DE102014215063B4 - Fahrzeugleuchte mit einem Lichtemissionselement mit zwei Leiterplatinen und einem Reflektor auf einer Schaltkreisstruktur - Google Patents

Fahrzeugleuchte mit einem Lichtemissionselement mit zwei Leiterplatinen und einem Reflektor auf einer Schaltkreisstruktur Download PDF

Info

Publication number
DE102014215063B4
DE102014215063B4 DE102014215063.9A DE102014215063A DE102014215063B4 DE 102014215063 B4 DE102014215063 B4 DE 102014215063B4 DE 102014215063 A DE102014215063 A DE 102014215063A DE 102014215063 B4 DE102014215063 B4 DE 102014215063B4
Authority
DE
Germany
Prior art keywords
circuit board
light emitting
light
emitting element
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102014215063.9A
Other languages
German (de)
English (en)
Other versions
DE102014215063A1 (de
Inventor
c/o KOITO MANUFACTURING CO. LTD Yasuda Yuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of DE102014215063A1 publication Critical patent/DE102014215063A1/de
Application granted granted Critical
Publication of DE102014215063B4 publication Critical patent/DE102014215063B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/321—Optical layout thereof the reflector being a surface of revolution or a planar surface, e.g. truncated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
DE102014215063.9A 2013-08-02 2014-07-31 Fahrzeugleuchte mit einem Lichtemissionselement mit zwei Leiterplatinen und einem Reflektor auf einer Schaltkreisstruktur Expired - Fee Related DE102014215063B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013161580A JP6209387B2 (ja) 2013-08-02 2013-08-02 車両用灯具
JP2013-161580 2013-08-02

Publications (2)

Publication Number Publication Date
DE102014215063A1 DE102014215063A1 (de) 2015-02-05
DE102014215063B4 true DE102014215063B4 (de) 2019-08-29

Family

ID=52342155

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014215063.9A Expired - Fee Related DE102014215063B4 (de) 2013-08-02 2014-07-31 Fahrzeugleuchte mit einem Lichtemissionselement mit zwei Leiterplatinen und einem Reflektor auf einer Schaltkreisstruktur

Country Status (5)

Country Link
US (1) US9546769B2 (enExample)
JP (1) JP6209387B2 (enExample)
CN (1) CN104344310B (enExample)
DE (1) DE102014215063B4 (enExample)
FR (1) FR3009365B1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2962588A1 (en) 2014-09-24 2016-03-31 Truck-Lite Co., Llc Headlamp with lens reflector subassembly
WO2017047598A1 (ja) * 2015-09-14 2017-03-23 株式会社小糸製作所 車輌用灯具
JPWO2022118750A1 (enExample) * 2020-12-04 2022-06-09

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098185A (ja) * 2007-12-28 2008-04-24 Koito Mfg Co Ltd 車両用灯具
JP2011081967A (ja) * 2009-10-05 2011-04-21 Koito Mfg Co Ltd 車両用前照灯
US20110133217A1 (en) * 2009-12-03 2011-06-09 Toyoda Gosei Co., Ltd. Led light emitting apparatus and vehicle headlamp using the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124508A (ja) * 1998-10-16 2000-04-28 Rohm Co Ltd 発光装置
JP4611721B2 (ja) * 2004-11-25 2011-01-12 株式会社小糸製作所 発光デバイス及び車両用灯具
US7705365B2 (en) * 2006-01-24 2010-04-27 Denso Corporation Lighting device and light emitting module for the same
JP4535453B2 (ja) * 2006-03-06 2010-09-01 株式会社小糸製作所 光源モジュール及び車輌用灯具
US20090059594A1 (en) * 2007-08-31 2009-03-05 Ming-Feng Lin Heat dissipating apparatus for automotive LED lamp
JP2009245643A (ja) * 2008-03-28 2009-10-22 Sharp Corp 照明装置
JP5231194B2 (ja) 2008-12-17 2013-07-10 株式会社小糸製作所 車両用灯具
KR101761385B1 (ko) * 2010-07-12 2017-08-04 엘지이노텍 주식회사 발광 소자
JP5101715B2 (ja) * 2011-05-27 2012-12-19 株式会社三共 スロットマシン
CN202352720U (zh) * 2011-10-21 2012-07-25 西安重装渭南光电科技有限公司 白光led外延芯片封装结构
CN202564428U (zh) * 2012-03-31 2012-11-28 泉州市博泰半导体科技有限公司 半导体发光器件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098185A (ja) * 2007-12-28 2008-04-24 Koito Mfg Co Ltd 車両用灯具
JP2011081967A (ja) * 2009-10-05 2011-04-21 Koito Mfg Co Ltd 車両用前照灯
US20110133217A1 (en) * 2009-12-03 2011-06-09 Toyoda Gosei Co., Ltd. Led light emitting apparatus and vehicle headlamp using the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP 2008 - 098 185 A (Maschinenübersetzung), AIPN [online] JPO [abgerufen am 04.01.2019] *
JP 2011 - 081 967 A (Maschinenübersetzung), AIPN [online] JPO [abgerufen am 08.01.2019] *

Also Published As

Publication number Publication date
CN104344310B (zh) 2017-09-01
CN104344310A (zh) 2015-02-11
JP2015032472A (ja) 2015-02-16
FR3009365A1 (fr) 2015-02-06
US9546769B2 (en) 2017-01-17
US20150036374A1 (en) 2015-02-05
FR3009365B1 (fr) 2019-07-12
DE102014215063A1 (de) 2015-02-05
JP6209387B2 (ja) 2017-10-04

Similar Documents

Publication Publication Date Title
DE10110835B4 (de) Beleuchtungsanordnung mit einer Mehrzahl von LED-Modulen auf einer Kühlkörperoberfläche
DE102005026949B4 (de) LED-Lampe als Lichtquelle für eine Beleuchtungseinheit
DE102007003256A1 (de) Lichtquellenmodul
DE102008061431B4 (de) Fahrzeugleuchte
DE102015202519A1 (de) Fahrzeuglampe
DE102007024922B4 (de) Lichtemittermodul und Fahrzeugleuchte
DE602004011708T2 (de) Antikollisionsleuchte für Luftfahrzeuge
DE102012220455A1 (de) Leuchtvorrichtung mit halbleiterlichtquelle
EP1995514A2 (de) Beleuchtungseinheit
DE102010030702A1 (de) Halbleiterlampe
DE102005003213A1 (de) Beleuchtungseinheit
DE102007031241A1 (de) Lichtemittermodul und Beleuchtungsvorrichtung für Fahrzeuge
EP3167224A1 (de) Halbleiterlampe
WO2009033477A1 (de) Leucht-vorrichtung
DE10063876B4 (de) Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle
WO2012038172A1 (de) Leuchtvorrichtung
DE102014215063B4 (de) Fahrzeugleuchte mit einem Lichtemissionselement mit zwei Leiterplatinen und einem Reflektor auf einer Schaltkreisstruktur
EP2651695A1 (de) Vorrichtung zur innenbeleuchtung in einem kraftfahrzeug
EP2938170A1 (de) Halter für SMD-Leuchtdiode
DE102019104792A1 (de) Lichtemittierendes modul
EP3516688B1 (de) Kraftfahrzeug-scheinwerfer mit einer aufgelöteten smd-led
WO2015007904A1 (de) Leuchtvorrichtung mit halbleiterlichtquelle und treiberplatine
DE10331532B4 (de) Beleuchtungsvorrichtung
DE102009047765A1 (de) Beleuchtung
WO2012126894A1 (de) Beleuchtungseinrichtung

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: F21S0008100000

Ipc: F21S0043000000

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee