DE102014209348A1 - Ermittlung einer korrigierten Größe - Google Patents

Ermittlung einer korrigierten Größe Download PDF

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Publication number
DE102014209348A1
DE102014209348A1 DE102014209348.1A DE102014209348A DE102014209348A1 DE 102014209348 A1 DE102014209348 A1 DE 102014209348A1 DE 102014209348 A DE102014209348 A DE 102014209348A DE 102014209348 A1 DE102014209348 A1 DE 102014209348A1
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DE
Germany
Prior art keywords
functions
size
matrix
subrange
measured values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102014209348.1A
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German (de)
English (en)
Inventor
Christoph Petri
Christian Wald
Daniel Runde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Priority to DE102014209348.1A priority Critical patent/DE102014209348A1/de
Priority to PCT/EP2015/060770 priority patent/WO2015173397A1/de
Priority to JP2017512438A priority patent/JP6751079B2/ja
Publication of DE102014209348A1 publication Critical patent/DE102014209348A1/de
Priority to US15/353,406 priority patent/US9841685B2/en
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE102014209348.1A 2014-05-16 2014-05-16 Ermittlung einer korrigierten Größe Ceased DE102014209348A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102014209348.1A DE102014209348A1 (de) 2014-05-16 2014-05-16 Ermittlung einer korrigierten Größe
PCT/EP2015/060770 WO2015173397A1 (de) 2014-05-16 2015-05-15 Ermittlung einer korrigierten grösse
JP2017512438A JP6751079B2 (ja) 2014-05-16 2015-05-15 補正光学変数を求める方法及び装置
US15/353,406 US9841685B2 (en) 2014-05-16 2016-11-16 Determination of a corrected variable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014209348.1A DE102014209348A1 (de) 2014-05-16 2014-05-16 Ermittlung einer korrigierten Größe

Publications (1)

Publication Number Publication Date
DE102014209348A1 true DE102014209348A1 (de) 2015-11-19

Family

ID=53276840

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014209348.1A Ceased DE102014209348A1 (de) 2014-05-16 2014-05-16 Ermittlung einer korrigierten Größe

Country Status (4)

Country Link
US (1) US9841685B2 (enExample)
JP (1) JP6751079B2 (enExample)
DE (1) DE102014209348A1 (enExample)
WO (1) WO2015173397A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3696605A1 (en) * 2019-02-13 2020-08-19 ASML Netherlands B.V. Method and lithograph apparatus for measuring a radiation beam

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3570110A1 (en) * 2018-05-16 2019-11-20 ASML Netherlands B.V. Estimating a parameter of a substrate
CN116710847A (zh) * 2021-01-19 2023-09-05 卡尔蔡司Smt有限责任公司 设置投射曝光系统的方法、投射曝光方法以及用于微光刻的投射曝光系统
US11609506B2 (en) * 2021-04-21 2023-03-21 Kla Corporation System and method for lateral shearing interferometry in an inspection tool
DE102023120807A1 (de) * 2023-08-04 2025-02-06 Asml Netherlands B.V. Verfahren und System zur Bestimmung feldabhängiger Aberrationen

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110119011A1 (en) * 2009-11-19 2011-05-19 Canon Kabushiki Kaisha Apparatus for measuring shape of test surface, and recording medium storing program for calculating shape of test surface

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW550377B (en) * 2000-02-23 2003-09-01 Zeiss Stiftung Apparatus for wave-front detection
US7088458B1 (en) * 2002-12-23 2006-08-08 Carl Zeiss Smt Ag Apparatus and method for measuring an optical imaging system, and detector unit
JP4753009B2 (ja) * 2005-05-24 2011-08-17 株式会社ニコン 計測方法、露光方法、及び露光装置
US7580113B2 (en) * 2006-06-23 2009-08-25 Asml Netherlands B.V. Method of reducing a wave front aberration, and computer program product
JP2008186912A (ja) * 2007-01-29 2008-08-14 Nikon Corp 収差評価方法、調整方法、露光装置、露光方法、およびデバイス製造方法
JP5503193B2 (ja) * 2009-06-08 2014-05-28 キヤノン株式会社 波面収差の測定装置、露光装置及びデバイス製造方法
DE102009038558A1 (de) * 2009-08-24 2011-03-10 Carl Zeiss Sms Gmbh Verfahren zur Emulation eines fotolithographischen Prozesses und Maskeninspektionsmikroskop zur Durchführung des Verfahrens
DE102010062763A1 (de) * 2010-12-09 2012-06-14 Carl Zeiss Smt Gmbh Verfahren zum Vermessen eines optischen Systems
KR101529807B1 (ko) * 2011-01-20 2015-06-17 칼 짜이스 에스엠티 게엠베하 투영 노광 도구를 조작하는 방법
US9046791B2 (en) * 2011-11-30 2015-06-02 Changchun Institute Of Optics, Fine Mechanics And Physics, Chinese Academy Of Sciences Apparatuses and methods for detecting wave front abberation of projection objective system in photolithography machine
DE102012202057B4 (de) * 2012-02-10 2021-07-08 Carl Zeiss Smt Gmbh Projektionsobjektiv für EUV-Mikrolithographie, Folienelement und Verfahren zur Herstellung eines Projektionsobjektivs mit Folienelement
DE102012111008B4 (de) * 2012-11-15 2014-05-22 Precitec Optronik Gmbh Optisches Messverfahren und optische Messvorrichtung zum Erfassen einer Oberflächentopographie
DE102013218991A1 (de) * 2013-09-20 2015-03-26 Carl Zeiss Smt Gmbh Vorrichtung zum Bestimmen einer optischen Eigenschaft eines optischen Abbildungssystems

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110119011A1 (en) * 2009-11-19 2011-05-19 Canon Kabushiki Kaisha Apparatus for measuring shape of test surface, and recording medium storing program for calculating shape of test surface

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WENG, Chow W., LAWRENCE, George N.: Method for subaperture testing interferogram reduction. In: Opt. Lett., 1983, Vol. 8, Nr. 9. S. 468-470. - ISSN 0146-9592 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3696605A1 (en) * 2019-02-13 2020-08-19 ASML Netherlands B.V. Method and lithograph apparatus for measuring a radiation beam
WO2020164918A1 (en) * 2019-02-13 2020-08-20 Asml Netherlands B.V. Method and lithograph apparatus for measuring a radiation beam
US11796921B2 (en) 2019-02-13 2023-10-24 Asml Netherlands B.V. Method and lithograph apparatus for measuring a radiation beam

Also Published As

Publication number Publication date
JP2017524946A (ja) 2017-08-31
JP6751079B2 (ja) 2020-09-02
US9841685B2 (en) 2017-12-12
US20170068166A1 (en) 2017-03-09
WO2015173397A1 (de) 2015-11-19

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