Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
  • H01L21/565—Moulds
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14065—Positioning or centering articles in the mould
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/367—Cooling facilitated by shape of device
  • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14065—Positioning or centering articles in the mould
  • B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert

Definitions

• the invention relates to a method and a jig for manufacturing a Pin-Fin type power module.
• a Pin-Fin baseplate 10 includes a metal plate 11 having several Fins 12 on one side (the Pin-Fin side), and the other side (the flat side) of the Pin-Fin baseplate 10 is connected to a power module.
• the Fins contact a liquid cooling system directly, so the power module will not be overheated.
• the thermal cycling capability of the power module is significantly improved and the lifetime of the power module is extended.
• a traditional Pin-Fin type power module uses silicone gel as sealant.
• the power module further comprises an insulation material 20 (such as DBC (Direct Bonded Copper), polymer film) and power chips 30 (IGBT, MOSFET, Diode, etc.) provided on the insulation material 20.
• the insulation material 20 is connected to the flat side of the Pin-Fin baseplate 10.
• the insulation material 20 and power chips 30 are encapsulated in a housing 50 and the space inside the housing is filled with silicone gel 40.
• the traditional Pin-Fin type power module has a complicated structure and needs more steps in the manufacturing process, which leads to low manufacturing efficiency and higher cost.
• a transfer molded power module is presented. As shown in FIG.2-FIG.3, in this power module, epoxy resin 60 is used as sealant and no housing is needed. A bottom mold 702 and a top mold 701 are used to manufacture the power module. The power module is placed in the cavity 700 between the top mold 701 and the bottom mold 702, and the Pin-Fin side is placed on the upper surface 7021 of the bottom mold 702. The epoxy resin is injected into the cavity 700 by pressure through an opening 7011 on the top mold 701.
• the current manufacturing process has the following drawbacks:
• One aspect of the present invention is to provide a method for
• a Pin-Fin type power module including: (1) providing a Pin-Fin type power module and a jig, the power module comprises a Pin-Fin baseplate, insulation material connecting the base plate and power chips provided on the insulation material.
• the baseplate has a first surface and a second surface opposite the first surface. The first surface is connected to the insulation material and the second surface has several Fins on it.
• the jig includes a main body having a flat upper surface and a flat lower surface, and holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins.
• the aperture of the holes depends on the thermal expansion of the Fins' material and/or the jig's material.
• the jig is made of carbon, copper or steel.
• the insulation material is DBC or polymer film.
• Another aspect of the present invention is to provide a jig for
• the module includes a surface with several protrusive Fins on it, the jig comprises: a main body having a flat upper surface and a flat lower surface, holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins.
• the holes are through holes.
• the holes are blind holes.
• the cross section of the holes is round, oval or diamond shape.
• FIG.l is a cross section of a traditional gel-sealed Pin-Fin type power module.
• FIG.2 is a cross section of a transfer molded Pin-Fin type power module.
• FIG.3 illustrates molding the Pin-Fin type power module with epoxy resin in the top mold and the bottom mold by traditional way.
• FIG.4 illustrates the unsealed Pin-Fin type power module before molding process.
• FIG.5 illustrates a jig protecting the Pin-Fin during molding process.
• FIG.6 illustrates inserting the Pin-Fin into a jig having through holes.
• FIG.7 illustrates molding the Pin-Fin type power module with epoxy resin under the protection of the jig.
• FIG.8 illustrates the epoxy resin sealed Pin-Fin type power module after stripping the jig.
• FIG.9 illustrates inserting the Pin-Fin into a jig having blind holes through arrow A.
• FIG.10 illustrates the combination of the Pin-Fin and the jig after the Fins are completely inserted into the blind holes.
• FIG.ll illustrates another alternative jig having blind holes.
• Embodiment 1 referring to FIG.4-FIG.8, the Pin-Fin type power module is manufactured by the following steps:
• the power module comprises a Pin-Fin baseplate 1, insulation material (a DBC) 2 connecting the base plate 1 and power chips 3 provided on the DBC 2.
• the baseplate 1 has a first surface 11 and a second surface 12 opposite the first surface 11.
• the first surface 11 is connected to the DBC 2 and the second surface 12 has several Fins 121 on it.
• the jig 9 includes a carbon main body having a flat upper surface and a flat lower surface, and several through holes 91 provided on the upper surface of the main body, wherein the distribution of the through holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of through holes is the same as that of the Fins.
• Embodiment 2 referring now to FIG.9-FIG.10, in an alternative solution, a steel jig 9 with blind holes 91 is used.
• the length of blind holes is the same as that of the Fins.
• the Pin-Fin is supported steadily by the jig.
• the jig with blind holes is stable enough so the pressure on the power module is distributed uniformly during the molding process.
• Embodiment 3 referring now to FIG.ll, in another alternative jig, blind holes 91 are provided, but the length of blind holes 91 is longer than that of the Fins 121, so there is a vertical gap 800 between each Fin and the corresponding blind hole. The vertical direction is parallel to the length direction of the Fins.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=65036765

Family Applications (1)

Country Status (5)

Families Citing this family (2)

Family Cites Families (9)

• 2018
  • 2018-01-29 DE DE102018201263.6A patent/DE102018201263B3/de active Active
• 2019
  • 2019-01-10 EP EP19700871.7A patent/EP3747046A1/en not_active Withdrawn
  • 2019-01-10 JP JP2020541446A patent/JP7290650B2/ja active Active
  • 2019-01-10 WO PCT/EP2019/050488 patent/WO2019145154A1/en unknown
  • 2019-01-10 CN CN201980006546.9A patent/CN111527598A/zh active Pending

Also Published As

Similar Documents

Legal Events