download PDF

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Publication number
DE102018201263B3
DE102018201263B3 DE102018201263.6A DE102018201263A DE102018201263B3 DE 102018201263 B3 DE102018201263 B3 DE 102018201263B3 DE 102018201263 A DE102018201263 A DE 102018201263A DE 102018201263 B3 DE102018201263 B3 DE 102018201263B3
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DE
Germany
Prior art keywords
holes
fins
fin
pin
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102018201263.6A
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German (de)
English (en)
Inventor
Xiaoguang LIANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Priority to DE102018201263.6A priority Critical patent/DE102018201263B3/de
Priority to CN201980006546.9A priority patent/CN111527598A/zh
Priority to EP19700871.7A priority patent/EP3747046A1/en
Priority to JP2020541446A priority patent/JP7290650B2/ja
Priority to PCT/EP2019/050488 priority patent/WO2019145154A1/en
Application granted granted Critical
Publication of DE102018201263B3 publication Critical patent/DE102018201263B3/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE102018201263.6A 2018-01-29 2018-01-29 Ein verfahren und eine vorrichtung zum herstellen eines pin-fin-leistungsmoduls Active DE102018201263B3 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE102018201263.6A DE102018201263B3 (de) 2018-01-29 2018-01-29 Ein verfahren und eine vorrichtung zum herstellen eines pin-fin-leistungsmoduls
CN201980006546.9A CN111527598A (zh) 2018-01-29 2019-01-10 用于制造针-翅型功率模块的方法和夹具
EP19700871.7A EP3747046A1 (en) 2018-01-29 2019-01-10 A method and a jig for manufacturing a pin-fin type power module
JP2020541446A JP7290650B2 (ja) 2018-01-29 2019-01-10 ピンフィン型パワーモジュールを製造する方法および治具
PCT/EP2019/050488 WO2019145154A1 (en) 2018-01-29 2019-01-10 A method and a jig for manufacturing a pin-fin type power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018201263.6A DE102018201263B3 (de) 2018-01-29 2018-01-29 Ein verfahren und eine vorrichtung zum herstellen eines pin-fin-leistungsmoduls

Publications (1)

Publication Number Publication Date
DE102018201263B3 true DE102018201263B3 (de) 2019-05-16

Family

ID=65036765

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018201263.6A Active DE102018201263B3 (de) 2018-01-29 2018-01-29 Ein verfahren und eine vorrichtung zum herstellen eines pin-fin-leistungsmoduls

Country Status (5)

Country Link
EP (1) EP3747046A1 (ja)
JP (1) JP7290650B2 (ja)
CN (1) CN111527598A (ja)
DE (1) DE102018201263B3 (ja)
WO (1) WO2019145154A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020208862A1 (de) * 2020-07-15 2022-01-20 Zf Friedrichshafen Ag Formwerkzeug zum verkapseln eines pin-fin-artigen leistungsmoduls und verfahren zum herstellen eines leistungsmoduls
CN114514105B (zh) * 2020-09-16 2023-08-22 华为技术有限公司 注塑模具及注塑方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130322019A1 (en) 2010-10-05 2013-12-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Heat-sink device intended for at least one electronic component and corresponding method
DE112012005791T5 (de) 2012-01-31 2014-10-16 Mitsubishi Electric Corporation Halbleiterbauteil und Verfahren zu dessen Herstellung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011238644A (ja) * 2010-05-06 2011-11-24 Denso Corp パワー半導体モジュールの製造方法
JP2012164763A (ja) * 2011-02-04 2012-08-30 Toyota Motor Corp ヒートシンク付き半導体パッケージの製造方法及び当該ヒートシンク
JP5776328B2 (ja) * 2011-05-19 2015-09-09 トヨタ自動車株式会社 冶具、半導体モジュールの製造方法及び半導体モジュール
JP5987190B2 (ja) * 2012-09-25 2016-09-07 三菱電機株式会社 半導体装置封止用金型及び半導体装置
JP6021695B2 (ja) * 2013-03-06 2016-11-09 三菱電機株式会社 半導体装置の製造方法および半導体装置の製造装置
JP2015185835A (ja) * 2014-03-26 2015-10-22 株式会社デンソー 半導体装置及びその製造方法
JP6446280B2 (ja) * 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130322019A1 (en) 2010-10-05 2013-12-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Heat-sink device intended for at least one electronic component and corresponding method
DE112012005791T5 (de) 2012-01-31 2014-10-16 Mitsubishi Electric Corporation Halbleiterbauteil und Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
JP2021513217A (ja) 2021-05-20
WO2019145154A1 (en) 2019-08-01
CN111527598A (zh) 2020-08-11
EP3747046A1 (en) 2020-12-09
JP7290650B2 (ja) 2023-06-13

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